Patent classifications
G01R31/3173
SYSTEM AND METHOD FOR PARALLEL TESTING OF ELECTRONIC DEVICE
Circuits and methods for testing voltage monitor circuits are provided. In one embodiment, a method includes setting voltage monitor circuits to test mode; setting, a monitor reference in each voltage monitor circuit, to a respective targeted threshold voltage using a corresponding trim code; ramping, a voltage provided to a subset of voltage monitor circuits, from a first voltage to a second voltage using a test voltage supply, voltages between the first voltage and the second voltage corresponding with targeted threshold voltages of the subset of voltage monitor circuits; determining, for each voltage monitor circuit in the subset of voltage monitor circuits, a voltage value of the test voltage supply resulting in a change in a logic state at an output of a corresponding voltage monitor circuit.
SYSTEM AND METHOD FOR PARALLEL TESTING OF ELECTRONIC DEVICE
Circuits and methods for testing voltage monitor circuits are provided. In one embodiment, a method includes setting voltage monitor circuits to test mode; setting, a monitor reference in each voltage monitor circuit, to a respective targeted threshold voltage using a corresponding trim code; ramping, a voltage provided to a subset of voltage monitor circuits, from a first voltage to a second voltage using a test voltage supply, voltages between the first voltage and the second voltage corresponding with targeted threshold voltages of the subset of voltage monitor circuits; determining, for each voltage monitor circuit in the subset of voltage monitor circuits, a voltage value of the test voltage supply resulting in a change in a logic state at an output of a corresponding voltage monitor circuit.
DIE-TO-DIE CONNECTIVITY MONITORING
An input/output (I/O) sensor for a multi-IC module. The I/O sensor includes: delay circuitry, configured to receive a data signal from an interconnected part of an IC of the multi-IC module and to generate a delayed data signal, the delay circuitry including an adjustable delay-line configured to delay an input signal by a set time duration; a comparison circuit, configured to generate a comparison signal by comparing the data signal with the delayed data signal; and processing logic, configured to set the time duration of the adjustable delay-line and, based on the comparison signal, identify a margin measurement of the data signal for determining an interconnect quality parameter.
DIE-TO-DIE CONNECTIVITY MONITORING
An input/output (I/O) sensor for a multi-IC module. The I/O sensor includes: delay circuitry, configured to receive a data signal from an interconnected part of an IC of the multi-IC module and to generate a delayed data signal, the delay circuitry including an adjustable delay-line configured to delay an input signal by a set time duration; a comparison circuit, configured to generate a comparison signal by comparing the data signal with the delayed data signal; and processing logic, configured to set the time duration of the adjustable delay-line and, based on the comparison signal, identify a margin measurement of the data signal for determining an interconnect quality parameter.
Die-to-die connectivity monitoring
An input/output (I/O) sensor for a multi-IC module. The I/O sensor includes: delay circuitry, configured to receive a data signal from an interconnected part of an IC of the multi-IC module and to generate a delayed data signal, the delay circuitry including an adjustable delay-line configured to delay an input signal by a set time duration; a comparison circuit, configured to generate a comparison signal by comparing the data signal with the delayed data signal; and processing logic, configured to set the time duration of the adjustable delay-line and, based on the comparison signal, identify a margin measurement of the data signal for determining an interconnect quality parameter.
Die-to-die connectivity monitoring
An input/output (I/O) sensor for a multi-IC module. The I/O sensor includes: delay circuitry, configured to receive a data signal from an interconnected part of an IC of the multi-IC module and to generate a delayed data signal, the delay circuitry including an adjustable delay-line configured to delay an input signal by a set time duration; a comparison circuit, configured to generate a comparison signal by comparing the data signal with the delayed data signal; and processing logic, configured to set the time duration of the adjustable delay-line and, based on the comparison signal, identify a margin measurement of the data signal for determining an interconnect quality parameter.
DIE-TO-DIE CONNECTIVITY MONITORING
An input/output (I/O) sensor for a multi-IC module. The I/O sensor includes: delay circuitry, configured to receive a data signal from an interconnected part of an IC of the multi-IC module and to generate a delayed data signal, the delay circuitry including an adjustable delay-line configured to delay an input signal by a set time duration; a comparison circuit, configured to generate a comparison signal by comparing the data signal with the delayed data signal; and processing logic, configured to set the time duration of the adjustable delay-line and, based on the comparison signal, identify a margin measurement of the data signal for determining an interconnect quality parameter.
DIE-TO-DIE CONNECTIVITY MONITORING
An input/output (I/O) sensor for a multi-IC module. The I/O sensor includes: delay circuitry, configured to receive a data signal from an interconnected part of an IC of the multi-IC module and to generate a delayed data signal, the delay circuitry including an adjustable delay-line configured to delay an input signal by a set time duration; a comparison circuit, configured to generate a comparison signal by comparing the data signal with the delayed data signal; and processing logic, configured to set the time duration of the adjustable delay-line and, based on the comparison signal, identify a margin measurement of the data signal for determining an interconnect quality parameter.
APPLICATIONS OF ADAPTIVE MICROELECTRONIC CIRCUITS THAT ARE DESIGNED FOR TESTABILITY
The performance of a microelectronic circuit can be configured by making an operating parameter assume an operating parameter value. An operating method comprises selectively setting the microelectronic circuit into a test mode that differs from a normal operating mode of the microelectronic circuit, and utilizing said test mode to input test input signals consisting of test input values into one or more adaptive processing paths within the microelectronic circuit. An adaptive processing path comprises processing logic and register circuits configured to produce output values from input values input to them. The performance of such an adaptive processing path can be configured by making an operating parameter assume an operating parameter value. The method comprises making said one or more adaptive processing paths form test output values on the basis of the respective test input values input to them, and forming a set of test output signals by collecting said test output values given by said one or more adaptive processing paths. The method comprises examining said set of test output signals, and forming a test result on the basis of said examining, and using said test result to select and set an operating parameter value for said operating parameter.
APPLICATIONS OF ADAPTIVE MICROELECTRONIC CIRCUITS THAT ARE DESIGNED FOR TESTABILITY
The performance of a microelectronic circuit can be configured by making an operating parameter assume an operating parameter value. An operating method comprises selectively setting the microelectronic circuit into a test mode that differs from a normal operating mode of the microelectronic circuit, and utilizing said test mode to input test input signals consisting of test input values into one or more adaptive processing paths within the microelectronic circuit. An adaptive processing path comprises processing logic and register circuits configured to produce output values from input values input to them. The performance of such an adaptive processing path can be configured by making an operating parameter assume an operating parameter value. The method comprises making said one or more adaptive processing paths form test output values on the basis of the respective test input values input to them, and forming a set of test output signals by collecting said test output values given by said one or more adaptive processing paths. The method comprises examining said set of test output signals, and forming a test result on the basis of said examining, and using said test result to select and set an operating parameter value for said operating parameter.