The present disclosure discloses an assembly for carrying a chip, and a device and a method for testing a chip. The assembly for carrying a chip is configured to fasten chips of different sizes, and includes a rotatable vertical rod, a cross beam, a first sidewall, and a second sidewall. The rotatable vertical rod is provided with a gear that surrounds the rotatable vertical rod with gear teeth. The cross beam is internally provided with a first through hole and a first chute. A top of the first sidewall is connected to a first connecting rod located in the first chute. A top of the second sidewall is connected to a second connecting rod located in the first chute. A side surface of the first connecting rod is provided with a plurality of first tooth grooves arranged linearly.

A method for controlling temperature in a temperature control system. The method includes providing a temperature control system including a controller, a first contactor assembly having a first channel system, a plurality of first contacts, each of the first contacts including a portion that is disposed within the first channel system, and one or more of a first exhaust valve or a first inlet valve, and a second contactor assembly having a second channel system, a plurality of second contacts, each of the second contacts including a portion that is disposed within the second channel system, and one or more of a second exhaust valve or a second inlet valve. The method also includes receiving, by the first contactor assembly, a fluid at a first temperature. The method also includes receiving, by the second contactor assembly, the fluid at the first temperature.

A method comprising activating an internal switch within a packaged electronic device to connect to a reference ground of an internal voltage source to a first input of an analog front end, receiving an external ground potential voltage at a first package pin of the packaged electronic device, generating a zero detector output signal for the packaged electronic device at a second package pin, activating the internal switch to connect the first input of the analog front end to the internal voltage source, receiving a second voltage level at the first package pin that generates a second output signal that matches the zero detector output signal, and receiving trim instructions to trim an internal voltage generated by the internal voltage source to a voltage level that is closer to a target voltage level.

An integrated circuit includes a semiconductor die having conductive pads and an electronic component with a first terminal coupled to a third conductive pad and a second terminal coupled to a fourth conductive pad. A resistor has a first terminal coupled to the fourth conductive pad and a second terminal coupled to the fifth conductive pad, and a first transistor has a first terminal coupled to the first conductive pad, a second terminal coupled to the fifth conductive pad, and a control terminal. A second transistor has a first terminal coupled to the first transistor, a second terminal coupled to the third conductive pad, and a control terminal. A pulse generator has an input coupled to the second conductive pad and an output coupled to the control terminal of the second transistor.

A semiconductor wafer according to the present embodiment is a semiconductor wafer having a first face. A plurality of chip structures are provided on a plurality of chip regions of the first face. A test structure is provided on dicing regions between adjacent ones of the chip regions. The chip structures each comprise first integrated circuits provided on the semiconductor wafer, and a first stacked body provided above the first integrated circuits and including a plurality of first layers and a plurality of second layers different from the first layers alternately stacked. The test structure comprises second integrated circuits provided on the semiconductor wafer, and a second stacked body provided above the second integrated circuits and including the first layers and the second layers alternately stacked.

A self-test system for PCIe and a method thereof are disclosed. In the system, a first circuit interconnect card and a second circuit interconnect card are inserted into CEM slots, respectively, and the first circuit interconnect card and the second circuit interconnect card are electrically connected to each other through a FFC, the central processing unit generates and provides differential signals to the first circuit interconnect card and the second circuit interconnect card; the first circuit interconnect card or the second circuit interconnect card provide differential signals to the second circuit interconnect card or the first circuit interconnect card through the first FFC interface and the second FFC interface, respectively, and the second circuit interconnect card or the first circuit interconnect card provides the differential signals to a central processing unit, so as to implement self-check for PCIe.

It is described an RF communication device comprising: i) an RF antenna functionality; ii) at least one antenna pad connected to the RF antenna functionality; iii) a further functionality which is not an RF antenna functionality; and iv) at least one non-antenna pad electrically connected to the further functionality.

The antenna pad and the non-antenna pad are arranged to be short-circuited with each other, and the non-antenna pad is electrically connected via a connection line to the further functionality within the RF communication device.

Further, a method of manufacturing an RF communication device is described.

An apparatus has a semiconductor wafer hosting rows and columns of chips, where the rows and columns of chips are separated by scribe lines. There are test circuit sites in the scribe lines, each test circuit site including contact pads for simultaneous connection to probe card needles, sensor circuit select and control circuitry, and a sensor circuit bank.

An apparatus has a semiconductor wafer hosting rows and columns of chips, where the rows and columns of chips are separated by scribe lines. Selection circuitry is positioned within the scribe lines. The selection circuitry is connected to test circuits in the scribe lines. The selection circuitry operates to enable voltage control at a single test circuit while disabling all other test circuits.

A test device includes semiconductor substrate, gate lines disposed on an upper surface of the semiconductor substrate and extending in a first direction parallel to the upper surface, a test element group including test transistors defined by the gate lines and by active regions extending in a second direction perpendicular to the first direction and intersecting the gate lines, and metal wirings disposed on the semiconductor substrate and electrically connected to the active regions and/or the gate lines, and a test circuit electrically connected to the metal wirings and configured to measure resistance of the test transistors. The gate lines include first gate lines and second gate lines disposed alternately, with the spacing between first gate lines and second gate lines alternating between a first distance and a second distance greater than the first distance.