A variety of applications can include systems and methods that include a memory system tester having an analyzer coupled to a test flow controller. The test flow controller can be arranged to generate test signals to a memory system with the analyzer arranged to couple to test pads of a package platform for the memory system. The analyzer can provide data to the test flow controller to conduct testing and/or debugging of the memory system, with the data based on real time monitoring of the test pads of the package platform. In various embodiments, the analyzer can provide data feedback to the test flow controller in real time such that the test flow controller can control the flow of test signals to the memory system in real time. Additional apparatus, systems, and methods are disclosed.

An integrated circuit chip is attached to a support that includes first conductive elements. First conductive pads are located on the integrated circuit chip and are electrically coupled to the first conductive elements by conductive wires. The integrated circuit chip further includes a conductive track. A switch circuit is provided to selectively electrically connect each first conductive pad to the conductive track. To test the conductive wires, a group of first conductive pads are connected by their respective switch circuits to the conductive track and current flow between corresponding first conductive elements is measured.

An ultrasonic testing device having a packaged semiconductor device as a testing target, the device including: an ultrasonic oscillator disposed to face the semiconductor device; a pulse generator generating a driving signal that is used in the generation of an ultrasonic wave to be output from the ultrasonic oscillator; and an analysis unit analyzing an output signal that is output from the semiconductor device in accordance with the irradiation of the ultrasonic wave from the ultrasonic oscillator, in which the pulse generator sets an optimal frequency of the driving signal such that the absorption of the ultrasonic wave in the semiconductor device is maximized.

An input/output (I/O) block for a semiconductor integrated circuit (IC), which includes: at least one I/O buffer, configured to define at least one signal path in respect of a connection to a remote I/O block via a communication channel, each signal path causing a respective signal edge slope; and an I/O sensor, coupled to the at least one signal path and configured to generate an output signal indicative of one or both of: (a) a timing difference between the signal edge for a first signal path and the signal edge for a second signal path, and (b) an eye pattern parameter for one or more of the at least one signal path.

A display device including a first substrate including a display area and a non-display area, a circuit film connected to the first substrate, a printed circuit board (PCB) connected to the circuit film, and a first inspection pad, a second inspection pad, and a third inspection pad located in the non-display area and a bridge configured to electrically connect the first inspection pad, the second inspection pad, and the third inspection pad. The circuit film includes a first line electrically connected to the first inspection pad, a second line electrically connected to the second inspection pad, a third line electrically connected to the third inspection pad, and a branch point configured to branch at least one line from the first line, the second line, and the third line into two sub-lines. The PCB includes a test pad unit connected to the first line, the second line, and the third line.

A display device including a first substrate including a display area and a non-display area, a circuit film connected to the first substrate, a printed circuit board (PCB) connected to the circuit film, and a first inspection pad, a second inspection pad, and a third inspection pad located in the non-display area and a bridge configured to electrically connect the first inspection pad, the second inspection pad, and the third inspection pad. The circuit film includes a first line electrically connected to the first inspection pad, a second line electrically connected to the second inspection pad, a third line electrically connected to the third inspection pad, and a branch point configured to branch at least one line from the first line, the second line, and the third line into two sub-lines. The PCB includes a test pad unit connected to the first line, the second line, and the third line.

An electronic apparatus includes a main circuit board, a seat body, a detachable element and a detection element. The seat body is disposed on the main circuit board and includes an opening and a conductive structure located in the opening. The detection element is disposed on the detachable element and includes an elastic conductive member. The elastic conductive member is adapted to extend into the opening, apply an elastic force to the seat body in the opening, and electrically contact the conductive structure. The main circuit board is adapted to determine that the seat body and the detection element are in a first state or a second state. The first state includes that the elastic conductive member electrically contacts the conductive structure. The second state includes that the elastic conductive member is separated from the conductive structure.

An electronic apparatus includes a main circuit board, a seat body, a detachable element and a detection element. The seat body is disposed on the main circuit board and includes an opening and a conductive structure located in the opening. The detection element is disposed on the detachable element and includes an elastic conductive member. The elastic conductive member is adapted to extend into the opening, apply an elastic force to the seat body in the opening, and electrically contact the conductive structure. The main circuit board is adapted to determine that the seat body and the detection element are in a first state or a second state. The first state includes that the elastic conductive member electrically contacts the conductive structure. The second state includes that the elastic conductive member is separated from the conductive structure.

An input/output (I/O) block for a semiconductor integrated circuit (IC), which includes: at least one I/O buffer, configured to define at least one signal path in respect of a connection to a remote I/O block via a communication channel, each signal path causing a respective signal edge slope; and an I/O sensor, coupled to the at least one signal path and configured to generate an output signal indicative of one or both of: (a) a timing difference between the signal edge for a first signal path and the signal edge for a second signal path, and (b) an eye pattern parameter for one or more of the at least one signal path.

A variety of applications can include systems and methods that include a memory system tester having an analyzer coupled to a test flow controller. The test flow controller can be arranged to generate test signals to a memory system with the analyzer arranged to couple to test pads of a package platform for the memory system. The analyzer can provide data to the test flow controller to conduct testing and/or debugging of the memory system, with the data based on real time monitoring of the test pads of the package platform. In various embodiments, the analyzer can provide data feedback to the test flow controller in real time such that the test flow controller can control the flow of test signals to the memory system in real time. Additional apparatus, systems, and methods are disclosed.