G01R31/2829

Inline sensor assembly to monitor air data probe heater

A sensor assembly for monitoring a heater system for an aircraft probe sensor includes a current sensor module with a current sensor core and a high electromagnetically permeable enclosure around the current sensor core. An input wire pathway extends through the current sensor core and is configured to receive a heater input wire. A return wire pathway extends through the current sensor core and is configured to receive a heater return wire. A high electromagnetically permeable tube extends through the current sensor core and is configured to extend around one of the input wire and the heater return wire.

SENSOR STATUS DETERMINATION BASED ON INDEPENDENT FUNDAMENTAL FREQUENCY MEASUREMENTS
20220373591 · 2022-11-24 ·

Methods, computing systems, and computer-readable media for detecting sensor malfunctioning status. The method includes receiving sensor measurements of a first type from a first type of sensor, deriving a first value for a metric from the sensor measurements of the first type, receiving sensor measurements of a second type from a second type of sensor, wherein the second measurements of the second type include a second value for the metric, comparing the first value to the second value, determining whether the first type of sensor or the second type of sensor is malfunctioning based on the comparing, and storing or outputting information indicating whether first type of sensor and the second type of sensor are malfunctioning.

Diagnosis of a two-conductor field instrument

Disclosed is a method for diagnosis of a two-conductor field instrument and a corresponding two-conductor field instrument. In a normal operating mode, an input voltage is provided and an output current is output. In a diagnostic operating mode, the method includes: providing a first diagnosis-input voltage and outputting a first diagnosis-output current during a first time interval, providing a second diagnosis-input voltage and outputting a second diagnosis-output current during a second time interval, determining the second time interval from the first time interval, registering a first and second diagnosis-output voltage as a function of the first and second diagnosis-output current, and checking the functionality of the two-conductor field instrument by the first and second diagnosis-input voltage, the first and second time interval, the first and second diagnosis-output electrical current, the first and second diagnosis-output voltage based on the input voltage and/or based on the output electrical current.

Identifier automatic assigning data processing board, data processing module including identifier automatic assigning data processing board and data processing system including data processing module
11507390 · 2022-11-22 · ·

A data processing board according to an embodiment of the present disclosure includes a data processing module including at least one data processing board for automatically assigning an identifier according to the voltage value measured in the internal circuit and a communication board for transmitting and receiving signal to/from the data processing board, and a data processing system including the data processing module and a monitor collecting device for selecting and parallel-processing the data received from the data processing module.

Solid-state optical receiver driver system and method for testing a solid-state optical receiver driver system

Embodiments of the invention relates to a Solid-state optical receiver driver system, particularly for automotive applications, comprising at least one optical receiver channel, the optical receiver channel being connectable to a respective optical receiver, which is characterized in that the solid-state optical receiver driver system further comprises at least one test signal generation unit, for providing a test signal to the at least one optical receiver channel. The invention further relates to a method for testing a solid-state optical receiver driver system.

Method and system for safe diagnosis of squib loop components using transient response characteristics for restraint control module
11613222 · 2023-03-28 · ·

A method and system for diagnosing a squib loop in a restraint control module using a transient response is disclosed in the present application. The system may be used with a low energy actuator (LEA) which is primarily an inductive device. A diagnostic current may be applied to the squib loop for a diagnostic test period and the voltage between the feed line terminal and the return line terminal or the voltage between the return line terminal and the feed line terminal can be monitored at a specific time or times during the test period for the expected response (e.g. peak voltage, rise rate, etc). The current may also be reversed to check the correct polarity of a diode in the LEA.

Sensor test apparatus

A sensor test apparatus having excellent versatility is provided. The sensor test apparatus includes a first application unit 40 including a first application device including a socket to which the sensor is electrically connected, and a pressure chamber 43 which applies pressure to the sensor, a test unit which tests the sensor 90 via the socket, a conveying robot which conveys the sensor into and out of the first application unit 40, and an apparatus main body which houses the first application unit 40, the test unit 35 and the conveying robot, and the apparatus main body has an opening which allows the first application unit 40 to be inserted into the apparatus main body and removed from the apparatus main body to an outside.

Method for manufacturing semiconductor device package with isolation
11614482 · 2023-03-28 · ·

A method includes placing a semiconductor device package in a test handler, the semiconductor device package having leads of a first portion of a package substrate extending from a mold compound and leads of a second portion isolated from the first portion extending from the mold compound; contacting the first portion with a first and a second conductive slug; contacting the second portion with a third and a fourth conductive slug; contacting a first surface of the mold compound with a first plunger having a conductive plate and an insulating tip; contacting an opposite second surface of the mold compound with a second plunger having a conductive plate and an insulating tip; and placing a high voltage on the first conductive slug while placing approximately half the high voltage on the conductive plate of the first plunger, and placing a ground voltage on the third conductive slug.

Analog-to-digital converter, sensor system , and test system

Provided are an analog-to-digital (AD) converter, a sensor system, and a test system capable of reducing the time for test processing. AD converter includes input part, AD conversion part, first output part, and second output part. The analog signal output from sensor is input to input part. AD conversion part digitally converts an analog signal to generate first digital data and second digital data. First output part outputs the first digital data to control circuit. Second output part outputs the second digital data to test controller before first output part outputs the first digital data. In the test mode, test controller determines whether or not sensor system including sensor is in an abnormal state on the basis of the second digital data.

Bridge sensor error check

A method for detecting an error in a bridge sensor which is adapted for measuring a physical parameter. The method comprises biasing a first contact pair of the bridge sensor at least two times in a first direction and at least one time in a second direction opposite to the first direction; while biasing the first contact pair, measuring an output signal on a different contact pair of the bridge sensor, thus obtaining at least three output measurements which are representative for the physical parameter and which are separated by time intervals; combining the output measurements to obtain an output value which is indicative for an error in the bridge sensor, wherein the output measurements which are combined are only those output measurements which are measured when biasing the first contact pair.