Disclosed is a camera module inspector of rotating type distributing a load of processing test raw data. In an exemplary embodiment, the camera module inspector of rotating type includes a rotary index table including a plurality of socket units, a plurality of testers arranged around the rotary index table, a plurality of test control processors connected to correspond to the plurality of socket units, respectively, to be fixed on the rotary index table, a network connection unit establishing network connections with respect to the plurality of test control processors, a redundancy check processor processing the test raw data faster than the test control processor, connected to the network connection unit and data controller test raw data requiring a great deal of processing time out of the test raw data generated in the plurality of test control processors to be transmitted to the redundancy check processor through the network connection unit.

A secure distance protection for electric power delivery systems under transient conditions is disclosed herein. Upon detection of a transient condition, additional security is added to a distance protection element before a protective action is taken. The transient condition may be detected when an angle of advancement of an operating signal is outside of a predetermined threshold. An unsecure condition may also be detected before applying additional security. The unsecure condition may be detected based on an estimation of a fault within a close-in zone and a voltage magnitude falling below a threshold.

A probe device according to an embodiment is a probe device for inspecting electrical characteristics of an inspection target object, mounted on a mounting table, by electrically contacting probes and the inspection target object to each other. The probe device includes a support base having on an upper surface thereof a needle trace transfer member for transferring needle traces of the probes, a fixed support portion extending from a side of the mounting table and configured to fix and support the support base from below, and a movable support unit that is disposed below the support base and is configured to be moved up and down to be in contact with the support base and movably support the support base.

A temperature-managed equipment enclosure, wherein the fans are configured to draw air from the environment, and wherein damage sensors are distributed in a non-uniform and/or targeted manner. In an example embodiment, most of the damage sensors may be placed within a relatively narrow zone downstream from the cooling fans. In some embodiments, a relatively large percentage of the damage sensors may be placed in the areas characterized by one or more of the following: (i) relatively high linear velocity of the airflow; (ii) turbulent airflow; and (iii) a certain range of angles of impingement of airflow on the equipment surfaces. Advantageously, the disclosed placement of damage sensors can be used to enhance the ability to detect environmentally induced equipment damage with high sensitivity and/or certainty.

Disclosed herein is method and system for facilitating fault rectification in power backup devices using a fault rectification system configured in the power backup device. The fault rectification system detects occurrence of fault events in the power backup device and retrieves information required for rectification of the fault events based on the complexity level of the fault event. The rectification information is provided to the user, thereby facilitating the user in rectification of the detected fault event, without requirement of the expert service personnel. The method of instant disclosure helps in reducing total turnaround time of rectifying the faults in the power backup devices by eliminating involvement of expert/customer service personnel in the rectification of the faults.

A circuit board testing device electrically coupled to a measurement gauge tests a circuit board. The circuit board testing device includes a processor configured to configure measurement parameters of the measurement gauge, configure measurement rules for testing the circuit board, confirm a circuit of the circuit board to be tested according to the record of test data, control the measurement gauge to test the circuit of the circuit board to be tested when the measurement gauge is electrically coupled to the circuit of the circuit board to be tested, receive measurement data returned by the measurement gauge, and analyze a faulty region of the circuit board according to the record of test data and the measurement data.

A secure distance protection for electric power delivery systems under transient conditions is disclosed herein. Upon detection of a transient condition, additional security is added to a distance protection element before a protective action is taken. The transient condition may be detected when an angle of advancement of an operating signal is outside of a predetermined threshold. An unsecure condition may also be detected before applying additional security. The unsecure condition may be detected based on an estimation of a fault within a close-in zone and a voltage magnitude falling below a threshold.

A display device including: a substrate including a display area and a peripheral area peripheral to the display area; a plurality of pads disposed in a pad area, wherein the pad area is disposed in the peripheral area and the pad area includes an integrated circuit (IC); and a first crack detecting line connected to a first pad and a second pad at a first node, and a third pad at a second node, wherein the first crack detecting line is disposed in the peripheral area between the first node and the second node.

Some embodiments described herein include a method to validate supply chains for electronic devices using side-channel information in a signature analysis. The method includes sending, to a target device, a first signal associated with a set of codes to be executed by the target device, and then receiving first side-channel information associated with the target device in response to the target device executing the set of codes. The method also includes determining second side-channel information associated with a simulated device in response to the set of codes. The method further includes comparing a discriminatory feature of the first side-channel information with a discriminatory feature of the second side-channel information to determine a characteristic of the target device based on a pre-determined characteristic of the simulated device. Finally, the method includes sending, to a user interface, a second signal associated with the characteristic of the target device.

An inspection method according to an embodiment is an inspection method of performing laser marking on a semiconductor device including a substrate and a metal layer formed on the substrate, and the inspection method includes specifying a fault point in the semiconductor device by inspecting the semiconductor device, and irradiating the semiconductor device with laser light having a wavelength that is transmitted through the substrate from the substrate side so that a marking is formed at least at a boundary between the substrate and the metal layer on the basis of the fault point.