Patent classifications
G01R31/3177
Self-contained built-in self-test circuit with phase-shifting abilities for high-speed receivers
Aspects of the invention include a phase rotator, that is located at a built-in self-test (BIST) path of a receiver, receiving a clock signal from an on-chip clock. The phase rotator shifts the phases of the clock signal. The phase rotator transmits the shifted clock signal to a binary sequence generator, that is located at the receiver. The binary sequence generator outputs a binary sequence, where the binary sequence generator is driven by the shifted clock signal.
Method and apparatus for contemporary test time reduction for JTAG
A method of loading a data string into a Joint Test Action Group (JTAG) shift register is provided. The method includes determining whether the last bit of the data string is equal to one or zero. In response to determining that the last bit is equal to one, the method includes simultaneously setting each flip-flop of the shift register to one, identifying first data string loading bits by removing, from the data string, the last bit and any other bits in a continuous sequence of bits, including the last bit, that are each equal to one, and sequentially loading the identified first data string loading bits into the shift register. A testing apparatus for performing the method and an enhanced JTAG interface are also provided. The method, testing apparatus, and enchanced JTAG interface may reduce the number of clock cycles required to load the shift register.
Method and apparatus for contemporary test time reduction for JTAG
A method of loading a data string into a Joint Test Action Group (JTAG) shift register is provided. The method includes determining whether the last bit of the data string is equal to one or zero. In response to determining that the last bit is equal to one, the method includes simultaneously setting each flip-flop of the shift register to one, identifying first data string loading bits by removing, from the data string, the last bit and any other bits in a continuous sequence of bits, including the last bit, that are each equal to one, and sequentially loading the identified first data string loading bits into the shift register. A testing apparatus for performing the method and an enhanced JTAG interface are also provided. The method, testing apparatus, and enchanced JTAG interface may reduce the number of clock cycles required to load the shift register.
WAFER SCALE TESTING USING A 2 SIGNAL JTAG INTERFACE
Testing of die on wafer is achieved by; (1) providing a tester with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, (2) providing die on wafer with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuity, and (3) providing a connectivity mechanism between the bidirectional transceiver circuitry's of the tester and a selected group or all of the die on wafer for communication of the JTAG signals.
WAFER SCALE TESTING USING A 2 SIGNAL JTAG INTERFACE
Testing of die on wafer is achieved by; (1) providing a tester with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, (2) providing die on wafer with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuity, and (3) providing a connectivity mechanism between the bidirectional transceiver circuitry's of the tester and a selected group or all of the die on wafer for communication of the JTAG signals.
3D TAP & SCAN PORT ARCHITECTURES
This disclosure describes die test architectures that can be implemented in a first, middle and last die of a die stack. The die test architectures are mainly the same, but for the exceptions mentioned in this disclosure.
3D TAP & SCAN PORT ARCHITECTURES
This disclosure describes die test architectures that can be implemented in a first, middle and last die of a die stack. The die test architectures are mainly the same, but for the exceptions mentioned in this disclosure.
Apparatus for device access port selection
The disclosure describes a novel method and apparatuses for allowing a controller to select and access different types of access ports in a device. The selecting and accessing of the access ports is achieved using only the dedicated TDI, TMS, TCK, and TDO signal terminals of the device. The selecting and accessing of device access ports can be achieved when a single device is connected to the controller, when multiple devices are placed in a daisy-chain arrangement and connected to the controller, or when multiple devices are placed in a addressable parallel arrangement and connected to the controller. Additional embodiments are also provided and described in the disclosure.
Apparatus for device access port selection
The disclosure describes a novel method and apparatuses for allowing a controller to select and access different types of access ports in a device. The selecting and accessing of the access ports is achieved using only the dedicated TDI, TMS, TCK, and TDO signal terminals of the device. The selecting and accessing of device access ports can be achieved when a single device is connected to the controller, when multiple devices are placed in a daisy-chain arrangement and connected to the controller, or when multiple devices are placed in a addressable parallel arrangement and connected to the controller. Additional embodiments are also provided and described in the disclosure.
SCAN ARCHITECTURE FOR INTERCONNECT TESTING IN 3D INTEGRATED CIRCUITS
In one embodiment, a device comprises: a first die having disposed thereon a first plurality of latches wherein ones of the first plurality of latches are operatively connected to an adjacent one of the first plurality of latches; and a second die having disposed thereon a second plurality of latches wherein ones of the second plurality of latches are operatively connected to an adjacent one of the second plurality of latches. Each latch of the first plurality of latches on said first die corresponds to a latch in the second plurality of latches on said second die. Each set of corresponding latches are operatively connected. A scan path comprises a closed loop comprising each of said first and second plurality of latches. One of the second plurality of latches is operatively connected to another one of the second plurality of latches via an inverter.