G01S7/52079

INTERPOSER ELECTRICAL INTERCONNECT COUPLING METHODS, APPARATUSES, AND SYSTEMS
20230015499 · 2023-01-19 ·

Systems, methods, and apparatuses for coupling a flexible circuit to a printed circuit board (PCB) with an interposer in an ultrasound probe are disclosed. A bolster plate configured to compress the PCB, interposer, and flexible circuit against a transducer mount is disclosed. A method of coupling a bolster plate to a transducer mount with fasteners is disclosed. Fasteners that do not pass through the PCB, interposer, and flexible circuit are disclosed.

Under-display ultrasonic fingerprint sensors for foldable displays

An apparatus may include an ultrasonic sensor stack, a foldable display stack and a transmission enhancement layer. The foldable display stack may include a display stiffener and display stack layers. The display stack layers may form one or more display stack resonators configured to enhance ultrasonic waves transmitted by the ultrasonic sensor stack in a first ultrasonic frequency range. In some implementations, a transmission enhancement resonator may include the display stiffener and the transmission enhancement layer. In some examples, the transmission enhancement resonator may include at least a portion of the ultrasonic sensor stack. The transmission enhancement resonator may be configured to enhance the ultrasonic waves transmitted by the ultrasonic sensor stack in the first ultrasonic frequency range.

CONFIGURABLE ULTRASONIC IMAGER

An imaging device includes a two dimensional array of piezoelectric elements. Each piezoelectric element includes: a piezoelectric layer; a bottom electrode disposed on a bottom side of the piezoelectric layer and configured to receive a transmit signal during a transmit mode and develop an electrical charge during a receive mode; and a first top electrode disposed on a top side of the piezoelectric layer; and a first conductor, wherein the first top electrodes of a portion of the piezoelectric elements in a first column of the two dimensional array are electrically coupled to the first conductor.

Temperature insensitive backing structure for intraluminal imaging devices
11813116 · 2023-11-14 · ·

An imaging catheter assembly is provided. In one embodiment, the imaging catheter assembly includes a flexible elongate member including a distal portion and a proximal portion; and an imaging component coupled to the distal portion of the flexible elongate member, wherein the imaging component includes: an integrated circuit (IC) layer that includes a semiconductor material; an array of ultrasound transducer elements coupled to a first side of the IC layer; and a backing layer coupled to a second side of the IC layer opposite the first side, wherein the backing layer includes a backing material, and wherein a coefficient of thermal expansion (CTE) difference between the semiconductor material and the backing material is less than 23 parts per million per degree Centigrade (ppm/C).

Method for measuring an ultrasonic attenuation parameter guided by harmonic elastography, probe and device for the implementation of the method
11808898 · 2023-11-07 · ·

A method for measuring an ultrasonic attenuation parameter guided by harmonic elastography including applying, using a vibrator included in a probe in contact with a viscoelastic medium, of a continuous low frequency vibration, the continuous low frequency vibration generating an elastic wave within the viscoelastic medium and generating, during the propagation of the elastic wave, using an ultrasonic transducer in contact with the viscoelastic medium, a series of ultrasonic acquisitions, the series of ultrasonic acquisitions including groups of ultrasonic acquisitions, the groups of ultrasonic acquisitions being generated with a repetition rate, each group of ultrasonic acquisitions including at least one acquisition; the ultrasonic attenuation parameter being measured from the ultrasonic acquisitions realised during the application of the continuous low frequency vibration.

CONTACTLESS CMUT OPERATION
20230363735 · 2023-11-16 ·

Methods, systems, and techniques for the contactless operation of capacitive micromachined ultrasonic transducers (CMUTs) and CMUT arrays. Contactless operations refers to both the contactless transfer of energy and information between the transducer(s) and the controlling subsystem. A system includes a CMUT, a first alternating current voltage source, a first inductor electrically coupled to the first voltage source, and a second inductor electrically coupled to the CMUT. The second inductor is physically decoupled from, and positioned to be wirelessly coupled to, the first inductor. A contactless configuration is useful for a wide range of applications, from wearable transducers to high-end ultrasound imaging systems.

ULTRASOUND 3D IMAGING SYSTEM
20230346344 · 2023-11-02 ·

The present invention related to an ultrasound imaging system win which the scan head includes a beamformer circuit that performs far field subarray beamforming or includes a sparse array selecting circuit that actuates selected elements. When using a hierarchical two-stage or three-stage beamforming system, three dimensional ultrasound images can be generated in real-time. The invention further relates to flexible printed circuit boards in the probe head. The invention furthermore related to the use of coded or spread spectrum signaling in ultrasound imagining systems. Matched filters based on pulse compression using Golay code pairs improve the signal-to-noise ratio thus enabling third harmonic imaging with suppressed sidelobes. The system is suitable for 3D full volume cardiac imaging.

Method, system and terminal for wide-area acoustic indoor positioning based on RF enhancement

The present disclosure belongs to technical field of indoor positioning, and discloses a method and system for wide-area acoustic indoor positioning based on RF enhancement, comprising: design of an acoustic signal, using Blackman window function to control the amplitude of acoustic signal entering and leaving channel; a mixed multiple access transmission of the acoustic signal, combining three multiple access schemes of time, space and frequency, assisting a small amount of BLE signals, and constructing a wide-area coverage capability of the acoustic positioning signal; acoustic measurement based on RF enhancement, including TOA estimation of an acoustic signal and area identification based on low-power Bluetooth RSS; robust fusion positioning of an inertial sensor and multi-source measurement, including pedestrian walking speed estimation, multi-source heterogeneous measurement, acoustic measurement compensation and correction, measurement quality evaluation and control.

Thumb-dominant ultrasound imaging system
11828844 · 2023-11-28 · ·

Disclosed herein are portable ultrasound imaging systems for thumb-dominant operations comprising: a portable ultrasound probe, wherein the portable ultrasound probe is configured to be operable using a first hand of the user; a mobile device comprising a mobile application installed thereon, the mobile application comprising a user interface, the mobile application configured to be operable using a second hand of the user and; and direct electronic communication between the portable ultrasound probe and the mobile device, the direct electronic communication configured to allow a user to control an operation of the portable ultrasound probe for imaging via user interaction with the user interface.

Ultrasound imaging transducer array with integrated apodization

A transducer array (802) includes at least one 1D array of transducing elements (804). The at least one 1D array of transducing elements includes a plurality of transducing elements (904). A first of the plurality of transducing elements has a first apodization and a second of the plurality of transducing elements has a second apodization. The first apodization and the second apodization are different. The transducer array further includes at least one electrically conductive element (910) in electrical communication with each of the plurality of transducing elements. The transducer array further includes at least one electrical contact (906) in electrical communication with the at least one electrically conductive element. The at least one electrical contact concurrently addresses the plurality of transducing elements through the at least one electrically conductive element.