An imaging system (300) includes a transducer array (308) with a transducer element (310) with at least two faces (402, 904). Each face faces a different direction. The transducer element includes at least two sub-elements (404, 902). Each sub-element is part of a different face. The at least two sub-elements transmit respective beams at each location along a scan path (806).

An attachment for ultrasound probe, an ultrasound probe, an ultrasound inspecting apparatus, and an ultrasound inspecting method are provided. The attachment for ultrasound probe includes an acoustic matching element provided on a transceiver of an ultrasound probe and deformed based on a surface of an inspection target when the ultrasound probe scans the surface of the inspection target; a medium supplier provided near the acoustic matching element and configured to provide a medium between the inspection target and the acoustic matching element, based on the deformation of the acoustic matching element; and a body configured to fix the acoustic matching element and the medium supplier to the ultrasound probe.

An ultrasound probe of the present invention includes: a piezoelectric element configured to transmit and receive an ultrasonic wave; a casing that houses the piezoelectric element; and an acoustic medium liquid that fills a space between the piezoelectric element and the casing, and contains an aromatic compound or a substituted derivative thereof

An ultrasonic device includes a plurality of ultrasonic element arrays each of which is provided with a plurality of ultrasonic elements arranged in a first direction, in which the plurality of ultrasonic element arrays are disposed at positions which do not interfere with each other in the first direction, and are disposed at positions which are deviated relative to each other in a second direction intersecting the first direction.

Disclosed are systems, devices and methods for providing fingerprint sensors based on ultrasound imaging techniques in electronic devices and fabrication techniques for producing ultrasound-based fingerprint sensors. In some aspects, an ultrasound fingerprint sensor device includes an intermediate layer coupled to a base chip including an integrated circuit having conducive contacts at a surface of the base chip, the intermediate layer including an insulation layer formed on the base chip and a corresponding array of channeling electrode structures coupled to the conductive contacts and passing through the insulation layer, in which the channeling electrodes terminate at or above a top surface of the insulation layer to provide bottom electrodes; a plurality of ultrasonic transducer elements including an acoustic transducer material coupled to the bottom electrodes; and a plurality of top electrodes positioned on the ultrasonic transducer elements.

A flexible ultrasound transducer according to an embodiment of the present disclosure includes a substrate having a central part and a plurality of extended parts extending from the central part; an ultrasound probe disposed at the central part of the substrate to acquire an ultrasound image of a region of interest; and a focused ultrasound output unit disposed at the extended parts of the substrate to output a focused ultrasound to the region of interest, wherein the focused ultrasound output unit disposed at the extended parts of the substrate has a flexible property and is deformable. According to the structure of an embodiment, it is possible to simultaneously achieve ultrasound imaging and ultrasonic therapy such as lesion stimulation or removal through focused ultrasound, and adjust the focal position of focused ultrasound or improve the focal sensitivity through flexible movement.

In a method for receive beamforming using an array of ultrasonic transducers, a plurality of array positions comprising pluralities of ultrasonic transducers of the array of ultrasonic transducers is defined. A pixel capture operation is performed at each array position of the plurality of array positions. The pixel capture operation includes transmitting ultrasonic signals using a transmit beam pattern comprising ultrasonic transducers of the array of ultrasonic transducers, the transmit beam pattern for forming an ultrasonic beam toward a region of interest, and receiving reflected ultrasonic signals using a receive beam pattern comprising at least one ultrasonic transducer of the array of ultrasonic transducers. Received reflected ultrasonic signals are combined for a plurality of array positions overlapping the region of interest in a receive beamforming operation to generate a pixel for a reference array position of the plurality of array positions.

An ultrasonic device includes: an element substrate including an ultrasonic transducer and a first connection electrode connected to the ultrasonic transducer; a reinforcing plate that is bonded to the element substrate to reinforce the element substrate; and a second connection electrode provided on the reinforcing plate. The first and second connection electrodes are connected to each other in a bonding portion between the element substrate and the reinforcing plate.

An ultrasonic sensor includes: a substrate in which an opening is formed; a vibration film that is provided on the substrate so as to close the opening; a plurality of vibration elements that are disposed at positions where the vibration film and the opening overlap each other in a plan view along a thickness direction of the vibration film; a sealing plate that is disposed so as to face the vibration film, supports the vibration film, and has a surface facing the vibration film as a flat surface; and a suppressing portion that is provided between the adjacent vibration elements in the plan view, is bonded to both the vibration film and the sealing plate, and is formed of a resin material for suppressing transmission of vibration of the vibration film.

An ultrasonic element includes an element substrate including a first surface, a second surface having a front-back relation with the first surface, an opening section piercing through the element substrate from the first surface to the second surface, and a partition wall section surrounding the opening section, a supporting film provided on the first surface of the element substrate to cover the opening section and including a third surface facing the opening section and a fourth surface having a front-back relation with the third surface, a piezoelectric element provided on the fourth surface of the supporting film and disposed in a region overlapping the opening section of the supporting film in a plan view from a film thickness direction extending from the third surface to the fourth surface, a sealing plate provided to be opposed to the fourth surface of the supporting film and joined to the supporting film by an adhesive member via a beam section projecting toward the supporting film, and a wall section provided on the fourth surface of the supporting film and provided to project toward the sealing plate between the beam section and the piezoelectric element.