Semiconductor devices that include test circuitry to measure internal signal wire propagation delays during memory access operations, and circuity configured to store delay information that is used to configure internal delays based on the measured internal signal propagation circuit delays. The semiconductor device includes a test circuit configured to measure a signal propagation delay between a command decoder and a bank logic circuit based on time between receipt of a test command signal directly from the command decoder and a time of receipt of the test command signal routed through the bank logic circuit.

Semiconductor devices that include test circuitry to measure internal signal wire propagation delays during memory access operations, and circuity configured to store delay information that is used to configure internal delays based on the measured internal signal propagation circuit delays. The semiconductor device includes a test circuit configured to measure a signal propagation delay between a command decoder and a bank logic circuit based on time between receipt of a test command signal directly from the command decoder and a time of receipt of the test command signal routed through the bank logic circuit.

An integrated circuit device may include core circuitry, and a set of external interface buffer circuits coupled to the core circuitry. To improve test time and accuracy, as well as to simplify test procedures during voltage testing of the set of external interface buffer circuits, the integrated circuit device may include a test circuit and a combinational logic circuit coupled to the set of external interface buffer circuits. The combinational logic circuit is configured to combine a logic level of each of the external interface buffer circuits into a test signal, and the test circuit is configured to execute a voltage test on the set of external interface buffer circuits based on a logic level of the test signal.

An integrated circuit device may include core circuitry, and a set of external interface buffer circuits coupled to the core circuitry. To improve test time and accuracy, as well as to simplify test procedures during voltage testing of the set of external interface buffer circuits, the integrated circuit device may include a test circuit and a combinational logic circuit coupled to the set of external interface buffer circuits. The combinational logic circuit is configured to combine a logic level of each of the external interface buffer circuits into a test signal, and the test circuit is configured to execute a voltage test on the set of external interface buffer circuits based on a logic level of the test signal.

A device test architecture and interface is provided to enable efficient testing embedded cores within devices. The test architecture interfaces to standard IEEE 1500 core test wrappers and provides high test data bandwidth to the wrappers from an external tester. The test architecture includes compare circuits that allow for comparison of test response data to be performed within the device. The test architecture further includes a memory for storing the results of the test response comparisons. The test architecture includes a programmable test controller to allow for various test control operations by simply inputting an instruction to the programmable test controller from the external tester. The test architecture includes a selector circuit for selecting a core for testing. Additional features and embodiments of the device test architectures are also disclosed.

A device test architecture and interface is provided to enable efficient testing embedded cores within devices. The test architecture interfaces to standard IEEE 1500 core test wrappers and provides high test data bandwidth to the wrappers from an external tester. The test architecture includes compare circuits that allow for comparison of test response data to be performed within the device. The test architecture further includes a memory for storing the results of the test response comparisons. The test architecture includes a programmable test controller to allow for various test control operations by simply inputting an instruction to the programmable test controller from the external tester. The test architecture includes a selector circuit for selecting a core for testing. Additional features and embodiments of the device test architectures are also disclosed.

An input device including an input circuit with an input connection point for applying an input signal and with an input signal path which leads from the input connection point to an evaluation input and on which a conversion of the input signal into an evaluation signal is effected, an evaluation device which includes the evaluation input and which is designed to recognise an input signal level of the input signal on the basis of the evaluation signal, wherein the evaluation device is further designed to carry out a functionality test of the input device and within the framework of the functionality test by way of providing a test signal to effect a first change of the evaluation signal and to test the functionality of the input device on the basis of the effected first change of the evaluation signal, wherein the input circuit includes a transistor which is connected into the input signal path, and the input circuit is designed to control a control terminal of the transistor on the basis of the test signal, in order to effect the first change of the evaluation signal.

An input device including an input circuit with an input connection point for applying an input signal and with an input signal path which leads from the input connection point to an evaluation input and on which a conversion of the input signal into an evaluation signal is effected, an evaluation device which includes the evaluation input and which is designed to recognise an input signal level of the input signal on the basis of the evaluation signal, wherein the evaluation device is further designed to carry out a functionality test of the input device and within the framework of the functionality test by way of providing a test signal to effect a first change of the evaluation signal and to test the functionality of the input device on the basis of the effected first change of the evaluation signal, wherein the input circuit includes a transistor which is connected into the input signal path, and the input circuit is designed to control a control terminal of the transistor on the basis of the test signal, in order to effect the first change of the evaluation signal.

A memory array of a compute tile may store activations or weights of a DNN. The memory array may include databanks for storing contexts, context MUXs, and byte MUXs. A databank may store a context with flip-flop arrays, each of which includes a sequence of flip-flops. A logic gate and an ICG unit may gate flip-flops and control whether states of the flip-flops can be changed. The data gating can prevent a context not selected for the databank from inadvertently toggling and wasting power A context MUX may read a context from different flip-flop arrays in a databank based on gray-coded addresses. A byte MUX can combine bits from different bytes in a context read by the context MUX. The memory array may be implemented with bit packing to reduce distance between the context MUX and byte MUX to reduce lengths of wires connecting the context MUXs and byte MUXs.

A memory array of a compute tile may store activations or weights of a DNN. The memory array may include databanks for storing contexts, context MUXs, and byte MUXs. A databank may store a context with flip-flop arrays, each of which includes a sequence of flip-flops. A logic gate and an ICG unit may gate flip-flops and control whether states of the flip-flops can be changed. The data gating can prevent a context not selected for the databank from inadvertently toggling and wasting power A context MUX may read a context from different flip-flop arrays in a databank based on gray-coded addresses. A byte MUX can combine bits from different bytes in a context read by the context MUX. The memory array may be implemented with bit packing to reduce distance between the context MUX and byte MUX to reduce lengths of wires connecting the context MUXs and byte MUXs.