An integrated circuit (IC) includes: a first functional analog pin or pad; a first analog test bus coupled to the first functional analog pin or pad; first and second analog circuits coupled to the first analog test bus; and a test controller configured to: when the IC is in a functional operating mode, connect an input or output of the first analog circuit to the first analog test bus so that the input or output of the first analog circuit is accessible by the first functional analog pin or pad, and keep disconnected an input or output of the second analog circuit from the first analog test bus, and when the IC is in a test mode, selectively connect the input or output of the first and second analog circuits to the first analog test bus to test the first and second analog circuits using the first analog test bus.

An integrated circuit (IC) device and a method for communicating test data utilizes test control circuitry, and a test controller. The test controller is coupled with the test control circuitry and decodes packetized test pattern data to identify configuration data for the test controller and test data for the test control circuitry. The test controller further communicates the test data to the test control circuitry, and packetizes resulting data received from the test control circuitry. The resulting data corresponds to errors identified by a test performed based on the test pattern data.

A built-in self-test (BIST) method includes providing expanded test patterns to a logic circuit under test, generating a first signature based on a response of the logic circuit to the expanded test patterns, generating a second signature based on the first signature, wherein the second signature is a compressed version of the first signature, selecting one of the first signature or the second signature in response to a control signal, comparing the selected one of the first signature or the second signature to an expected signature, and, based on the comparison of the selected one of the first signature or the second signature to the expected signature, determining that the logic circuit passes or fails BIST.

This disclosure describes die test architectures that can be implemented in a first, middle and last die of a die stack. The die test architectures are mainly the same, but for the exceptions mentioned in this disclosure.

This disclosure describes die test architectures that can be implemented in a first, middle and last die of a die stack. The die test architectures are mainly the same, but for the exceptions mentioned in this disclosure.

Ring packet built-in self-test (PBIST) circuitry configured to detect errors in wires connecting a ring of superconducting chips includes circuitry configured to make the PBIST immune to interchip latency and still allow the PBIST to test a stop-to-stop connection. By making a PBIST independent of latency, an entire ring can be characterized for latency and for its bit-error rate prior to running any functional test. Such systems and associated methods can be scaled to larger platforms having any number of ring stops. The PBIST circuitry can function as either transmitter or receiver, or both, to test an entire ring. The PBIST can also be used to tune clocks in the ring to achieve the lowest overall bit error rate (BER) in the ring.

A system-on-chip (SoC) is disclosed. The SoC includes a set of fake fault injection circuits and a critical intellectual property (IP) core that includes first and second control circuits. The first and second control circuits are each operable in a test mode and a functional mode. The first and second control circuits are operated in the functional mode in lockstep in an absence of a fake fault input. In a presence of the fake fault input, one of the first and second control circuits is switched from the functional mode to the test mode. One of the first and second control circuits operating the test mode generates a fake fault response for the fake fault input. The critical IP core is determined as one of error-free and erroneous based on a detection of the generated fake fault response as one of error-free and erroneous, respectively.

Testing of die on wafer is achieved by; (1) providing a tester with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, (2) providing die on wafer with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuity, and (3) providing a connectivity mechanism between the bidirectional transceiver circuitry's of the tester and a selected group or all of the die on wafer for communication of the JTAG signals.

This disclosure describes a test architecture that supports a common approach to testing individual die and dies in a 3D stack arrangement. The test architecture uses an improved TAP design to facilitate the testing of parallel test circuits within the die.

Ring packet built-in self-test (PBIST) circuitry configured to detect errors in wires connecting a ring of superconducting chips includes circuitry configured to make the PBIST immune to interchip latency and still allow the PBIST to test a stop-to-stop connection. By making a PBIST independent of latency, an entire ring can be characterized for latency and for its bit-error rate prior to running any functional test. Such systems and associated methods can be scaled to larger platforms having any number of ring stops. The PBIST circuitry can function as either transmitter or receiver, or both, to test an entire ring. The PBIST can also be used to tune clocks in the ring to achieve the lowest overall bit error rate (BER) in the ring.