A hybrid optical-electrical automated testing equipment (ATE) system can implement a workpress assembly that can interface with a device under test (DUT) and a load board that holds the DUT during testing, analysis, and calibration. A test hand can actuate to position the DUT on a socket and align one or more alignment features. The workpress assembly can include two optical interfaces that are optically coupled such that light can be provided to a side of the DUT that is facing away from the load board, thereby enabling the ATE system to perform simultaneous optical and electrical testing of the DUT.

In one embodiment, an apparatus includes a bi-directional coupler for coupling an upstream signal and a downstream signal to a termination load. A test point detection mechanism is configured to detect when a test point device is inserted in a test point connector. The test point device is configured to perform a test of the upstream signal or the downstream signal. A switch is configured to switch from being coupled to the termination load to being coupled to the test point device when the test point device is detected as being inserted in the test point connector. The switch is configured to switch from being coupled to being coupled to the test point device to the termination load when the test point device is detected as being removed from being inserted in the test point connector.

This invention relates to an anti-tamper assembly for a circuit board comprising one or more electronic components, the assembly comprising: a container having side walls, a first, closed end and a second, opposing, open end, the container being configured to be mounted on said circuit board at said open end, over at least one of said electrical components, to form, in use, a sealed cavity around said at least one of said electrical components; a source of radioactive particles mounted within said container; an image sensor for capturing image frames within said sealed cavity, in use, wherein said image sensor comprises a detector region defining an array of pixels; and a processor for receiving said captured image frames, monitoring said image frames for changes in the statistical distribution of active pixels and, in the event that statistical distribution of active pixels indicates the presence of a feature in an image frame, generating a tamper alert.

A hybrid automated testing equipment (ATE) system can simultaneously test electrical and optical components of a device under test, such as an optical transceiver. The device under test can be a multilane optical transceiver that transmits different channels of data on different lanes. The hybrid ATE system can include one or more light sources and optical switches in an optical test lane selector to selectively test and calibrate each optical and electrical components of each lane of the device under test.

A test apparatus includes: an electrical connection unit to be electrically connected to a terminal of each of a plurality of light emitting devices to be tested; a light source unit for collectively irradiating the plurality of light emitting devices with light; a measuring unit for measuring a photoelectric signal obtained by photoelectrically converting light irradiated by the light source unit and output via the electrical connection unit by each light emitting device; an acquisition unit for acquiring a correction map including a correction value for correcting a variation in intensity of light with which a position of each light emitting device is irradiated by the light source unit; and a determination unit for determining a quality of each light emitting device on a basis of a measurement result by the measuring unit and the correction map acquired by the acquisition unit.

An optical-electrical device can implement a feedback-based control loop for temperature of the device during component calibration. The optical-electrical device can implement compressed air to vary the device temperature during calibration. Additionally, non-active components of the device can be provided current to vary the temperature of the device in concert with the provided compressed air. Additional calibration temperatures can be implemented by activating and deactivating additional non-active components in the device, such as light sources, optical amplifiers, and modulators.

A test system for a memory card includes a first circuit board. One side of the first circuit board is provided with a plurality of contact groups spaced apart from each other along a row direction. Another side of the first circuit board is provided with slots disposed along the row direction. The test system further includes a second circuit board. The second circuit board is provided with a test circuit, and is inserted into the slot along a direction perpendicular to the first circuit board. The second circuit board provides a test signal to the contact groups.

In some embodiments, an apparatus includes an automatic integrated circuit (IC) handler having a change kit. The change kit has a plunger moveably disposable onto an automatic test equipment (ATE). In such embodiments, the ATE is configured to receive an integrated circuit having an optical interface. The plunger has a first position and a second position. In such embodiments, the plunger is out of contact with the integrated circuit when the plunger is in the first position. The plunger includes an optical connector operatively coupled to the optical interface of the integrated circuit when the plunger is in the second position.

A control method of a touch display apparatus applicable to a probe station is provided. The probe station includes a movable element. The movable element is a chuck stage, a camera stage, a probe platen, or a positioner. The control method of a touch display apparatus includes displaying a first window and a second window on a touch display apparatus; displaying an operation interface on the first window and displaying a real-time image on the second window; and detecting a touch instruction generated on the operation interface, where the movable element moves according to the touch instruction.

Methods and systems for an all-optical wafer acceptance test may include an optical transceiver on a chip, the optical transceiver comprising first, second, and third grating couplers, an interferometer comprising first and second phase modulators, a splitter, and a plurality of photodiodes. A first input optical signal may be received in the chip via the first grating coupler, where the first input optical signal may be coupled to the interferometer. An output optical signal may be coupled out of the chip via the second grating coupler for a first measurement of the interferometer. A second input optical signal may be coupled to a third grating coupler and a portion of the second input optical signal may be communicated to each of the plurality of photodiodes via the splitter. A voltage may be generated using the photodiodes based on the second input signal that may bias the first phase modulator.