A current sensor includes a bus bar in which a current to be detected flows, a circuit board mounted with a magnetic detection element thereon to detect a strength of a magnetic field generated by a current flowing in the bus bar, and a housing including first and second housings provided in such a manner as to sandwich the bus bar and the circuit board therebetween in a plate thickness direction of the bus bar. The first and second housings include slide guide portions respectively which are relatively slidable in a sloping direction with respect to the plate thickness direction of the bus bar while abutting each other in the plate thickness direction of the bus bar.

A testing probe apparatus for testing die. The testing probe may include a probe interface and a carrier for supporting at least one die comprising 3DI structures. The probe interface may be positionable on a first side of the at least one die and include a voltage source and at least one first inductor operably coupled to the voltage source. A voltage sensor and at least one second inductor coupled to the voltage sensor may be disposed on a second opposing side of the at least one die. The voltage source of the probe interface may be configured to inductively cause a voltage within the 3DI structures of the at least one die via the at least one first inductor. The voltage sensor may be configured to sense a voltage within the at least one 3DI structure via the at least one second inductor. Related systems and methods are also disclosed.

A system includes a signal generator configured to generate a signal, the signal being a constant frequency signal or the signal ranging in frequency during a time period. The system includes a probe electrically coupled to the signal generator, and the probe is configured to hover across or touch an encapsulated or uncapsulated strain gauge. The probe includes a coil and a stylus. The coil is configured to receive the signal from the signal generator and generate a magnetic field. The stylus is configured to transmit the magnetic field to the strain gauge. The system includes a data acquisition component coupled to the strain gauge. The data acquisition component is configured to receive stimulus data from the strain gauge, resulting from the magnetic field transmitted by the probe. The data acquisition component is configured to determine whether the stimulus data from the strain gauge is above a threshold, and if so, determine that the strain gauge is operable.

A testing apparatus includes a test head body, a test board coupled to the test head body, and a spring pin block coupled to a lower portion of the test board. The testing apparatus further includes a magnetic field generator penetrating through each of the test head body, the test board, and the spring pin block.

A sensor device for testing electrical connections using contactless fault detection is disclosed. The sensor device includes: a surface coil comprising a plurality of concentric loops disposed at a first region located away from the electrical connections. The concentric loops generate a first magnetic field passing through the electrical connections, and the first magnetic field is equivalent to that generated by a coaxial intermediate current loop adjacent to the electrical connections based on an excitation current in the surface coil. The sensor device further includes a sensor adapted to detect a second magnetic field at a second region located away from the electrical connections, wherein variations in the detected second magnetic field provide categories of performance of the electrical connections.

Techniques are disclosed for carrying out ferromagnetic resonance (FMR) testing on whole wafers populated with one or more buried magnetic layers. The techniques can be used to verify or troubleshoot processes for forming the buried magnetic layers, without requiring the wafer to be broken. The techniques can also be used to distinguish one magnetic layer from others in the same stack, based on a unique frequency response of that layer. One example methodology includes moving a wafer proximate to a waveguide (within 500 microns, but without shorting), energizing a DC magnetic field near the target measurement point, applying an RF input signal through the waveguide, collecting resonance spectra of the frequency response of the waveguide, and decomposing the resonance spectra into magnetic properties of the target layer. One or both of the DC magnetic field and RF input signal can be swept to generate a robust set of resonance spectra.

Techniques are disclosed for carrying out ferromagnetic resonance (FMR) testing on whole wafers populated with one or more buried magnetic layers. The techniques can be used to verify or troubleshoot processes for forming the buried magnetic layers, without requiring the wafer to be broken. The techniques can also be used to distinguish one magnetic layer from others in the same stack, based on a unique frequency response of that layer. One example methodology includes moving a wafer proximate to a waveguide (within 500 microns, but without shorting), energizing a DC magnetic field near the target measurement point, applying an RF input signal through the waveguide, collecting resonance spectra of the frequency response of the waveguide, and decomposing the resonance spectra into magnetic properties of the target layer. One or both of the DC magnetic field and RF input signal can be swept to generate a robust set of resonance spectra.

An inductive charging system can include a transmitter device and a receiver device. The transmitter device may be adapted to detect when a receiver coil in the receiver device is coupled to a transmitter coil in the transmitter device. For example, the current input into a DC-to-AC converter in the transmitter device can be measured and coil coupling detected when the current equals or exceeds a threshold value.

A probe test card for testing semiconductor devices includes a printed circuit board, a pair of electrically conductive probes extending towards one another and protruding away from the printed circuit board with a gap being disposed between ends of the pair of electrically conductive probes, and a coil affixed to and electrically connected to the printed circuit board and disposed directly over the gap. The probe test card is configured to generate a magnetic flux in the gap between the ends of the pair of electrically conductive probes upon the application of a current through the coil.

A probe test card for testing semiconductor devices includes a printed circuit board, a pair of electrically conductive probes extending towards one another and protruding away from the printed circuit board with a gap being disposed between ends of the pair of electrically conductive probes, and a coil affixed to and electrically connected to the printed circuit board and disposed directly over the gap. The probe test card is configured to generate a magnetic flux in the gap between the ends of the pair of electrically conductive probes upon the application of a current through the coil.