An integrated circuit (IC) comprising: a margin measurement circuit configured to monitor multiple data paths of the IC and to output, at different times, different ranges of remaining margins of the multiple data paths; a workload sensor configured to output a value representing aggregate operational stress experienced by the IC over a period of time ending at each of the different times; and a processor configured to: (i) compute, based on the value output by said workload sensor, an upper bound and a lower bound of change of the remaining margin of the IC, and (ii) compute upper and lower bounds of a current remaining margin of the IC, based on (a) the upper and lower bounds of change, and (b) a remaining margin indicated by a border between two adjacent ranges outputted by the margin measurement circuit.

The present disclosure relates to an adaptive body biasing or voltage regulation circuit for a circuit region, comprising: a first delay module configured to delay a local clock signal to generate first and second output signals delayed by first and second delays; a multiplexer configured to select one of the first and second output signals; a first slack monitor circuit configured to generate a first detection signal indicating when a slack time of the first and second output signals is less than a first threshold; a voltage generation circuit configured to generate a supply voltage for the circuit region, or at least one biasing voltage for biasing wells of transistors in the circuit region, using a further control loop comprising a process, voltage and/or temperature sensor; and a control circuit configured to adjust a gain of the further control loop based on the first detection signal.

An input/output (I/O) sensor for a multi-IC module. The I/O sensor includes: delay circuitry, configured to receive a data signal from an interconnected part of an IC of the multi-IC module and to generate a delayed data signal, the delay circuitry including an adjustable delay-line configured to delay an input signal by a set time duration; a comparison circuit, configured to generate a comparison signal by comparing the data signal with the delayed data signal; and processing logic, configured to set the time duration of the adjustable delay-line and, based on the comparison signal, identify a margin measurement of the data signal for determining an interconnect quality parameter.

Described herein are improved techniques for measuring propagation delay of an integrated circuit that facilitate performing propagation delay measurements on-chip. Some embodiments relate to an integrated circuit comprising programmable oscillator circuitry with a plurality of oscillator stages that are switchable into and out of a delay path based on control signals from a controller, allowing the same programmable oscillator to generate many different oscillator signals according to the received control signals, for the controller to determine a central tendency and/or variance of propagation delay of the integrated circuit. Some embodiments relate to an integrated circuit including programmable delay paths configured to provide an amount of cell delay and an amount of wire delay based on control signals from a controller, allowing the same programmable delay path to generate signals for measuring delays due to cell and wire delays of the integrated circuit.

An input/output (I/O) sensor for a multi-IC module. The I/O sensor includes: delay circuitry, configured to receive a data signal from an interconnected part of an IC of the multi-IC module and to generate a delayed data signal, the delay circuitry including an adjustable delay-line configured to delay an input signal by a set time duration; a comparison circuit, configured to generate a comparison signal by comparing the data signal with the delayed data signal; and processing logic, configured to set the time duration of the adjustable delay-line and, based on the comparison signal, identify a margin measurement of the data signal for determining an interconnect quality parameter.

Obtaining a periodic test signal, sampling the periodic test signal using a sampling element according to a sampling clock to generate a sampled periodic output, the sampling element operating according to a supply voltage provided by a voltage regulator, the voltage regulator providing the supply voltage according to a supply voltage control signal, comparing the sampled periodic output to the sampling clock to generate a clock-to-Q measurement indicative of a delay value associated with the generation of the sampled periodic output in response to the sampling clock, generating the supply voltage control signal based at least in part on an average of the clock-to-Q measurement, and providing the supply voltage to a data sampling element connected to the voltage regulator, the data sampling element being a replica of the sampling element, the data sampling element sampling a stream of input data according to the sampling clock.

A chip health monitor includes a processor configured to operate as a state machine based on instructions stored in a storage device. The state machine is configured to exercise a signal path in a chip in response to a condition and determine presence of an error in the signal path based on results from the exercise. The state machine is configured to compensate for the error by changing at least one operational parameter of the chip.

Embodiments of the present technology provide a synchronous device. The synchronous device provides a first latch configured to store a data input signal during a first state of a first clock signal and a slack guard circuit. The slack guard circuit provides a delay element coupled to the first latch and configured to generate a delayed data signal, a gated-input cell coupled to the delay element and configured to propagate the delayed data signal during the first state of the first clock signal, and a comparator coupled to the first latch and the gated-input cell.

A method for predicting an operation parameter of an integrated circuit includes the following steps. A plurality of cells used by the integrated circuit are provided. A voltage-frequency sweep test is performed on each of cells through a test model to generate a plurality of parameters, wherein the parameters correspond to a voltage value. A lookup table is established according to the parameters. A timing signoff corresponding to the integrated circuit is obtained. A timing analysis is performed on a plurality of timing paths of the integrated circuit according to the timing signoff and the parameters of the lookup table to obtain a critical timing path, and the operation parameter of the integrated circuit is predicted according to the critical timing path.

A semiconductor integrated circuit (IC) comprising a signal path combiner, comprising a plurality of input paths and an output path. The IC comprises a delay circuit having an input electrically connected to the output path, the delay circuit delaying an input signal by a variable delay time to output a delayed signal path. The IC may comprise a first storage circuit electrically connected to the output path and a second storage circuit electrically connected to the delayed signal path. The IC comprises a comparison circuit that compares outputs of the signal path combiner and the delayed signal, wherein the comparison circuit comprises a comparison output provided in a comparison data signal to at least one mitigation circuit.