A test system for testing RF PCBs including an RF probe for interfacing an intermediate node of each RF PCB, an RF source providing an RF test signal, a reflectometer, and a test measurement system that makes a pass/fail determination of each RF PCB using a measured reflection coefficient. Each RF PCB includes an IC matching circuit and an antenna matching circuit coupled between an RFIC and an antenna, in which the intermediate RF node is between the matching circuits. The reflectometer outputs a measured reflection coefficient indicative of a comparison between a reflected RF signal and the RF test signal. The measured reflection coefficient may be corrected using error values based on a calibration procedure using a calibration kit with modified RF PCBs with known loads. The modified RF PCBs are measured with a network analyzer and the test system to calculate the error values used for production testing.

There is provided an aircraft engine printed circuit board assembly generally having a functional circuit contributing to the operation of an aircraft engine. The functional circuit has a first substrate portion, a first electronic component supported by the first substrate portion, and a first electrical conductor supported by the first substrate portion and leading to the first electronic component. The aircraft engine printed circuit board assembly generally has a monitoring circuit having a second substrate portion, a second electronic component supported by the second substrate portion, a second electrical conductor supported by the second substrate portion and leading to the second electronic component, the second electrical conductor having a shorter life expectancy than the first electrical conductor, and a detector monitoring an indicator of operativeness of the second electrical conductor, in which the first electrical conductor and the second electrical conductor are both exposed to the same environment.

There is provided an aircraft engine printed circuit board assembly generally having a functional circuit contributing to the operation of an aircraft engine. The functional circuit has a first substrate portion, a first electronic component supported by the first substrate portion, and a first electrical conductor supported by the first substrate portion and leading to the first electronic component. The aircraft engine printed circuit board assembly generally has a monitoring circuit having a second substrate portion, a second electronic component supported by the second substrate portion, a second electrical conductor supported by the second substrate portion and leading to the second electronic component, the second electrical conductor having a shorter life expectancy than the first electrical conductor, and a detector monitoring an indicator of operativeness of the second electrical conductor, in which the first electrical conductor and the second electrical conductor are both exposed to the same environment.

A reference via in a set of plated vias on a printed circuit board is located. A reference lead is applied to the reference via. A test via in the set of plated vias is located. A test lead is applied to the test via. An electrical conductance between the reference via and the test via is measured. A property of a core layer of the printed circuit board is identified based on the electrical conductance.

A reference via in a set of plated vias on a printed circuit board is located. A reference lead is applied to the reference via. A test via in the set of plated vias is located. A test lead is applied to the test via. An electrical conductance between the reference via and the test via is measured. A property of a core layer of the printed circuit board is identified based on the electrical conductance.

A capacitance detection area sensor includes capacitance sensor elements arranged in a two-dimensional array, is shaped into an appropriate shape, and capacitively coupled to an external electrode. To the external electrode, a sensing signal having a potential difference is supplied. The first and second sensor output signals are acquired from a capacitance sensor element capacitively coupled to the external electrode, at the timing of the sensing signal being a first signal and being a second signal, respectively. A differential signal is generated from a difference between the acquired first and second sensor output signals, and an image indicating the shape of the external electrode is generated based on the level of the differential signal, in different colors or different tones.

A test system for testing RF PCBs including an RF probe for interfacing an intermediate node of each RF PCB, an RF source providing an RF test signal, a reflectometer, and a test measurement system that makes a pass/fail determination of each RF PCB using a measured reflection coefficient. Each RF PCB includes an IC matching circuit and an antenna matching circuit coupled between an RFIC and an antenna, in which the intermediate RF node is between the matching circuits. The reflectometer outputs a measured reflection coefficient indicative of a comparison between a reflected RF signal and the RF test signal. The measured reflection coefficient may be corrected using error values based on a calibration procedure using a calibration kit with modified RF PCBs with known loads. The modified RF PCBs are measured with a network analyzer and the test system to calculate the error values used for production testing.

A test system for testing RF PCBs including an RF probe for interfacing an intermediate node of each RF PCB, an RF source providing an RF test signal, a reflectometer, and a test measurement system that makes a pass/fail determination of each RF PCB using a measured reflection coefficient. Each RF PCB includes an IC matching circuit and an antenna matching circuit coupled between an RFIC and an antenna, in which the intermediate RF node is between the matching circuits. The reflectometer outputs a measured reflection coefficient indicative of a comparison between a reflected RF signal and the RF test signal. The measured reflection coefficient may be corrected using error values based on a calibration procedure using a calibration kit with modified RF PCBs with known loads. The modified RF PCBs are measured with a network analyzer and the test system to calculate the error values used for production testing.

An interconnect circuit testing apparatus including: an electric signal generating circuit for generating an electric signal; a first electrode arranged at a first region of a substrate, wherein the substrate includes an interconnect circuit, an upper surface and a lower surface; a second electrode arranged at a second region of the substrate; and a sensor for detecting an electric field emitted from the first region or the second region when the electric signal is applied to the substrate through the first electrode and the second electrode.

A transfer apparatus for an inspection apparatus according to one embodiment of the present disclosure includes: an upper end engaging portion configured to make contact with an upper surface of a transferred article; a support frame to which the upper end engaging portion is fixed; a lift including a support part configured to support a lower surface of the transferred article, the lift arranged on the support frame to be movable in an up-down direction; and a lifting driver configured to provide a driving force to move the lift in the up-down direction.