G01S7/52079

SURFACE TYPE DETECTION

A robotic cleaning appliance includes a housing, surface treatment item, surface type detection sensor, and processor. The sensor emits sonic signals toward a surface being traversed and receives corresponding returned signals from the surface. The returned signals are used for surface type detection and include directly reflected primary returned signals and multi-path reflected secondary returned signals which return at a later time than the primary returned signals. The processor selects a window of time after transmission of a sonic signal such that the returned signals in the window comprise at least a portion of the secondary returned signals, wherein the window is related to round trip time-of-flight of the returned signals; processes the returned signals falling in the window to achieve a reflectivity metric; compares the reflectivity metric to a stored value; and based on the comparison, determines which surface type of a plurality of surface types has been detected.

ULTRASOUND APPARATUSES AND METHODS FOR FABRICATING ULTRASOUND DEVICES

Aspects of the technology described herein relate to an ultrasound device including a first die that includes an ultrasonic transducer, a first application-specific integrated circuit (ASIC) that is bonded to the first die and includes a pulser, and a second ASIC in communication with the second ASIC that includes integrated digital receive circuitry. In some embodiments, the first ASIC may be bonded to the second ASIC and the second ASIC may include analog processing circuitry and an analog-to-digital converter. In such embodiments, the second ASIC may include a through-silicon via (TSV) facilitating communication between the first ASIC and the second ASIC. In some embodiments, SERDES circuitry facilitates communication between the first ASIC and the second ASIC and the first ASIC includes analog processing circuitry and an analog-to-digital converter. In some embodiments, the technology node of the first ASIC is different from the technology node of the second ASIC.

Ultrasound transducer tile registration

An ultrasound imaging system (1) comprises an ultrasound transducer array (100) comprising a plurality of ultrasound transducer tiles (101a-d), each of said tiles having an independently adjustable orientation such as to conform an ultrasound transmitting surface to a region of a body (50) including a foreign object such as a pacemaker, a stent, or an interventional tool (200). Using a known spatial arrangement of a plurality of features (201-204) of the foreign object (200), the respective ultrasound images generated by the ultrasound transducer tiles are registered in order to generate a composite image, in which the position and orientation of the foreign object in the individual images is superimposed. The position and orientation of an interventional tool may be determined for each image using object recognition algorithms or using acoustic feedback information provided by at least three ultrasound sensors (201-204) arranged in a known spatial arrangement on the interventional tool.

INTEGRATED ELECTROMAGNETIC-ACOUSTIC SENSOR AND SENSING

One illustrative integrated electromagnetic-acoustic sensor includes: a ground plane; a patch antenna above the ground plane to send or receive an electromagnetic (EM) signal having an EM signal frequency; and an array of capacitive micromachined acoustic transducers formed by cavities between the patch antenna and a base electrode to send or receive an acoustic signal having an acoustic signal frequency. One illustrative sensing method includes: driving or sensing a EM signal between a ground plane and a patch antenna; and driving or sensing an acoustic signal between the patch antenna and a base electrode, the base electrode and the patch antenna having an array of capacitive micromachined acoustic transducer cavities therebetween.

PORTABLE ULTRASOUND IMAGING SYSTEM WITH ACTIVE COOLING
20220244365 · 2022-08-04 ·

An ultrasound imaging system includes a thermally conductive frame and a number of electronic components and a display that are sealed within the frame. The frame further includes a plenum extending through the frame with surfaces that are thermally coupled to the electronic components and the display. An active cooling mechanism, such as one or more fans, moves air through the plenum to remove heat generated by the electronic components and display. The plenum is environmentally sealed so that moisture, dust, air or other contaminants drawn into the plenum do not contact the sealed electronic components and display in the frame.

Ultrasound transducers for constructive shear wave interference and related methods and systems
11406360 · 2022-08-09 · ·

A transducer array includes at least one annular shear wave generation transducer that defines an interior area, the at least one annular shear wave generation transducer being configured to generate a shear wave excitation to a region of interest such that the shear wave excitation excites at least a part of a corresponding cylindrical portion of the region of interest and shear waves propagating from the cylindrical portion of the region of interest constructively interfere in an interior region of the cylindrical portion of the region of interest: and at least one tracking transducer positioned in the interior area of the at least one annular shear wave generation transducer, the at least one tracking transducer being configured to detect a shear wave in the interior region of the region of interest.

Ultrasonic image system with synthesis of images of different ultrasonic waves received at respective positions of a probe
11382604 · 2022-07-12 · ·

An ultrasonic imaging system is provided which can obtain an accurate synthesized image, even if a specimen has a surface with a large curvature. An ultrasonic imaging system may include a probe and processing circuitry. The probe may perform scan of first and second ultrasonic waves different from each other. The processing circuitry may generate a first ultrasonic image based on the first ultrasonic wave and generate a second ultrasonic image based on the second ultrasonic wave. The processing circuitry may calculate a spatial relationship based on two first ultrasonic images at two positions and two second ultrasonic images at the two positions. The processing circuitry may synthesize one of the first and second ultrasonic images at one of the two positions with the one of the first and second ultrasonic images at the other position based on the calculated relationship.

Photoacoustic measurement device

Provided is a photoacoustic measurement device including: an ultrasound image generation unit that generates an ultrasound image on the basis of a detection signal of reflected ultrasonic waves generated by the transmission of ultrasonic waves; a puncture needle detection unit that detects a length direction of a puncture needle on the basis of the ultrasound image; and a controller that controls a steering direction of a sample gate which is a Doppler measurement target on the basis of the length direction of the puncture needle such that an angle θ formed between a straight line extending in the length direction of the puncture needle and a straight line extending in the steering direction of the sample gate satisfies 0°≤θ<90°.

Ultrasound apparatuses and methods for fabricating ultrasound devices

Aspects of the technology described herein relate to an ultrasound device including a first die that includes an ultrasonic transducer, a first application-specific integrated circuit (ASIC) that is bonded to the first die and includes a pulser, and a second ASIC in communication with the second ASIC that includes integrated digital receive circuitry. In some embodiments, the first ASIC may be bonded to the second ASIC and the second ASIC may include analog processing circuitry and an analog-to-digital converter. In such embodiments, the second ASIC may include a through-silicon via (TSV) facilitating communication between the first ASIC and the second ASIC. In some embodiments, SERDES circuitry facilitates communication between the first ASIC and the second ASIC and the first ASIC includes analog processing circuitry and an analog-to-digital converter. In some embodiments, the technology node of the first ASIC is different from the technology node of the second ASIC.

Ultrasound endoscope and ultrasound transducer with self-repairing acoustic lens
11406359 · 2022-08-09 · ·

An ultrasound transducer includes: a plurality of piezoelectric devices, each of the plurality of piezoelectric devices being configured to emit an ultrasonic wave according to an electrical signal input thereto, and convert an incident ultrasonic wave from an outside into an electrical signal; and an outer surface in which a material of a scanning surface transmitting and receiving an ultrasonic wave is constituted of a self-repairing material.