In one embodiment, a device comprises: a first die having disposed thereon a first plurality of latches wherein ones of the first plurality of latches are operatively connected to an adjacent one of the first plurality of latches; and a second die having disposed thereon a second plurality of latches wherein ones of the second plurality of latches are operatively connected to an adjacent one of the second plurality of latches. Each latch of the first plurality of latches on said first die corresponds to a latch in the second plurality of latches on said second die. Each set of corresponding latches are operatively connected. A scan path comprises a closed loop comprising each of said first and second plurality of latches. One of the second plurality of latches is operatively connected to another one of the second plurality of latches via an inverter.

Circuits, systems, and methods are described herein for increasing a hold time of a master-slave flip-flop. A flip-flop includes circuitry configured to receive a scan input signal and generate a delayed scan input signal; a master latch configured to receive a data signal and the delayed scan input signal; and a slave latch coupled to the master latch, the master latch selectively providing one of the data signal or the delayed scan input signal to the slave latch based on a scan enable signal received by the master latch.

Circuits, systems, and methods are described herein for increasing a hold time of a master-slave flip-flop. A flip-flop includes circuitry configured to receive a scan input signal and generate a delayed scan input signal; a master latch configured to receive a data signal and the delayed scan input signal; and a slave latch coupled to the master latch, the master latch selectively providing one of the data signal or the delayed scan input signal to the slave latch based on a scan enable signal received by the master latch.

A method for testing a stacked integrated circuit device comprising a first die and a second die, the method comprising: sending from testing logic of the first die, first testing control signals to first testing apparatus on the first die; in response to the first testing control signals, the first testing apparatus running a first one or more tests for testing functional logic or memory of the first die; sending from the testing logic of the first die, second testing control signals to the second die via through silicon vias formed in a substrate of the first die; and in dependence upon the second testing control signals from the first die, running a second one or more tests for testing the stacked integrated circuit device.

A method for testing a stacked integrated circuit device comprising a first die and a second die, the method comprising: sending from testing logic of the first die, first testing control signals to first testing apparatus on the first die; in response to the first testing control signals, the first testing apparatus running a first one or more tests for testing functional logic or memory of the first die; sending from the testing logic of the first die, second testing control signals to the second die via through silicon vias formed in a substrate of the first die; and in dependence upon the second testing control signals from the first die, running a second one or more tests for testing the stacked integrated circuit device.

Described herein are systems, methods, and other techniques for identifying redundant parameters and reducing parameters for testing a device. A set of test values and limits for a set of parameters are received. A set of simulated test values for the set of parameters are determined based on one or more probabilistic representations for the set of parameters. The one or more probabilistic representations are constructed based on the set of test values. A set of cumulative probabilities of passing for the set of parameters are calculated based on the set of simulated test values and the limits. A reduced set of parameters are determined from the set of parameters based on the set of cumulative probabilities of passing. The reduced set of parameters are deployed for testing the device.

Described herein are systems, methods, and other techniques for identifying redundant parameters and reducing parameters for testing a device. A set of test values and limits for a set of parameters are received. A set of simulated test values for the set of parameters are determined based on one or more probabilistic representations for the set of parameters. The one or more probabilistic representations are constructed based on the set of test values. A set of cumulative probabilities of passing for the set of parameters are calculated based on the set of simulated test values and the limits. A reduced set of parameters are determined from the set of parameters based on the set of cumulative probabilities of passing. The reduced set of parameters are deployed for testing the device.

Techniques for debugging a circuit including a global counter configured to continuously increment, a comparator configured to transmit a clock stop signal based on a comparison of a comparator value and a counter value of the global counter, and clock stop circuitry configured to receive the clock stop signal and stop a clock signal to one or more portions of the electronic device.

Techniques for debugging a circuit including a global counter configured to continuously increment, a comparator configured to transmit a clock stop signal based on a comparison of a comparator value and a counter value of the global counter, and clock stop circuitry configured to receive the clock stop signal and stop a clock signal to one or more portions of the electronic device.

A field programmable gate array (FPGA) for improving the reliability of a key configuration bitstream by reusing a buffer memory includes a configuration buffer, a configuration memory and a control circuit. The configuration memory includes N configuration blocks. The FPGA stores a key configuration chain by using the configuration buffer and ensures correct content of the key configuration chain through an error correcting code (ECC) check function of the configuration buffer, so that when the FPGA runs normally, a control circuit reads the key configuration chain in the configuration buffer at an interval of a predetermined time and writes the key configuration chain into a corresponding configuration block to update the key configuration chain, thereby ensuring accuracy of the content of the key configuration chain and improving running reliability of the FPGA.