A testing device includes a testing socket, a first transmission medium and a second transmission medium. The testing socket defines a radiation space. The first transmission medium is disposed in the radiation space of the testing socket. The first transmission medium is configured for supporting a device under test (DUT). The second transmission medium is disposed in the radiation space of the testing socket.

An over-the-air measurement system for performing over-the-air measurements on a device under test is described. The measurement system comprises a measurement device having several measurement antennas, several waveguides, wherein at least one waveguide is assigned to each measurement antenna, several waveguide-to-cable adapters, and a positioning unit assigned to the measurement antennas. The number of the waveguide-to-cable adapters is at least identical to the number of the measurement antennas. The positioning unit is configured to move the measurement antennas with respect to the waveguide-to-cable adapters.

The invention relates to an integrated circuit with an active transistor area and a plurality of wiring layers arranged above the active transistor area. At least one optical device is integrated in the active transistor area. The optical device is electrically connected with at least one of the wiring layers. At least one optical tunnel extends from the at least one optical device through the plurality of wiring layers to a surface of an uppermost wiring layer of the plurality of wiring layers facing away from the active transistor area.

A method that is disclosed that includes the operations outlined below. Dies are arranged on a test fixture, and each of the dies includes first antennas and at least one via array, wherein the at least one via array is formed between at least two of the first antennas to separate the first antennas. By the first antennas of the dies, test processes are sequentially performed on an under-test device including second antennas that positionally correspond to the first antennas, according to signal transmissions between the first antennas and the second antennas.

A test assembly for testing an antenna-in-package (AiP) device includes a socket over a circuit board, where the socket includes an opening for receiving the AiP device; a plunger configured to move along sidewalls of the opening, where during testing of the AiP device, the plunger is configured to cause the AiP device to be pressed towards the circuit board such that the AiP device is operatively coupled to the circuit board via input/output connections of the AiP device and of the circuit board; and a loadboard disposed within the socket and between the plunger and the AiP device, where the loadboard includes a coupling structure configured to be electromagnetically coupled to a transmit antenna and to a receive antenna of the AiP device, so that testing signals transmitted by the transmit antenna are conveyed to the receive antenna externally relative to the AiP device through the coupling structure.

A method for testing a device under test at a specific channel condition is provided. The method comprises the steps of initiating a communication with the device under test and receiving a transmission frame from the device under test with a header portion comprising a specific transmission rate information. It also comprises analyzing the header portion of the transmission frame in order to determine whether the device under test is transmitting with the specific transmission rate information.

An integrated circuit (IC) includes a first circuit layer that includes a first wireless power transfer (WPT) device, a first chip electrically connected to the first circuit layer, and a first tracking circuit disposed in the first chip. The first WPT device may be configured to extract energy from an electromagnetic signal and provide an output voltage. The first tracking circuit may be powered by the output voltage of the first WPT device and may output tracking data in response to an instruction extracted from the electromagnetic signal.

According to some embodiments, a tester tests one or more DUTs by utilizing one or more respective reference devices. The tester comprises one or more test sites and one or more test circuits operatively coupled to each of the test sites. Each test site is configured to: hold a reference device and a DUT, transmit a transmitted electromagnetic RF signal including a test data pattern to the DUT, and receive a received electromagnetic RF signal emitted from the DUT. The test circuits are configured to: receive a first electrical signal converted from the received electromagnetic RF signal, extract first data from the first electrical signal, determine a first error rate between the test data pattern and the first data, and generate a test result on the basis of the first error rate.

A radio frequency (RF) loopback substrate or printed circuit board (PCB) which contains receive and transmit antennas located on the bottom of the loopback substrate which are aligned with the complementary transmit and receive antennas on an antenna on package (AOP) device under test. The loopback substrate receive and transmit antennas are coupled to each other. The device under test contacts are driven by a conventional tester, which causes RF circuitry in the integrated circuit to drive an AOP transmit antenna. The corresponding loopback substrate receive antenna receives the RF signal from the AOP transmit antenna and provides it to the loopback substrate transmit antennas. The integrated circuit package AOP receive antennas then receive the RF signals from the loopback substrate transmit antennas. The signals at the integrated circuit package AOP receive antennas are monitored through the integrated circuit contacts to monitor the received RF signals.

A wireless test system includes a load board having an upper surface and a lower surface. The load board has a testing antenna disposed on the load board. A socket for receiving a device under test (DUT) having an antenna structure therein is disposed on the upper surface of the load board. The antenna structure is aligned with the testing antenna. The wireless test system further includes a handler for picking up and delivering the DUT to the socket. The handler has a clamp for holding and pressing the DUT. The clamp is grounded during testing and functions as a ground reflector that reflects and reverses radiation pattern of the DUT from an upward direction to a downward direction toward the testing antenna.