A system and method for testing a tractor trailer is disclosed. The system includes a housing having connections for establishing an electrical and pressure connection to the electrical system and ABS of a tractor trailer, respectively, a circuit board that generates electrical signals and pressure signals corresponding to the connections, an electronic device for displaying the electrical signals and pressure signals, a wireless transceiver for transmitting the electrical signals and pressure signals to the electronic device, and a memory for storing the transmitted electrical signals and pressure signals. The method includes connecting the tractor trailer electrical system and ABS connections to the housing, powering on the tractor trailer, querying an electrical signal and/or pressure signal of the electrical system and ABS, wirelessly transmitting the electrical signal and/or pressure signal to an electronic device, and displaying the electrical signal and/or pressure signal on the electronic device.

A system and method for testing a tractor trailer is disclosed. The system includes a housing having connections for establishing an electrical and pressure connection to the electrical system and ABS of a tractor trailer, respectively, a circuit board that generates electrical signals and pressure signals corresponding to the connections, an electronic device for displaying the electrical signals and pressure signals, a wireless transceiver for transmitting the electrical signals and pressure signals to the electronic device, and a memory for storing the transmitted electrical signals and pressure signals. The method includes connecting the tractor trailer electrical system and ABS connections to the housing, powering on the tractor trailer, querying an electrical signal and/or pressure signal of the electrical system and ABS, wirelessly transmitting the electrical signal and/or pressure signal to an electronic device, and displaying the electrical signal and/or pressure signal on the electronic device.

The disclosure relates to a test system for improving test stability. One end of the connection pin is fixed to a bottom surface of a corresponding pin socket, the bottom surface is near an end of the plug end, the other end of each connection pin is disposed in the corresponding pin socket and a portion of the other end of the connection pin protrudes from a top surface of an end of the plug end. The connection pin in the plug end will not be deformed by external force, which can avoid the deformation of the connection pin caused by external force, and ensure the electrical connection and test stability.

The disclosure relates to a test system for improving test stability. One end of the connection pin is fixed to a bottom surface of a corresponding pin socket, the bottom surface is near an end of the plug end, the other end of each connection pin is disposed in the corresponding pin socket and a portion of the other end of the connection pin protrudes from a top surface of an end of the plug end. The connection pin in the plug end will not be deformed by external force, which can avoid the deformation of the connection pin caused by external force, and ensure the electrical connection and test stability.

The invention: determines if the duration of the conducting state of the semiconductors in a first cycle of the pulse width modulation is upper than a predetermined duration, measures, during the conducting state of the semiconductors at a second cycle, the voltage provided to the load, sequentially disables the conduction of each semiconductor during a part of the duration of the conducting state of the semiconductors in a third cycle and measures the voltage provided to the load, determines the differences between the voltage measured during the second cycle and each voltage measured during the third cycle, orders the differences according to their value, checks if the determined order is identical to an order stored in a memory of the device and determines that one connection of one semiconductor is deteriorated if the order is changed.

An input/output (I/O) block for a semiconductor integrated circuit (IC), which includes: at least one I/O buffer, configured to define at least one signal path in respect of a connection to a remote I/O block via a communication channel, each signal path causing a respective signal edge slope; and an I/O sensor, coupled to the at least one signal path and configured to generate an output signal indicative of one or both of: (a) a timing difference between the signal edge for a first signal path and the signal edge for a second signal path, and (b) an eye pattern parameter for one or more of the at least one signal path.

A variety of applications can include systems and methods that include a memory system tester having an analyzer coupled to a test flow controller. The test flow controller can be arranged to generate test signals to a memory system with the analyzer arranged to couple to test pads of a package platform for the memory system. The analyzer can provide data to the test flow controller to conduct testing and/or debugging of the memory system, with the data based on real time monitoring of the test pads of the package platform. In various embodiments, the analyzer can provide data feedback to the test flow controller in real time such that the test flow controller can control the flow of test signals to the memory system in real time. Additional apparatus, systems, and methods are disclosed.

A sensor device is provided for testing electrical connections in a DUT using contactless fault detection. The sensor device includes main traces for conducting an RF signal supplied by a signal source; at least one inductor connected to at least one of the main traces; and a slit formed between opposing conductor portions at a tip of the sensor device for sensing open circuits and/or short circuits in portions of the DUT located in a sensing region below the slit, the tip being at an end of the sensor device opposite ends of the main traces connected to the signal source. An electric field, generated by the sensor device in response to the RF signal, substantially concentrates in the slit, enhancing the sensing of the open and/or the short circuits during the contactless fault detection.

A sensor device is provided for testing electrical connections in a DUT using contactless fault detection. The sensor device includes main traces for conducting an RF signal supplied by a signal source; at least one inductor connected to at least one of the main traces; and a slit formed between opposing conductor portions at a tip of the sensor device for sensing open circuits and/or short circuits in portions of the DUT located in a sensing region below the slit, the tip being at an end of the sensor device opposite ends of the main traces connected to the signal source. An electric field, generated by the sensor device in response to the RF signal, substantially concentrates in the slit, enhancing the sensing of the open and/or the short circuits during the contactless fault detection.

Disclosed are a fuse pad, a printed circuit board having the fuse pad, and a method of manufacturing the printed circuit board. The fuse pad includes a first pad provided at one side of a fuse, a second pad provided at an opposite side of the fuse, and a measurement pad electrically connected to the second pad to measure whether the fuse is detached.