A semiconductor device may include a plurality of single-photon avalanche diodes. The single-photon avalanche diodes may be arranged in microcells. Each microcell may be a split microcell with first and second independent microcell segments. Each microcell segment in the split microcell may have a respective single-photon avalanche diode that is coupled to an output line. The single-photon avalanche diode of each microcell segment may also be coupled to a respective resistor that is used to quench avalanches in the single-photon avalanche diode. Splitting the microcell may reduce the recovery time of each microcell. The segments of the split microcell may be positioned close together, even if susceptible to optical crosstalk. Intra-microcell isolation structures may be formed between the microcell segments. Inter-microcell isolation structures may be formed around a perimeter of the split microcell. The intra-microcell and inter-microcell isolation structures may be different.

A radiation detector has reflection materials that segment a scintillator array to respective areas, a first accumulator 41, which adds multiple signals amplified by amplifiers 30 in the area segmented by the reflection materials, per area segmented by the reflection materials, a first trigger generation circuit 42, that generates a trigger of the signals added by the first accumulator, per area segmented by the reflection materials. When the signals are added, the superimposition of the inherent noises of each amplifier 30 can be reduced as much as the area segmented by the reflection materials, so that the signal noise can be reduced by increasing the S/N (signal/noise) ratio. The signals (timing signals) are respectively and separately generated based on each trigger in the different area to each other and converged by the encoder 50, so that probability of pileup (multiple pileups) can be reduced and an accurate timing signal can be obtained.

A digital radiographic detector includes redundant bonding pads formed on the array substrate and electrically connected to the array of photosensors. A plurality of COFs are each electrically connected to one of the bonding pads. A repair may be performed by removing a bond pad and reconnecting a corresponding COF to a redundant bond pad. A PCB including array read out electronics is electrically connected to the plurality of COFs.

An imaging apparatus includes a plurality of pixels arranged in a matrix form, each pixel being configured to generate an electric signal, and each being configured such that the electric signal can be read out nondestructively, an output amplifier configured to sequentially output electric signals read out nondestructively from the plurality of pixels, and a control unit configured to, in a period when electric signals for one frame of image data are being read out nondestructively from the plurality of pixels, execute nondestructive readout processing a plurality of times for reading out electric signals nondestructively from pixels in a first row, and execute nondestructive readout processing a plurality of times for reading out electric signals nondestructively from pixels in a second row adjacent to the first row. In this case, the control unit resets the output amplifier in a period when the nondestructive readout processing is performed a plurality of times on the pixels of the first row.

A method and apparatus for estimating a parameter vector including a plurality of parameters of a detector response model of a photon-counting detector. The method includes calculating a modeled spectrum based on an input spectrum and an initial value of the plurality of parameters. For each detector, a difference between the normalized photon count of the measured spectrum and the normalized modeled spectrum is calculated. A root mean square error (RMSE) between the measured and modeled spectra is obtained by squaring the normalized difference and weighting the normalized difference by a weighting factor. The parameter vector is updated until an optimum RMSE value is achieved. Upon determining optimal values of the parameter vector, measured data that is obtained via a patient scan is corrected based on the optimal parameter vector.

There is provided an x-ray detector system including a photon-counting x-ray detector for detecting x-ray radiation from an x-ray source, and a coincidence detection system configured to determine and/or obtain information about the radiation incident on the x-ray detector based on information about the time of photon interactions in the x-ray detector and information about the location of the x-ray source in relation to the x-ray detector. There is also provide an x-ray imaging system including such an x-ray detector system, as well as a corresponding coincidence detection system and a corresponding method.

A digital x-ray detector has a non-metallic housing. A two dimensional array of photosensors enclosed by the housing is in electrical communication with an electrical circuit formed on an interior surface of the housing.

Among other things, one or more systems and/or techniques for calibrating a direct conversion detector array are provided. An electrical charge is generated on an interface of a photoconductor (e.g., amorphous selenium) of the detector array when there is a change in voltage that is applied to the photoconductor. Such a change in voltage may occur because the voltage that is supplied to the photoconductor by a power supply is changed. The changed voltage causes an electrical charge to be produced, or causes a change in the net charge density at an interface of the photoconductor, that is substantially similar to the electrical charge that may be produced when radiation impinges the detector array. In this way, calibrations of the detector array (e.g., the generation of a uniformity map, defect table, etc.) may be performed without the emission of radiation and onsite or outside of a factory setting.

A curved radiographic detector has electromagnetic radiation sensitive elements disposed in a two-dimensional array. A curved housing encloses the two-dimensional array of radiation sensitive elements and includes a layer of aligned carbon nanotubes on a surface thereof.

A detector slice circuit for a CT imaging system may include a plurality of sensors for detecting photons passing through an object and a first electronic component configured to determine an energy of photons detected by the plurality of sensors and generate photon count data, which may be a count of detected photons in one or more energy bins. The detector slice circuit may further include a second electronic component configured to receive the photon count data from the first electronic component and is clocked at a first clock rate; a local memory storage configured to receive the photon count data from the second electronic component at the first clock rate and to output the photon count data at a second clock rate.