An apparatus for testing a device under test (DUT) is provided. The apparatus includes a power supply device and a data generating device. The power supply device is configured to provide a first voltage and a second voltage to the DUT. The data generating device is configured to provide first data to the DUT. The power supply device is configured to provide the first voltage to the DUT in a first time duration. The data generating device is configured to provide the first data to the DUT in the first time duration. The power supply device is configured to provide the second voltage to the DUT in a second time duration after the first time duration. The second voltage is different from the first voltage.

Testing of die on wafer is achieved by; (1) providing a tester with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, (2) providing die on wafer with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuity, and (3) providing a connectivity mechanism between the bidirectional transceiver circuitry's of the tester and a selected group or all of the die on wafer for communication of the JTAG signals.

An abnormality detection method according to one aspect of the present disclosure is a method of detecting an abnormality in an AC signal to be input from an AC power supply. The method includes, where an ideal AC signal is represented as V.sub.0 sin ωt (V.sub.0: amplitude, co: angular frequency, t: time), calculating an arithmetic value including a value represented by sin.sup.2ωt+cos.sup.2ωt and determining that the AC signal is abnormal when the arithmetic value is out of a threshold range.

In an embodiment a processing system includes a reset circuit configured to receive a reset-request signal and one or more further reset-request signals, wherein the one or more further reset-request signals are provided by a processing core, one or more further circuits and/or a terminal of the processing system and to generate a combined reset-request signal by combining the reset-request signal and the one or more further reset-request signals, and a hardware test circuit including for each of the one or more further reset-request signals, a respective first combinational circuit configured to selectively assert the respective further reset-request signal, a second combinational logic circuit configured to selectively mask the combined reset-request signal, and a control circuit configured to repeat operations during a diagnostic phase.

An apparatus includes a processor configured to control an automatic test equipment (ATE) to measure one or more parameters of a current test instance for testing a device under test (DUT), during execution of the current test instance on the DUT, and determine, based on the measured one or more parameters, one or more controls for controlling a temperature of a thermal head connected to the DUT so that a junction temperature of the DUT corresponds to a predetermined test temperature. The processor is further configured to control the temperature of the thermal head, based on the determined one or more controls.

An apparatus for testing components for use in a power system includes at least one power amplifier circuit configured to be coupled to the component and a control circuit configured to operate the power amplifier circuit responsive to at least one state of a component emulator for the component included in a system emulator for the power system. The component emulator may include at least one power electronics converter circuit and the control circuit may be configured to control at least one of a voltage and a current of the at least one power amplifier circuit responsive to at least one of a voltage and a current of the at least one power electronics converter circuit. The control circuit may be further configured to control the component emulator responsive to at least one state of the at least one power amplifier circuit.

A board adapter device includes: a first adapter structure provided with a gold finger matched with a board of a target memory module, a second adapter structure provided with a connector matched with the gold finger, and a signal transmission structure including a first and second transmission module. The first transmission module is for connecting a data signal line, a clock signal line, an address signal line, and a control signal line of the gold finger to corresponding connecting lines of the connector. The second transmission module is configured to, when receiving a power input signal, convert the power input signal into a power output signal matched with a power supply of the target memory module, and transmit the power output signal to a power signal line of the connector.

Testing of die on wafer is achieved by; (1) providing a tester with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, (2) providing die on wafer with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, and (3) providing a connectivity mechanism between the bidirectional transceiver circuitry's of the tester and a selected group or all of the die on wafer for communication of the JTAG signals.

An apparatus comprising a battery and a circuit. The battery may be configured to provide a persistent power source. The circuit may comprise a processor, self-test logic, internal storage and logic circuitry. The self-test logic may be configured to perform a status check to determine an operating status of the logic circuitry. The processor may be configured to enable a first portion of the status check to be performed during a shutdown of the apparatus and a second portion of the status check to be performed during a bootup of the apparatus. The battery may provide the persistent power source to the internal storage after the shutdown of the apparatus. Parameters generated during the first portion may be stored in the internal storage. The parameters stored in the internal storage may be used with the second portion to determine the operating status of the logic circuitry.

An apparatus includes a processor configured to control an automatic test equipment (ATE) to measure one or more parameters of a current test instance for testing a device under test (DUT), during execution of the current test instance on the DUT, and determine, based on the measured one or more parameters, one or more controls for controlling a temperature of a thermal head connected to the DUT so that a junction temperature of the DUT corresponds to a predetermined test temperature. The processor is further configured to control the temperature of the thermal head, based on the determined one or more controls.