The disclosure describes a novel method and apparatus for improving the operation of a TAP architecture in a device through the use of Command signal inputs to the TAP architecture. In response to a Command signal input, the TAP architecture can perform streamlined and uninterrupted Update, Capture and Shift operation cycles to a target circuit in the device or streamlined and uninterrupted capture and shift operation cycles to a target circuit in the device. The Command signals can be input to the TAP architecture via the devices dedicated TMS or TDI inputs or via a separate CMD input to the device.

Described herein are integrated circuit chips having test circuitry designed such that independently selectable testing of different power domains using a same scan chain compressor-decompressor circuit may be performed. Also disclosed herein are integrated circuit chips having test circuitry designed such that independently selectable testing of different power domains using multiple different scan chain compressor-decompressor circuits may be performed.

Described herein are integrated circuit chips having test circuitry designed such that independently selectable testing of different power domains using a same scan chain compressor-decompressor circuit may be performed. Also disclosed herein are integrated circuit chips having test circuitry designed such that independently selectable testing of different power domains using multiple different scan chain compressor-decompressor circuits may be performed.

Testing of an electrical device is achieved by providing a test access mechanism within the device that can receive scan frames from an external tester. The received scan frames contain stimulus data to be applied to circuitry within the device to be tested, a command for enabling a test control operation, and a frame marker bit to indicate the end of the scan frame pattern. The inputting of scan frames can occur continuously and simultaneous with a commanded test control operation.

Testing of an electrical device is achieved by providing a test access mechanism within the device that can receive scan frames from an external tester. The received scan frames contain stimulus data to be applied to circuitry within the device to be tested, a command for enabling a test control operation, and a frame marker bit to indicate the end of the scan frame pattern. The inputting of scan frames can occur continuously and simultaneous with a commanded test control operation.

This application discloses a computing system implementing an automatic test pattern generation tool to convert a transistor-level model of a library cell describing a digital circuit into a switch-level model of the library cell, generate test patterns configured to enable detection of target defects injected into the switch-level model of the library cell, and bifurcate the test patterns into a first subset of the test patterns and a second set of the test patterns based on detection types for the target defects enabled by the test patterns. The computing system can implement a cell model generation tool to perform an analog simulation of the transistor-level model of the library cell using the second subset of the test patterns to verify that they enable detection of target defects, while skipping performance of the analog simulation of the transistor-level model of the library cell using the first subset of the test patterns.

This application discloses a computing system implementing an automatic test pattern generation tool to convert a transistor-level model of a library cell describing a digital circuit into a switch-level model of the library cell, generate test patterns configured to enable detection of target defects injected into the switch-level model of the library cell, and bifurcate the test patterns into a first subset of the test patterns and a second set of the test patterns based on detection types for the target defects enabled by the test patterns. The computing system can implement a cell model generation tool to perform an analog simulation of the transistor-level model of the library cell using the second subset of the test patterns to verify that they enable detection of target defects, while skipping performance of the analog simulation of the transistor-level model of the library cell using the first subset of the test patterns.

A system includes a test access port (TAP) configured to provide internal joint test action group (IJTAG) access to one or more test data registry (TDR). The system further includes a plurality of hierarchical electronic components, wherein each hierarchical electronic component includes a de-asserted segment inserted bit (D-SIB) register, an asserted segment inserted bit (A-SIB) register, and a TDR associated with the D-SIB register. Each D-SIB register is configured to prevent access to its associated TDR when a reset signal is asserted and each A-SIB register is configured to provide access to its subsequent A-SIB register or D-SIB register coupled thereto when the reset signal is asserted.

A system includes a test access port (TAP) configured to provide internal joint test action group (IJTAG) access to one or more test data registry (TDR). The system further includes a plurality of hierarchical electronic components, wherein each hierarchical electronic component includes a de-asserted segment inserted bit (D-SIB) register, an asserted segment inserted bit (A-SIB) register, and a TDR associated with the D-SIB register. Each D-SIB register is configured to prevent access to its associated TDR when a reset signal is asserted and each A-SIB register is configured to provide access to its subsequent A-SIB register or D-SIB register coupled thereto when the reset signal is asserted.

Methods for detecting a glitch at a high sampling rate are provided. In some embodiments, a method includes the following steps: S1, acquiring to-be-identified data; S2, processing the to-be-identified data to obtain normal sampling data; and S3, performing glitch identification on the to-be-identified data to obtain a glitch position of the normal sampling data. In other embodiments, the disclosure provides a system for detecting a glitch at a high sampling rate and for implementing the method for detecting a glitch at a high sampling rate. The system includes an acquisition unit and a glitch identification unit. The acquisition unit acquires and processes the to-be-identified data to obtain the normal sampling data, and the glitch identification unit performs glitch identification on the to-be-identified data to obtain the glitch position of the normal sampling data.