G02B3/0025

SEMICONDUCTOR LENS OPTIMIZATION OF FABRICATION

Embodiments comprise a system created through fabricating a lens array through which lasers are emitted. The lens array may be fabricated in the semiconductor substrate used for fabricating the lasers or may be a separate substrate of other transparent material that would be aligned to the lasers. In some embodiments, more lenses may be produced than will eventually be used by the lasers. The inner portion of the substrate may be formed with the lenses that will be used for emitting lasers, and the outer portion of the substrate may be formed with lenses that will not be used for emitting lasers—rather, through etching these additional lenses, the inner lenses may be created with a higher quality.

Method of manufacturing microlens array substrate, microlens array substrate, electro-optic device, and electronic
09746586 · 2017-08-29 · ·

A microlens array substrate includes a substrate. A plurality of first recesses are provided in a first area of a surface of the substrate. A plurality of second recesses are provided in a second area of the surface of the substrate. The second area is outside of the first area. A light transmission layer has a refractive index which is different from a refractive index of the substrate and is provided to cover the surface of the substrate and to bury the first recesses and the second recesses. Each of the first recesses has a first depth from a surface of the light transmission layer. Each of the second recesses has a second depth from the surface of the light transmission layer. The second depth is deeper than the first depth.

MICROLENS ARRAYS FOR PARALLEL MICROPATTERNING
20220266385 · 2022-08-25 ·

Disclosed herein are systems and methods for using microlens arrays for parallel micropatterning of features. In some embodiments, a system includes a laser that emits a laser beam, a beam homogenizer configured to shape the laser beam into a shaped laser beam having a beam profile, and a lenslet array. The beam homogenizer shapes the laser beam such that at least a portion of the beam profile is substantially uniform in power. The lenslets of the lenslet array have the same shape and each receive a respective portion of the shaped laser beam to output a plurality of laser sub-beams. The plurality of laser sub-beams can be directed toward one or more layers of material to generate or modify a plurality of features on the one or more layers in parallel.

LENS ARRAY SUBSTRATE, ELECTRO-OPTICAL DEVICE, ELECTRONIC APPARATUS, MICRO-LENS SUBSTRATE MANUFACTURING METHOD, AND ELECTRO-OPTICAL DEVICE MANUFACTURING METHOD
20170219744 · 2017-08-03 ·

An element substrate is formed as a lens array substrate on which a plurality of lenses are formed. In a method of manufacturing the lens array substrate, first recess sections are formed on one surface of the substrate, and then a plurality of lens surfaces, which include concave surfaces, are formed at the bottoms of the first recess sections 195. Subsequently, after a light-transmitting lens layer is formed to fill the inside of the first recess sections, flattening is performed while the lens layer is removed. Here, the surface of the lens layer on a side opposite to the substrate is a planar surface which is contiguous to an outside area that is positioned on the outer side of the first recess sections on the one surface of the substrate.

Microlens arrays for parallel micropatterning

Disclosed herein are systems and methods for using microlens arrays for parallel micropatterning of features. A method includes emitting a laser beam providing the laser beam to a lenslet array including a plurality of lenslets, and generating, from the laser beam, a plurality of laser sub-beams using the lenslet array. Each one of the plurality of laser sub-beams is generated by a corresponding one of the plurality of lenslets. Each lenslet of the plurality of lenslets has the same shape.

Micro-lens Structure, Displaying Device, and Machining Method of Micro-lens Structure

Disclosed are a micro-lens structure, a displaying device, and a machining method of the micro-lens structure. The micro-lens structure specifically comprises: micro-lens units distributed in an array, wherein each micro-lens unit comprises at least two micro-lenses made of a photoresist, and the at least two micro-lenses have different arch heights.

PERSONALIZED PLASTIC IDENTIFICATION DOCUMENT WITH LENS STRUCTURE
20230294445 · 2023-09-21 ·

A security feature on a personalized plastic identification document such as a personalized plastic card and a plastic page of passport. The security feature includes a lens structure with a plurality of lenses, where the lens structure is formed using a laser at a location on the personalized plastic identification document to facilitate viewing of a security feature underlying the lens structure.

Semiconductor lens optimization of fabrication

Embodiments comprise a system created through fabricating a lens array through which lasers are emitted. The lens array may be fabricated in the semiconductor substrate used for fabricating the lasers or may be a separate substrate of other transparent material that would be aligned to the lasers. In some embodiments, more lenses may be produced than will eventually be used by the lasers. The inner portion of the substrate may be formed with the lenses that will be used for emitting lasers, and the outer portion of the substrate may be formed with lenses that will not be used for emitting lasers—rather, through etching these additional lenses, the inner lenses may be created with a higher quality.

METHOD OF FORMING AMORPHOUS TITANIUM DIOXIDE THIN FILM USING LOW TEMPERATURE ATOMIC LAYER DEPOSITION METHOD AND METHOD OF FABRICATING OPTICAL STRUCTURE

Provided is a method of forming an amorphous titanium dioxide (TiO.sub.2) thin film on a substrate using a low temperature atomic layer deposition method, the method of forming an amorphous TiO.sub.2 thin film including supplying a titanium (Ti) precursor to the substrate provided in a process chamber to adsorb the Ti precursor on the substrate, forming a Ti precursor film on the substrate by exposing the Ti precursor to the substrate where the Ti precursor is not adsorbed, supplying an oxygen (O.sub.2) precursor to the Ti precursor film and reacting the O.sub.2 precursor with the Ti precursor film, and forming the TiO.sub.2 thin film on the substrate by exposing the O.sub.2 precursor to the Ti precursor film that has not reacted with the O.sub.2 precursor, and reacting the Ti precursor film with the O.sub.2 precursor.

Method for producing lens elements and packaged radiation-sensitive devices on wafer level

A production method includes fixing ball elements of a semiconductor material to a carrier substrate by means of heat and pressure; and one-sided thinning of the ball elements fixed to the carrier substrate to form plano-convex lens elements of a semiconductor material.