A method wherein faults are detected by measuring electromagnetic emission from a device under test which is placed into different operating states. Electromagnetic emission signals are measured from the device for each operating state by obtaining a time-domain result. The measured signals are processed by digitizing and converting the signal from time-domain into frequency domain. The result is compared with a result of a non-fault device. A fault is detected if there is a sufficient difference between the compared results. The system includes one or more inductive sensors and one or more amplifiers. A digital processing unit in the system includes an analog-to-digital converter for digitizing measured signals, an analyzer for transforming the digital signals into frequency components, a comparator for comparing the frequency components to those of a non-fault device, and a memory for storing the measurement results.

An inductive charging system can include a transmitter device and a receiver device. The transmitter device may be adapted to detect when a receiver coil in the receiver device is coupled to a transmitter coil in the transmitter device. For example, the current input into a DC-to-AC converter in the transmitter device can be measured and coil coupling detected when the current equals or exceeds a threshold value.

An inductive charging system can include a transmitter device and a receiver device. The transmitter device may be adapted to detect when a receiver coil in the receiver device is coupled to a transmitter coil in the transmitter device. For example, the current input into a DC-to-AC converter in the transmitter device can be measured and coil coupling detected when the current equals or exceeds a threshold value.

A testing probe apparatus for testing die. The testing probe may include a probe interface and a carrier for supporting at least one die comprising 3DI structures. The probe interface may be positionable on a first side of the at least one die and include a voltage source and at least one first inductor operably coupled to the voltage source. A voltage sensor and at least one second inductor coupled to the voltage sensor may be disposed on a second opposing side of the at least one die. The voltage source of the probe interface may be configured to inductively cause a voltage within the 3DI structures of the at least one die via the at least one first inductor. The voltage sensor may be configured to sense a voltage within the at least one 3DI structure via the at least one second inductor. Related systems and methods are also disclosed.

An apparatus for measuring velocities of projectiles launched from firearms is disclosed. The apparatus includes a stationary clamp arm and a movable clamp arm works in concert with the stationary clamp arm for clamping the apparatus to a firearm. A thumb screw is employed to secure the movable clamp arm and the stationary clamp arm to the firearm. A sensor module, which is integrated to the stationary clamp, includes a first and second sensor coils, a first magnet adjacent to the first sensor coil, and a second magnet adjacent to the second sensor coil.

A sensor probe. The probe includes a central loop and a plurality of peripheral loops disposed peripherally relative to the central loop. To maximize far-field suppression, current flows in a first direction through the central loop and in a second direction through each one of the plurality of peripheral loops, the first direction opposite to the second direction, and current through the central loop equals current through the plurality of peripheral loops.

A sensor probe. The probe includes a central loop and a plurality of peripheral loops disposed peripherally relative to the central loop. To maximize far-field suppression, current flows in a first direction through the central loop and in a second direction through each one of the plurality of peripheral loops, the first direction opposite to the second direction, and current through the central loop equals current through the plurality of peripheral loops.

Techniques are disclosed for carrying out ferromagnetic resonance (FMR) testing on whole wafers populated with one or more buried magnetic layers. The techniques can be used to verify or troubleshoot processes for forming the buried magnetic layers, without requiring the wafer to be broken. The techniques can also be used to distinguish one magnetic layer from others in the same stack, based on a unique frequency response of that layer. One example methodology includes moving a wafer proximate to a waveguide (within 500 microns, but without shorting), energizing a DC magnetic field near the target measurement point, applying an RF input signal through the waveguide, collecting resonance spectra of the frequency response of the waveguide, and decomposing the resonance spectra into magnetic properties of the target layer. One or both of the DC magnetic field and RF input signal can be swept to generate a robust set of resonance spectra.

Techniques are disclosed for carrying out ferromagnetic resonance (FMR) testing on whole wafers populated with one or more buried magnetic layers. The techniques can be used to verify or troubleshoot processes for forming the buried magnetic layers, without requiring the wafer to be broken. The techniques can also be used to distinguish one magnetic layer from others in the same stack, based on a unique frequency response of that layer. One example methodology includes moving a wafer proximate to a waveguide (within 500 microns, but without shorting), energizing a DC magnetic field near the target measurement point, applying an RF input signal through the waveguide, collecting resonance spectra of the frequency response of the waveguide, and decomposing the resonance spectra into magnetic properties of the target layer. One or both of the DC magnetic field and RF input signal can be swept to generate a robust set of resonance spectra.

A Transistor Resonant Characteristic Sensor (TReCS) includes a sensing element positioned along electronic equipment so that the sensing element is electromagnetically coupled to the electronic equipment. The sensing element includes a coil. The sensing element is configured to detect magnetic oscillations associated with a characteristic signal generated by the electronic equipment. The TReCS sensor further includes an evaluation circuit connected to the sensing element for monitoring health state of the electronic equipment. The evaluation circuit includes one or more processing elements configured to diagnose health state of the electronic equipment based on extracted baseband information associated with the characteristic signal.