Acoustic imaging artifacts produced by imaging systems and devices can be reduced or eliminated by including a multisink medium in the systems or devices. The multisink material can be disposed between an acoustically reflective component of the imaging system or device and an ultrasound transducer of the imaging system or device. Inclusion of a multisink medium that is thermally conductive and acoustically non-conductive can reduce acoustic imaging artifacts while maintaining or improving heat management within imaging systems and devices.

An ultrasound device for use with various types of imaging. In some embodiments, the ultrasound device may comprise a circuitry substrate and a plurality of transducer chips coupled to the circuitry substrate. In some embodiments, each transducer chip may comprise a microelectromechanical systems (MEMS) component that may include a plurality of ultrasound elements closely packed with one another, an Application-Specific Integrated Circuit (ASIC) that may be operatively coupled to the plurality of ultrasound elements of said MEMS component, and a control unit that may be electrically coupled to each ASIC of the plurality of transducer chips for control thereof. In some embodiments, at least two transducer chips of the plurality of transducer chips may be placed on the circuitry substrate with a separation distance that may be less than an operational wavelength of the ultrasound elements of the MEMS components of said at least two transducer chips.

According to one embodiment, an ultrasonic diagnostic apparatus includes an ultrasonic probe and processing circuitry. The ultrasonic probe is configured to transmit and receive an ultrasonic wave. The processing circuitry is configured to acquire an optical image of a subject housed in a housing unit containing a medium. The processing circuitry is configured to estimate state information of the subject from the optical image. The processing circuitry is configured to set a scan condition of ultrasonic scanning for the subject based on the state information.

An ultrasonic probe including ultrasonic vibrators for transmitting ultrasound and a housing for encasing the ultrasonic vibrators. The ultrasonic probe includes a heat dissipation member encased in the housing in thermal connection with the ultrasonic vibrators and housing, and constructed separately from the housing, wherein the heat dissipation member has opposing surfaces and facing inner surfaces of the housing, the opposing surfaces being secured in close contact with the inner surfaces.

A transducer array includes at least one annular shear wave generation transducer that defines an interior area, the at least one annular shear wave generation transducer being configured to generate a shear wave excitation to a region of interest such that the shear wave excitation excites at least a part of a corresponding cylindrical portion of the region of interest and shear waves propagating from the cylindrical portion of the region of interest constructively interfere in an interior region of the cylindrical portion of the region of interest; and at least one tracking transducer positioned in the interior area of the at least one annular shear wave generation transducer, the at least one tracking transducer being configured to detect a shear wave in the interior region of the region of interest.

An apparatus may include an ultrasonic sensor stack, a foldable display stack and a transmission enhancement layer. The foldable display stack may include a display stiffener and display stack layers. The display stack layers may form one or more display stack resonators configured to enhance ultrasonic waves transmitted by the ultrasonic sensor stack in a first ultrasonic frequency range. In some implementations, a transmission enhancement resonator may include the display stiffener and the transmission enhancement layer. In some examples, the transmission enhancement resonator may include at least a portion of the ultrasonic sensor stack. The transmission enhancement resonator may be configured to enhance the ultrasonic waves transmitted by the ultrasonic sensor stack in the first ultrasonic frequency range.

The method of bonding an interposer and an integrated circuit chip includes preparing an interposer including an insulator and conductive lines each having one end exposed to a first surface of the insulator and another end exposed to a second surface opposite to the first surface; placing a bonding mask on the interposer; forming through-holes on the bonding mask before or after the placing of the bonding mask on the interposer; filling the plurality with a conductive material; and bonding an integrated circuit chip to the bonding mask.

An ultrasound system has a set of CMUT ultrasound transducer devices and a drive circuit for operating the ultrasound transducer devices, for delivering an AC drive signal and receiving a reflected signal. An intermediate circuit is between the drive circuit and the set of ultrasound devices in the form of an array of coupling circuits, each coupling circuit between the drive circuit and an associated at least one ultrasound transducer device. Each coupling circuit comprises a buffer element connected between a bias voltage and a device terminal and as series capacitor. The intermediate circuit serves as a connection link between the set of CMUT transducer elements and the driving/sensing electronics, and is formed as a passive integrated technology circuit. The buffer element prevents a low-impedance short between the CMUT cell bias node and the counter electrode in the case of a CMUT cell drum short circuit. In this way, failure of an individual cell will not cause a breakdown of the whole CMUT array nor a breakdown of the driving electronics.

An ultrasound imaging system includes a thermally conductive frame and a number of electronic components and a display that are sealed within the frame. The frame further includes a plenum extending through the frame with surfaces that are thermally coupled to the electronic components and the display. An active cooling mechanism, such as one or more fans, moves air through the plenum to remove heat generated by the electronic components and display. The plenum is environmentally sealed so that moisture, dust, air or other contaminants drawn into the plenum do not contact the sealed electronic components and display in the frame.

Apparatus, including an insertion tube, configured to be inserted into a body cavity and having a first lumen having a first lumen diameter and a distal opening, and a tubular channel, having a second lumen and an outer channel diameter smaller than the first lumen diameter, inserted into the first lumen. The apparatus includes a support structure, configured to be passed through a space between an inner wall of the insertion tube and an outer wall of the tubular channel to the distal opening in a folded state and to unfold, upon exit of the support structure through the distal opening, in a direction transverse to the first lumen to reach a support dimension that is greater than the first lumen diameter. A plurality of planar two-dimensional arrays of ultrasonic transducers are supported by the support structure, the arrays having transverse dimensions less than the first lumen diameter.