Systems, devices, and methods for performing a non-contact electrical measurement (NCEM) on a NCEM-enabled cell included in a NCEM-enabled cell vehicle may be configured to perform NCEMs while the NCEM-enabled cell vehicle is moving. The movement may be due to vibrations in the system and/or movement of a movable stage on which the NCEM-enabled cell vehicle is positioned. Position information for an electron beam column producing the electron beam performing the NCEMs and/or for the moving stage may be used to align the electron beam with targets on the NCEM-enabled cell vehicle while it is moving.

An integrated circuit integrated on a semiconductor material die and adapted to be at least partly tested wirelessly, wherein circuitry for setting a selected radio communication frequencies to be used for the wireless test of the integrated circuit are integrated on the semiconductor material die.

A method for testing a device under test at a specific channel condition is provided. The method comprises the steps of initiating a communication with the device under test and receiving a transmission frame from the device under test with a header portion comprising a specific transmission rate information. It also comprises analyzing the header portion of the transmission frame in order to determine whether the device under test is transmitting with the specific transmission rate information.

Systems, devices, and methods for performing a non-contact electrical measurement (NCEM) on a NCEM-enabled cell included in a NCEM-enabled cell vehicle may be configured to perform NCEMs while the NCEM-enabled cell vehicle is moving. The movement may be due to vibrations in the system and/or movement of a movable stage on which the NCEM-enabled cell vehicle is positioned. Position information for an electron beam column producing the electron beam performing the NCEMs and/or for the moving stage may be used to align the electron beam with targets on the NCEM-enabled cell vehicle while it is moving.

An electric field sensor includes sense and reference cells. The sense cell produces a resistance that varies relative to an intensity of an electric field, and the reference cell produces a resistance that is invariable relative to the intensity of the electric field. An output signal indicative of the intensity of the electric field is determined using the difference between the resistances. A system includes an electric field source that outputs a digital test program as an electric field signal. The system further includes the electric field sensor formed with IC dies on a wafer. The electric field sensor receives the electric field signal. The received electric field signal is converted to the test program, and the test program is stored in memory on the wafer. The electric field source does not physically contact the dies, but can flood an entire surface of the wafer with the electric field signal.

An automated circuit test system includes a magnetic sensor array configured to measure, at a plurality of locations, a magnetic field induced by a circuit under test. A circuit drive module can energize the circuit under test to induce the magnetic field. Optionally, the circuit drive module detects an electrical response from the circuit under test. Optionally, magnetic field data is combined with electrical response data prior to outputting the test result.

Devices for testing a DUT having a circuit coupled to an antenna are disclose. The device can include a DUT location for receiving a DUT, and an adapter or probe is used to wirelessly “over-the-air” (OTA) electronically test a DUT with an embedded antenna or antenna array with the measurement probe 140 located in close proximity to the DUT. The probe can be located very close to the DUT (e.g., in the near-field region). Although the probe is located in close proximity to the DUT antenna or antenna array elements it does not significantly disturb or interfere with probe during testing.

Embodiments of the present disclosure provide an antenna assembly for a test system. The antenna assembly includes a feedthrough part, two waveguide inputs, a single waveguide output as well as a multiplexing part that is interconnected between the two waveguide inputs and the single waveguide output. The multiplexing part is integrated within the feedthrough part at least partially. Moreover, embodiments of the present disclosure provide a test system and a method of establishing a test system for testing a device under test.

Systems and methods are provided for an integrated circuit system. A plurality of separate integrated circuit dies are coupled together to form an integrated circuit package, a first integrated circuit die including an input and a last integrated circuit die including an output, ones of the plurality of integrated circuit dies including a testing circuit associated with a corresponding integrated circuit die. The testing circuit includes a testing path for testing functionality of the corresponding integrated circuit die, a bypass path bypassing the testing path, and control circuitry for selecting between an output of the testing path and an output of the bypass path, the control circuitry being configured to select the output of the testing path or the output of the bypass path and to pass the selected output to a subsequent integrated circuit die among the plurality of coupled circuit dies.

A method for testing a device under test (DUT) is disclosed. The method comprises communicating signals wirelessly from a first plurality of patch antennae disposed on a top surface of the DUT to a second plurality of patch antennae disposed on a printed circuited within a handler device, wherein the handler device is operable to place the DUT in a socket of a tester system, and wherein the tester system comprises the handler device and a test fixture. The method further comprises communicating the signals captured by the second plurality of patch antennae using microstrip transmission lines to a patch antenna on the printed circuit board, wherein a first waveguide is mounted to the patch antenna using a first waveguide flange, and wherein the first waveguide flange is coupled to a first end of the first waveguide.