System and method for compensating for power loss due to a radio frequency (RF) signal probe mismatch in conductive RF signal testing of a RF data signal transceiver device under test (DUT). Sourcing the RF test signal with the RF vector signal transceiver at multiple test frequencies enables isolation of and compensation for power loss due to a mismatch between the RF signal probe and RF DUT connection based on predetermined losses of the RF signal path.

A testing device for testing electronic devices includes a test controller and a wireless power transmission system. The test controller is configured to generate testing signals for transmission to at least one of the plurality of electronic devices and receive testing data, in response to the testing signals. The wireless power transmission system is configured to receive the testing signal from the test controller, generate a power signal and a first asynchronous serial data signal in accordance with a wireless power and data transfer protocol, the first asynchronous serial data signal based on the testing signals, decode the power signal to extract a second data signal compliant with the wireless power and data transfer protocol, and decode the second data signal compliant with the wireless power and data transfer protocol to extract a second asynchronous serial data signal, the second asynchronous serial data signal based on the testing data.

A robust predictive model. A plurality of different predictive models for a target feature are run, and a comparative analysis provided for each predictive model that meet minimum performance criteria for the target feature. One of the predictive models is selected, either manually or automatically, based on predefined criteria. For semi-automatic selection, a static or dynamic survey is generated for obtaining user preferences for parameters associated with the target feature. The survey results will be used to generate a model that illustrates parameter trade-offs, which will be used to finalize the optimal predictive model for the user.

The present disclosure provides a microwave system, including a chamber and a microwave process circuit. The microwave process circuit is coupled to the chamber, and configured to radiate a polarized source microwave, receive a first reflected microwave, and radiate a polarized first reflected microwave into the chamber so as to heat a device under test in the chamber. The microwave process circuit includes a power generator, a first energy feeder, and a second energy feeder. The power generator is configured to generate a source microwave according to a reference signal and a control signal. The first energy feeder is configured to polarized the source microwave to the polarized source microwave, and radiate the polarized microwave into the chamber. The second energy feeder is configured to polarized the first reflected microwave to the polarized first reflected microwave, and radiate the polarized first reflected microwave into the chamber.

A device for testing a group of radio-frequency (RF) chip modules and a method for using the same is disclosed. The device includes a signal analyzer, a power divider, control ICs, a signal controller, and a power combiner. The power divider receives an RF signal and transmits RF input signals to the RF chip modules and the control ICs in response to the RF signal. The signal controller controls each control IC to adjust at least one of the power and the phase of the corresponding RF input signal, thereby generating an RF output signal. The power combiner receives the RF output signal from each control IC to generate a test signal. The signal analyzer receives the test signal and obtains RF properties corresponding to at least one of the power and the phase of each RF output signal.

The method is for identifying a signal and its image signal input to the heterodyne frequency sweep system. Comparing to a traditional heterodyne frequency sweep technology, a mixing module with a positive and negative sign filters (PNS filters) is introduced, and the detection and identification module is added, and the typical low-pass filter in the input module is removed. According to the timing order sequence of the signal output from the intermediate frequency (IF) filter and PNS filters, a signal and its image signal can be identified. The bandwidth of the heterodyne frequency sweep system is not limited by the cut-off frequency of the low-pass filter (LPF) of the traditional heterodyne frequency sweep system.

A test arrangement for adjusting a setup of testing a device under test (DUT) includes a main device that generates an RF signal and processes an incoming RF signal in a first frequency range; a frontend component generates an RF signal and processes an incoming RF signal in a second frequency range. The frontend component measures a signal level in a sub-range within the first frequency range; a connection cable connects the main device with the frontend component; and an analyzer predicts a behavior of the connection cable in a rest portion of the first frequency range that is different from the sub-range within the first frequency range.

A fast calibration method for slide-screw impedance tuners employs a new tuner control board and routine with independent direct triggering and data sampling by the VNA; a new vertical scaling algorithm bypasses the traditional iterative approach and uses numerical curve-fitting and ISO circle definition. Full tuner calibration executes without motor stopping, yielding time reduction typically by a factor of 8.

A test kit for testing a device under test (DUT) includes a socket structure for containing the DUT. The DUT includes an antenna and radiates a RF signal. The test kit further includes a reflector having a lower surface. The RF signal emitted from the antenna of the DUT is reflected by the reflector and a reflected RF signal is received by the antenna of the DUT.

A testing board (i.e., testing fixture) includes a printed circuit board (PCB), an external connection port, and plural coaxial radio frequency (RF) connector sets. The external connection port is located on the printed circuit board. Each of the coaxial RF connector sets includes a top coaxial RF connector and a bottom coaxial RF connector. The top coaxial RF connector and the bottom coaxial RF connector are respectively disposed on a top surface and a bottom surface of the printed circuit board in a coaxial arrangement and electrically connect to the external connection port.