An optical waveguide formed at the same layer as that of a microscopic optical device and a spot size converter largely different in size are integrally formed. A semiconductor device has an optical waveguide part functioning as a spot size converter. The optical waveguide part includes a plurality of optical waveguide bodies penetrating through an interlayer insulation layer in the thickness direction.

The disclosure provides an optical waveguide, a manufacturing method of an optical waveguide, and a head-mounted display device. The optical waveguide has a first optical region and a second optical region for transmitting an image beam. The optical waveguide includes a plate body, multiple first light-guiding optical elements, and multiple optical microstructures. The first light-guiding optical elements are disposed in parallel lines on a light-guiding plane inside the plate body. The light-guiding plane is located in the first optical region, and there is a spacing between the adjacent first light-guiding optical elements. The image beam transmitted to the light-guiding plane is separated into multiple sub image beams, and the transmission paths of the sub image beams are at least partially different. The optical coupling-out structure is disposed in the plate body and is located in the second optical region.

An optical system includes a substrate and, being formed on the substrate, a reflective structure including a first inner reflection face with a parabolic profile, a second inner planar reflection face and a third inner planar reflection face, a photoelectric transducer including an active region configured to emit light waves or configured to receive light waves and positioned in the reflective structure, at a part of the foci, the material of the reflective structure being chosen to be transparent to the light waves, a waveguide arranged so that its longitudinal axis is parallel to the optical axes and its proximal end is adjoining the reflective structure between the second and third reflection faces and at the active region.

Systems and methods for compensating for nonuniform surface topography features in accordance with various embodiments of the invention are illustrated. One embodiment includes a method for manufacturing waveguide cells, the method including providing a waveguide including first and second substrates and a layer of optical recording material, and applying a surface forming process to at least one external surface of the first and second substrates. In another embodiment, applying the surface forming process includes applying a forming material coating to the at least one external surface, providing a forming element having a forming surface, bringing the forming element in physical contact with the forming material coating, curing the forming material coating while it is in contact with the forming element, and releasing the forming material coating from the forming element.

A sensor and methods of making a sensor are disclosed. The sensor may include a substrate including an opening, an optical source disposed in the substrate and configured to generate an optical source signal, an optical detector disposed in the substrate so that the opening is disposed between the optical source and the optical detector, a plurality of optical cavity structures disposed in the opening wherein each of the plurality of optical cavity structures contains an enclosed cavity so that the respective enclosed cavities are not in gas communication with each other, wherein the plurality of optical cavity structures are arranged in an optical path between the optical source and the optical detector, and a processing circuit coupled to the optical detector and configured to process an optical signal received by the optical detector.

A method includes providing a semiconductor wafer that includes at least one optical waveguide extending in a longitudinal direction. Stealth dicing laser processing is applied to the semiconductor wafer by producing defect regions into the wafer along at least one cutting line. The cutting line is oblique to the longitudinal direction of the at least one optical waveguide. The wafer is expanded to induce fracture thereof at the at least one cutting line, thereby producing an end surface of the at least one optical waveguide. The end surface is oblique to the longitudinal direction of the at least one optical waveguide.

A structure includes an integrated circuit chip in a substrate, and an I/O opening extending inwardly from an edge of the integrated circuit chip. A dielectric moisture barrier includes a first portion extending along a side of the I/O opening, a second portion extending along the edge of the integrated circuit chip, and a third portion coupling the first moisture barrier portion to the second moisture barrier portion to complete the moisture barrier between the edge of the integrated circuit chip and the I/O opening. The third portion is distanced from the corner of the integrated circuit chip where the I/O opening meets the edge of the chip to prevent damage to the moisture barrier from fabrication processes, such as chip dicing, chip handling or other processes. Various crack stop configurations are also provided to further protect the moisture barrier from damage.

A photonic diode includes a first meta-material structure having a first bar and a second meta-material structure having a second bar arranged in a direction perpendicular to the first bar. The first bar and the second bar are separated from each other. Further, the first bar and the second bar are at least partially overlapped when viewed from a light propagation direction.

Disclosed are structures and methods for active optic cable (AOC) assembly having improved thermal characteristics. In one embodiment, an AOC assembly includes a fiber optic cable having a first end attached to a connector with a thermal insert attached to the housing for dissipating heat from the connector. The AOC assembly can dissipate a suitable heat transfer rate from the active components of the connector such as dissipating a heat transfer rate of 0.75 Watts or greater from the connector. In one embodiment, the thermal insert is at least partially disposed under the boot of the connector. In another embodiment, at least one component of the connector has a plurality of fins. Other AOC assemblies may include a connector having a pull tab for dissipating heat from the assembly.

A surface machining device for a light guide plate is disclosed, including: a support 11; a driving component 12 mounted on the support 11; a push unit 13 driven by the driving component 12, configured to push the light guide plate 10 to a pre-set position; a positioning component 14 driven by the driving component 12, configured to position the light guide plate 10 at the pre-set position; a bearing component 15 mounted on the support 11, configured to bear the light guide plate 10; and a pressing component 16 driven by the driving component 12, configured to press the light guide plate 10 onto the bearing component 15. With such device, an ultrathin light guide plate 10 can be machined to form a microstructure on the surface of the light guide plate 10, with high productivity, and low cost.