This application provides a spoof surface plasmon polariton transmission line structure, a circuit board, and an electronic device, to reduce a size of the SSPP transmission line structure. The SSPP transmission line structure includes a first dielectric substrate, a first metal strip, and a second metal strip. The first metal strip and the second metal strip are respectively disposed on two opposite surfaces of the first dielectric substrate, the first metal strip and the second metal strip separately extend in a first direction, and a length of the first metal strip in the first direction is less than a length of the second metal strip in the first direction. In the first direction, a cross-sectional area of the first metal strip gradually decreases, and at least one side of the second metal strip has a plurality of protrusion parts spaced apart.

A metasurface optical device includes a substrate and a nano-structure layer disposed on the substrate. The nano-structure layer includes a plurality of composite nano units each including a plurality of nano-structure units arranged on the substrate. Arrangement periods of the plurality of composite nano units are not completely same, and arrangement periods of the plurality of nano-structure units in one composite nano unit of the plurality of composite nano units are not completely same.

Described herein are photonic integrated circuits (PICs) comprising a semiconductor optical amplifier (SOA) to output a signal comprising a plurality of wavelengths, a sensor to detect data associated with a power value of each wavelength of the output signal of the SOA, a filter to filter power values of one or more of the wavelengths of the output signal of the SOA, and control circuitry to control the filter to reduce a difference between a pre-determined power value of each filtered wavelength of the output signal of the SOA and the detected power value of each filtered wavelength of the output signal of the SOA.

A device, such as an electroabsorption modulator, can modulate a light intensity by controllably absorbing a selectable fraction of the light. The device can include a substrate. A waveguide positioned on the substrate can guide light. An active region positioned on the waveguide can receive guided light from the waveguide, absorb a fraction of the received light, and return a complementary fraction of the received light to the waveguide. Such absorption produces heat, mostly at an input portion of the active region. The input portion of the active region can be thermally coupled to the substrate, which can dissipate heat from the input portion, and can help avoid thermal runaway of the device. The active region can be thermally isolated from the substrate away from the input portion, which can maintain a relatively low thermal mass for the active region, and can increase efficiency when heating the active region.

A process for fabricating a heterostructure includes at least one elementary structure made of III-V material on the surface of a silicon-based substrate successively comprising: producing a first pattern having at least a first opening in a dielectric material on the surface of a first silicon-based substrate; a first operation for epitaxy of at least one III-V material so as to define at least one elementary base layer made of III-V material in the at least first opening; producing a second pattern in a dielectric material so as to define at least a second opening having an overlap with the elementary base layer; a second operation for epitaxy of at least one III-V material on the surface of at least the elementary base layer made of III-V material(s) so as to produce the at least elementary structure made of III-V material(s) having an outer face; an operation for transferring and assembling the at least photonic active elementary structure via its outer face, on an interface that may comprise passive elements and/or active elements, the interface being produced on the surface of a second silicon-based substrate; removing the first silicon-based substrate and the at least elementary base layer located on the elementary structure.

Described are various configurations of optical structures having asymmetric-width waveguides. A photodetector can include parallel waveguides that have different widths, which can be connected via passive waveguide. One or more light absorbing regions can be proximate to the waveguides to absorb light propagating through one or more of the parallel waveguides. Multiple photodetectors having asymmetric width waveguides can operate to transduce light in different modes in a polarization diversity optical receiver.

In an optical device, a first semiconductor layer and a second semiconductor layer are formed to be thinner than a core, an active layer has a shape with an end in a waveguide direction tapers toward a tip end, the first semiconductor layer having a trapezoidal shape with a width thereof decreases toward a side of a third semiconductor layer from a side of the core in a plan view and a width thereof decreases as one end in the waveguide direction recedes from a central portion of the active region, and the second semiconductor layer having a trapezoidal shape with a width thereof decreases toward a side of a fourth semiconductor layer from the side of the core in a plan view and a width thereof decreases as one end in the waveguide direction recedes from the central portion of the active region.

A light receiving device includes, on a substrate, a Si waveguide core provided in a dielectric layer, a first i-type waveguide clad, an i-type core layer, a second i-type waveguide clad, p-type layers disposed on one side of a side surface of a layered structure in a light waveguide direction, the layered structure including the first i-type waveguide clad, the i-type core layer, and the second i-type waveguide clad, n-type layers disposed on the other side, and an electrode on a surface of each of the n-type layers. A width of the Si waveguide core is set to be able to suppress absorption of light in a vicinity of an input edge of the i-type core layer.

The application concerns an optical device including: a primary fan-out waveguide; at least one secondary fan-out waveguide; a fan-out optical coupler for coupling a light beam between the primary fan-out waveguide and the secondary fan-out waveguide; and at least one bus waveguide associated with the at least one secondary fan-out waveguide and different from each secondary fan-out waveguide; wherein a reflecting and coupling structure connecting the secondary fan-out waveguide and the bus waveguide.

An embodiment device includes: a first dielectric layer; a first photonic die and a second photonic die disposed adjacent a first side of the first dielectric layer; a waveguide optically coupling the first photonic die to the second photonic die, the waveguide being disposed between the first dielectric layer and the first photonic die, and between the first dielectric layer and the second photonic die; a first integrated circuit die and a second integrated circuit die disposed adjacent the first side of the first dielectric layer; conductive features extending through the first dielectric layer and along a second side of the first dielectric layer, the conductive features electrically coupling the first photonic die to the first integrated circuit die, the conductive features electrically coupling the second photonic die to the second integrated circuit die; and a second dielectric layer disposed adjacent the second side of the first dielectric layer.