An offset detector circuit includes a digital signal register storing M unit digital signals received in latest M signal periods, M being a natural number, among digital signals generated based on a single-ended PAM-N signal, N being an odd number, a comparator outputting a comparison signal of a pair of signals included in differential signals generated from a differential signal generator based on the single-ended PAM-N signal, a comparison result register storing M unit comparison signals corresponding to the latest M signal periods among the comparison signals, a pattern detector outputting a detection signal when the M unit digital signals match a predetermined signal pattern, and an offset checker checking patterns of the M unit comparison signals in response to the detection signal, and outputting an offset detection signal when the patterns of the M unit comparison signals match a predetermined offset pattern.

A technique for testing an electronic UUT by a test apparatus includes obtaining multiple DFTs of a test signal received from the UUT with the test apparatus configured differently for obtaining each DFT. The resulting DFTs include both valid content representing the test signal and invalid content introduced by the test apparatus. The improved technique suppresses the invalid content by generating a corrected DFT, which provides minimum magnitude values for corresponding frequencies relative to the test signal across the multiple DFTs.

According to an embodiment, a testing mechanism determines a status of circuits within a chip by analyzing fail signatures on a by-level basis to identify a high probability defect area within the chip. The testing mechanism further determines a whether functionally needed circuitry of the chip intersects with the high probability defect area within the chip and determines the status of the circuits in response to the determining of whether the functionally needed circuitry intersects with the high probability defect area.

A device and a method for monitoring and analysis utilize unintended electromagnetic emissions of electrically powered components, devices or systems. The emissions are received at the antenna and a receiver. A processor processes and measures change or changes in a signature of the unintended electromagnetic emissions. The measurement are analyzed to both record a baseline score for future measurements and to be used in determining status and/or health of the analyzed system or component.

A self-test built in a conditional access chip is provided. The conditional access chip decrypts video data by using a plurality of logic units. The self-test circuit includes: a storage circuit, storing test data and comparison data; and a control circuit, coupled to the logic units, controlling the logic units to receive a clock to perform a test, reading the test data from the storage circuit, inputting the test data to a scan chain formed by the logic units according to the clock, and comparing output data of the scan chain with the comparison data to obtain a test result.

A semiconductor device may include an inversion control signal generation circuit, a pattern control signal generation circuit, and a data input/output (I/O) circuit. The inversion control signal generation circuit may generate an inversion control signal according to a logic level combination of bit patterns included in at least one of a first address and a second address. The pattern control signal generation circuit may generate a pattern control signal from a pre-control signal in response to the inversion control signal. In response to the pattern control signal, the data input/output (I/O) circuit may generate data signals that will be output to an internal I/O line based on data signals loaded on a local I/O line.

Disclosed herein is a test circuit for a 3D semiconductor device for detecting soft errors and a method for testing thereof. The test circuit includes a first Multiple Input Signature Register (MISR) disposed in a first semiconductor chip, the first MISR compressing a first test result signal corresponding to a test pattern, a second MISR disposed in a second semiconductor chip stacked on or under the first semiconductor chip, the second MISR compressing a second test result signal corresponding to the test pattern, and a first error detector to detect a soft error by comparing a first output signal output from the first MISR with a second output signal output from the second MISR.

Embodiments of the present invention, which relate to the field of electronic technologies, provide a monitoring method, a monitoring apparatus, and an electronic device, which can accurately locate an error point in MPI information delivered by a system chip. The apparatus may include: an address filter, a read/write controller connected to the address filter, and a memory connected to the read/write controller, where the address filter is configured to acquire multiple pieces of MPI information, and obtain, by filtering the multiple pieces of MPI information, first MPI information corresponding to a first service that is preset; the read/write controller is configured to write, into the memory according to a time sequence of receiving the first MPI information, the first MPI information that is obtained by the address filter by filtering; and the memory is configured to store the first MPI information written by the read/write controller.

A synchronization circuit includes a first synchronizer, a second synchronizer, and selection circuitry. The first synchronizer is configured to synchronize a received signal to a clock signal. The second synchronizer is disposed in parallel with the first synchronizer and configured to synchronize the received signal to the clock signal. The selection circuitry is coupled to the first synchronizer and the second synchronizer. The selection circuitry is configured to provide an output value generated by the first synchronizer at an output terminal of the synchronization circuit based on the output value generated by the first synchronizer being the same as an output value generated by the second synchronizer.

A microcontroller includes a data memory configured to store test signal data. The microcontroller further includes a signal generator configured to process the test signal data in order to provide at least one test signal. The microcontroller also includes a circuit under test configured to process the test signal. The test signal data includes at least one pattern snippet and an associated pattern descriptor. The pattern snippet includes data concerning a content of a part of the test signal. The associated pattern descriptor includes data concerning a pattern formed by the pattern snippet within the test signal.