An optical testing circuit on a wafer includes an optical input configured to receive an optical test signal and photodetectors configured to generate corresponding electrical signals in response to optical processing of the optical test signal through the optical testing circuit. The electrical signals are simultaneously sensed by a probe circuit and then processed. In one process, test data from the electrical signals is simultaneously generated at each step of a sweep in wavelength of the optical test signal and output in response to a step change. In another process, the electrical signals are sequentially selected and the sweep in wavelength of the optical test signal is performed for each selected electrical signal to generate the test data.

Methods and systems for an all-optical wafer acceptance test may include an optical transceiver on a chip, the optical transceiver comprising first, second, and third grating couplers, an interferometer comprising first and second phase modulators, a splitter, and a plurality of photodiodes. A first input optical signal may be received in the chip via the first grating coupler, where the first input optical signal may be coupled to the interferometer. An output optical signal may be coupled out of the chip via the second grating coupler for a first measurement of the interferometer. A second input optical signal may be coupled to a third grating coupler and a portion of the second input optical signal may be communicated to each of the plurality of photodiodes via the splitter. A voltage may be generated using the photodiodes based on the second input signal that may bias the first phase modulator.

An optical testing circuit on a wafer includes an optical input configured to receive an optical test signal and photodetectors configured to generate corresponding electrical signals in response to optical processing of the optical test signal through the optical testing circuit. The electrical signals are simultaneously sensed by a probe circuit and then processed. In one process, test data from the electrical signals is simultaneously generated at each step of a sweep in wavelength of the optical test signal and output in response to a step change. In another process, the electrical signals are sequentially selected and the sweep in wavelength of the optical test signal is performed for each selected electrical signal to generate the test data.

Systems and methods for detecting programmed defects on a water during inspection of the wafer are provided. One method includes selecting a mode of an inspection subsystem for detecting programmed defects on a wafer that generates output for the wafer having the lowest non-defect signal and at least a minimum signal for the programmed defects. The method also includes selecting a training care area that is mutually exclusive of care area(s) used for detecting the programmed defects during inspection of the wafer. The training care area generates less of the non-defect signal than the care area(s). The method further includes training a programmed defect detection method using the output generated with the selected mode in the training care area and detecting the programmed defects during the inspection of the wafer by applying the trained programmed defect detection method to the output generated in the care area(s) with the selected mode.

There is provided a semiconductor wafer suitable for the inspection of an operation state.

A wafer is a semiconductor wafer having a plurality of chip forming regions, and includes a memory cell that is formed in each of the chip forming regions and an inspection device that is formed outside each of the chip forming regions. The inspection device has a photodiode that receives an input of pump light for checking an operation of the memory cell and outputs an electrical signal corresponding to the pump light and a signal processing circuit that generates a logic signal based on the electrical signal output from the photodiode and outputs the logic signal to the memory cell.

An automated optical inspection (AOI) equipment with adjustable image capturing combination and an image capturing combination adjusting method thereof are provided. The automated optical inspection equipment includes at least one image capturing apparatus, at least one moveable light source and a device-under-test (DUT) movement mechanism. A control circuit moves DUT, selects one light source, and controls the light source to move or rotate. The control circuit is capable of performing the capturing operation by switching multiple image capturing combinations sequentially. Each of the image capturing combinations records the image capturing apparatus, the position and angle of the DUT, the light source and its position and angle relative to DUT. The positions or angles of capturing combinations are different.

Accordingly, a large number of the image capturing results can be obtained for the DUT quickly and automatically.

A method for automated scan chain diagnostics includes comparing actual emission signatures for individual design elements to expected emission signatures, the individual design elements having pixels allocated thereto associated with an image of a device registered to a design layout, and determining whether the actual emission signatures differ from the expected emission signatures by more than a threshold amount to determine if a defect is present.

A method for automated scan chain diagnostics includes segmenting an image of a device associated with a design layout to allocate pixels to individual design elements, comparing actual emission signatures for the individual design elements to expected emission signatures, and determining whether the actual emission signatures differ from the expected emission signatures by more than a threshold amount to determine if a defect is present.

A method of detecting a condition of a light source includes adhering an adhesive tape platform in a vicinity of the light source; detecting light emitted from the light source that is incident to a light sensor of the adhesive tape platform; in response to the detecting light, determining that the light source is functioning correctly; and transmitting a report indicating that the light source is functioning to another node of an associated Internet of Things (IOT) system.

A photonic testing device includes a substrate, an optical device under test (DUT) disposed over the substrate, and an optical input circuit disposed over the substrate. The optical input circuit includes a first plurality of inputs each configured to transmit a respective optical test signal of a plurality of optical test signals. Each of the plurality of optical test signals includes a respective dominant wavelength of a plurality of dominant wavelengths. The optical input circuit further includes an output coupled to an input waveguide of the optical DUT. The output is configured to transmit a combined optical test signal comprising the plurality of optical test signals.