G01R31/67

Method and system for detecting miswiring of a power supply for a domestic appliance

A system for detecting miswiring in an AC power supply for an appliance may comprise a phase sensor sensing the phase difference between the first and a second hot line powering heavy electrical loads therebetween, and a control module coupling to the phase and voltage sensors. The control module may identify a fault condition and may disconnect different electrical loads from the power supply in the fault condition.

Method and system for detecting miswiring of a power supply for a domestic appliance

A system for detecting miswiring in an AC power supply for an appliance may comprise a phase sensor sensing the phase difference between the first and a second hot line powering heavy electrical loads therebetween, and a control module coupling to the phase and voltage sensors. The control module may identify a fault condition and may disconnect different electrical loads from the power supply in the fault condition.

Heater status monitor

An appliance having a heater connectable to a power source to create a heater circuit is disclosed. The appliance includes a controller and a heater switch configured to be selectively closed in response to a control signal from the controller to complete the heater circuit and enable current to flow from the power source to the electric heater. The appliance further includes a heater feedback circuit comprising a plurality of resistors and configured to be connected to the power source and further configured to generate an output signal to the controller having a first state indicative of no current leakage from the heater circuit, a second state indicative of current leakage from the heater circuit where the polarity of the power source is normal, and a third state indicative of current leakage from the heater circuit where the polarity of the power source is reversed. The controller may determine whether current leakage exists in the heater circuit, regardless of the polarity of the grid lines from the power source. The controller may take various actions in response to such determination.

Heater status monitor

An appliance having a heater connectable to a power source to create a heater circuit is disclosed. The appliance includes a controller and a heater switch configured to be selectively closed in response to a control signal from the controller to complete the heater circuit and enable current to flow from the power source to the electric heater. The appliance further includes a heater feedback circuit comprising a plurality of resistors and configured to be connected to the power source and further configured to generate an output signal to the controller having a first state indicative of no current leakage from the heater circuit, a second state indicative of current leakage from the heater circuit where the polarity of the power source is normal, and a third state indicative of current leakage from the heater circuit where the polarity of the power source is reversed. The controller may determine whether current leakage exists in the heater circuit, regardless of the polarity of the grid lines from the power source. The controller may take various actions in response to such determination.

COUPLING CAPACITANCE ESTIMATION METHOD, METHOD FOR IDENTIFYING CORRESPONDING ENDS OF MULTICORE CABLE, COUPLING CAPACITANCE ESTIMATION DEVICE, AND METHOD FOR MANUFACTURING MULTICORE CABLE ASSEMBLY
20220317207 · 2022-10-06 ·

A coupling capacitance estimation method includes arranging numerous input electrodes to respectively face first exposed end portions of numerous insulated wires exposed at one end of a multicore cable, arranging numerous output electrodes to respectively face second exposed end portions of the numerous insulated wires exposed at another end of the multicore cable, performing measurement of a voltage value of a measurement output signal that is output by capacitive coupling from the second exposed end portion through the output electrode when a measurement input signal is input by capacitive coupling from the input electrode to the first exposed end portion, with a plurality of predetermined different combinations of the input electrodes to input the measurement input signal and the output electrodes to output the measurement output signal, and based on the measured voltage values of a plurality of the measurement output signals, estimating respective coupling capacitances between the numerous input electrodes and the numerous first exposed end portions facing each other and respective coupling capacitances between the numerous output electrodes and the numerous second exposed end portions facing each other.

COUPLING CAPACITANCE ESTIMATION METHOD, METHOD FOR IDENTIFYING CORRESPONDING ENDS OF MULTICORE CABLE, COUPLING CAPACITANCE ESTIMATION DEVICE, AND METHOD FOR MANUFACTURING MULTICORE CABLE ASSEMBLY
20220317207 · 2022-10-06 ·

A coupling capacitance estimation method includes arranging numerous input electrodes to respectively face first exposed end portions of numerous insulated wires exposed at one end of a multicore cable, arranging numerous output electrodes to respectively face second exposed end portions of the numerous insulated wires exposed at another end of the multicore cable, performing measurement of a voltage value of a measurement output signal that is output by capacitive coupling from the second exposed end portion through the output electrode when a measurement input signal is input by capacitive coupling from the input electrode to the first exposed end portion, with a plurality of predetermined different combinations of the input electrodes to input the measurement input signal and the output electrodes to output the measurement output signal, and based on the measured voltage values of a plurality of the measurement output signals, estimating respective coupling capacitances between the numerous input electrodes and the numerous first exposed end portions facing each other and respective coupling capacitances between the numerous output electrodes and the numerous second exposed end portions facing each other.

ELECTRONIC DEVICE

An electronic device includes a substrate, an electronic element, a transistor, a redistribution layer and a plurality of first bonding pads. The electronic element is disposed on the substrate. The transistor is electrically connected with the electronic element. The plurality of first bonding pads are disposed on the redistribution layer.

Test system for improving test stability

The disclosure relates to a test system for improving test stability. One end of the connection pin is fixed to a bottom surface of a corresponding pin socket, the bottom surface is near an end of the plug end, the other end of each connection pin is disposed in the corresponding pin socket and a portion of the other end of the connection pin protrudes from a top surface of an end of the plug end. The connection pin in the plug end will not be deformed by external force, which can avoid the deformation of the connection pin caused by external force, and ensure the electrical connection and test stability.

Test system for improving test stability

The disclosure relates to a test system for improving test stability. One end of the connection pin is fixed to a bottom surface of a corresponding pin socket, the bottom surface is near an end of the plug end, the other end of each connection pin is disposed in the corresponding pin socket and a portion of the other end of the connection pin protrudes from a top surface of an end of the plug end. The connection pin in the plug end will not be deformed by external force, which can avoid the deformation of the connection pin caused by external force, and ensure the electrical connection and test stability.

Method of manufacturing electronic device

A method of manufacturing an electronic device includes the following steps. A substrate is provided, and the substrate has a first surface, a second surface opposite to the first surface and a side surface between the first surface and the second surface. A first circuit is formed on the first surface. A second circuit is formed on the second surface. The first circuit is made to electrically connect with the second circuit. A testing signal is applied to the first circuit and received from the second circuit to verify the electrical connection between the first circuit and the second circuit.