A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits. The present invention applies to spectral filters, waveguides, fiber-optic mode-transformers, diffraction gratings, refractive lenses, diffractive lens/Fresnel zone plates, reflectors, and to combinations of elements and devices, including microelectromechanical systems (MEMS) and liquid crystal device (LCD) matrices for adaptive, tunable elements. Preparation of interfacial layer properties and attachment process embodiments are taught.

An image sensor may include high dynamic range imaging pixels having an inner sub-pixel surrounded by an outer sub-pixel. To steer light away from the inner sub-pixel and towards the outer sub-pixel, the high dynamic range imaging pixels may be covered by a toroidal microlens. To mitigate cross-talk caused by high-angled incident light, various microlens arrangements may be used. A toroidal microlens may have planar portions on its outer perimeter. A toroidal microlens may be covered by four additional microlenses, each additional microlens positioned in a respective corner of the pixel. Each pixel may be covered by four microlenses in a 22 arrangement, with an opening formed by the space between the four microlenses overlapping the inner sub-pixel.

A method for forming a micro-lens array is provided. According to the method, a substrate is provided, and a hard-mask layer is formed. A lithography process is performed on the hard-mask layer by a hard-mask to form a first pattern and a second pattern. Then, the first pattern and the second pattern are reflowed to form a first lens structure and a second lens structure respectively. The photomask includes a first pattern segment and a second pattern segment, and the second pattern segment includes a transparent region and an opaque region. An area of the transparent region of the second pattern segment is larger than 18% of an area of the second pattern segment.

Micro light-emitting diode display driver architectures and pixel structures are described. In an example, a driver circuit for a micro light emitting diode device includes a current mirror. A linearized transconductance amplifier is coupled to the current mirror. The linearized transconductance amplifier is to generate a pulse amplitude modulated current that is provided to a set of micro LEDs connected in parallel to provide fault tolerance architecture.

Described herein are embodiments of a diffractive optical element (23) such as a grism. In one embodiment, the diffractive optical element (23) includes an input surface (31) configured to receive an input optical signal (29), a diffractive surface (33) adapted to spatially disperse the input optical beam (29) into a dispersed signal and an output surface (35) configured to output the dispersed signal from the diffractive optical element. The input surface (31) and the diffractive surface (33) are non-parallel and the diffractive surface (33) is formed in situ by a photolithographic technique.

An image sensor and a method of manufacturing the image sensor are provided. The image sensor includes a block layer including an absorption layer and a transparent layer, a lens element located below the block layer, and a sensing element located to face the lens element.

The present invention provides an image sensor, a micro-lens array with different heights in a pixel size level in the image sensor, and a method for fabricating the micro-lens array with different heights in the pixel size level in the image sensor. The present invention uses three different optical masks to fabricate a micro-lens array with different heights in a pixel size level in an image sensor, and the micro-lens array with different heights in a pixel size level in the image sensor disclosed by the present invention is capable of providing the same depth of focus (or nearly the same depth of focus) for every photodiode in the image sensor with lower cost.

A method of fabricating three-dimensional (3D) structures comprises forming a patterned area in a handle wafer, and bonding a mold wafer over the patterned area to produce one or more sealed cavities having a first pressure in the handle wafer. The mold wafer is heated past its softening point at a second pressure different from the first pressure to create a differential pressure across the mold wafer over the sealed cavities. The mold wafer is then cooled to harden the mold wafer into one or more 3D shapes over the sealed cavities. One or more materials are deposited on an outer surface of the mold wafer over the 3D shapes to form a structure layer having 3D structures that conform to the hardened 3D shapes of the mold wafer. The 3D structures are then bonded to a device wafer, and the handle wafer is removed to expose the 3D structures.

To improve detection efficiency in a solid-state imaging element including a SPAD in which an electrode and wiring are placed in a central portion.

A solid-state imaging element includes a photodiode and a light collecting section. The photodiode includes a light receiving surface and an electrode placed on the light receiving surface, and that outputs an electrical signal in accordance with light incident on the light receiving surface in a state where a voltage exceeding a breakdown voltage is applied to the electrode. The light collecting section causes light from a subject to be collected in the light receiving surface other than a region where the electrode is placed.

The present invention describes methods and apparatuses for creating superposition shape images by superposed base and revealing layers of lenslet gratings. The superposition shape images form a message recognizable by a human observer or by an image acquisition and computing device such as a smartphone. The superposition shape images may be created by different superposition techniques ranging from 1D moir, 2D moir and level-line moir superposition techniques to lenticular image and phase shift superposition techniques. Moir superposition techniques enable creating superposition shape images at different apparent depth levels. Applications comprise the protection of documents and valuable articles against counterfeits, the creation of eye-catching advertisements as well as the decoration of buildings and exhibitions.