An integrated circuit with functional circuitry and testing circuitry, the testing circuitry having a state machine operable in a plurality of different states. The integrated circuit also has a pin for receiving a signal, wherein the state machine is operable to transition between states in response to a change in level of the signal. Circuitry couples the signal of the pin, in a first level, to the state machine in a first time period for causing the state machine to enter a predetermined state, and circuitry maintains the signal in the first level to the state machine in a second time period for maintaining the state machine in the predetermined state. Also during the second time period, circuitry couples data received at the pin to a destination circuit other than the state machine, wherein the destination circuit is operable to perform plural successive scan tests using data from the pin without a power on reset of the functional circuitry.

A test mode circuit of a semiconductor device includes a test mode activating signal generation unit suitable for generating a test mode activating signal in response to a test signal; a test clock generation unit suitable for generating a plurality of test clocks in response to the test mode activating signal and a control clock; a test control signal generation unit suitable for generating test control signals based on the plurality of test clocks of a control signal input cycle, wherein the plurality of test clocks have the control signal input cycle and a data input cycle; and an internal control signal generation unit suitable for generating a plurality of control signals to perform a test operation in response to the test control signals and input data.

A processor includes logic to implement a reconfigurable test access port with finite state machine control. A plurality of test access ports may each include a finite state machine for enabling implementation of different test interfaces to the processor, including JTAG IEEE 1149.1, JTAG IEEE 1149.7, and serial wire debug.

Systems and methods for testing printed circuit boards (PCBs) are disclosed herein. In one embodiment, a tester for printed circuit boards (PCBs) includes a test fixture having a plurality of electrical contacts for contacting the PCBs that are units under test (UUTs). The test fixture carries a remote test peripheral master (RTPM) module, and a remote test peripheral slave (RTPS) module. The RTPM module and the RTPS module are connected through a remote test peripheral (RTP) bus.

Boundary scan test data and a command to initiate a boundary scan test are received via a universal asynchronous receiver-transmitter (UART). Based on receiving the command, a boundary scan test mode is initiated at a memory sub-system controller. A boundary scan test vector based on the boundary scan test data is synchronously streamed to a boundary scan chain. Test result data output by the scan chain is provided to a UART host via the UART.

An example integrated circuit (IC) die in a multi-die IC package, the multi-die IC package having a test access port (TAP) comprising a test data input (TDI), test data output (TDO), test clock (TCK), and test mode select (TMS), is described. The IC die includes a Joint Test Action Group (JTAG) controller having a JTAG interface that includes a TDI, a TDO, a TCK, and a TMS, a first output coupled to first routing in the multi-die IC package, a first input coupled to the first routing or to second routing in the multi-die IC package, a master return path coupled to the first input, and a wrapper circuit configured to couple the TDI of the TAP to the TDI of the JTAG controller, and selectively couple, in response to a first control signal, the TDO of the TAP to either the master return path or the TDO of the JTAG controller.

A scan test device includes a scan flip flop circuit and a clock gating circuit. The scan flip flop circuit is configured to receive a scan input signal according to a scan clock signal, and to output the received scan input signal to be a test signal. The clock gating circuit is configured to selectively mask the scan clock signal according to a predetermined bit of the test signal and a scan enable signal, in order to generate a test scan clock signal for testing at least one core circuit.

This disclosure proposes an inventive system capable of testing a component in the system during runtime. The system may comprise: a substrate; a plurality of functional components, of the plurality of functional components being mounted onto the substrate and including a circuitry; a system bus formed with electrically conductive pattern onto the substrate thereby allowing the plurality of functional components to communicate with each other; one or more wrappers, each of the one or more wrappers connected to one of the plurality of functional components; and an in-system component tester (ICT) configured to: select, as a component under test (CUT), at least one functional component, in an idle state, of the plurality of the functional components; and test, via the one or more test wrappers, the at least one functional component selected as the CUT.

An integrated circuit (IC) includes functional logic therein that can be enabled by application of a predefined thermal cycle. The IC includes an enabling fuse operatively coupled to the functional logic, the functional logic being disabled unless enabled by activation of the enabling fuse. A set of thermal sensors are arranged in a physically distributed manner through at least a portion of the IC. A test control macro operatively couples to the set of thermal sensors and the enabling fuse for activating the enabling fuse to enable the functional logic in response to application of a thermal cycle that causes the set of thermal sensors to sequentially experience a thermal condition matching a thermal sequence enabling test. A related method and system for applying the predefined thermal cycle are also provided.

A circuit debug apparatus for debugging an integrated circuit that causes a functional fault may include a processor configured to extract a scan pattern of a scan chain of the integrated circuit while the integrated circuit is in a scan mode. The scan pattern includes a plurality of logic states for a corresponding plurality of logic circuits of the integrated circuit. The processor may also be configured to apply a modified scan pattern to the integrated circuit while the integrated circuit is in the scan mode, where the modified scan pattern includes a test pattern configured to eliminate the functional fault. The processor may be further configured to determine whether the integrated circuit with the modified scan pattern produces the functional fault while the integrated circuit is in a functional mode.