Embodiments of the present invention provide an optical structure, an optical coupling method, and a photonic integrated circuit chip. The optical structure includes: two optical coupling structures with different structures, that is, a first optical coupling structure and a second optical coupling structure. The first optical coupling structure includes a first optical transmission structure, and a first coupling port and a second coupling port both connected to the first optical transmission structure. The second optical coupling structure includes a second optical transmission structure, and a third coupling port and a photoelectric conversion structure both connected to the second optical transmission structure. When optical signals are provided in different methods or optical coupling is performed in different scenarios, optical signal coupling can be realized by using optical coupling structures of different structures in the abovementioned optical structure.

A method includes forming multiple photonic devices in a semiconductor wafer, forming a v-shaped groove in a first side of the semiconductor wafer, forming an opening extending through the semiconductor wafer, forming multiple conductive features within the opening, wherein the conductive features extend from the first side of the semiconductor wafer to a second side of the semiconductor wafer, forming a polymer material over the v-shaped groove, depositing a molding material within the opening, wherein the multiple conductive features are separated by the molding material, after depositing the molding material, removing the polymer material to expose the v-shaped groove, and placing an optical fiber within the v-shaped groove.

An optical connection component includes an optical fiber; a high relative refractive-index difference optical fiber that is fusion-spliced to the optical fiber and has a greater relative refractive-index difference to a cladding of a core than the optical fiber; and an accommodating member accommodating the entire length of the optical fiber and the high relative refractive-index difference optical fiber, and has a first end face on which an end face of the optical fiber on the side opposite to the fusion-spliced side is exposed to be substantially flush with the first end face, and a second end face on which an end face of the high relative refractive-index difference optical fiber on the side opposite to the fusion-spliced side is exposed to be substantially flush with the second end face. The optical fiber and the high relative refractive-index difference optical fiber are fixed to the accommodating member.

A system for passive alignment of fibers to an interface of a photonic integrated circuit (PIC) includes an input frame, an actuator, and an output frame. The actuator arranged to apply force along a force axis to the input frame. The output frame including a tip for picking up a plate and transferring the force thereto, the output frame being connected to the input frame such that the output frame may tilt relative to the input frame and the output frame is elastically biased relative to the input frame into a position wherein the tip is aligned on the force axis.

A system for passive alignment of fibers to an interface of a photonic integrated circuit (PIC) includes an input frame, an actuator, and an output frame. The actuator arranged to apply force along a force axis to the input frame. The output frame including a tip for picking up a plate and transferring the force thereto, the output frame being connected to the input frame such that the output frame may tilt relative to the input frame and the output frame is elastically biased relative to the input frame into a position wherein the tip is aligned on the force axis.

Disclosed are apparatus and methods for optical coupling. In one example, a described apparatus includes: a planar layer; a grating region comprising an array of scattering elements arranged in the planar layer to form a two-dimensional grating; a first taper structure formed in the planar layer connecting a first side of the grating region to a first waveguide, wherein a shape of the first taper structure is a first triangle that is asymmetric about any line perpendicular to the first side of the grating region in the planar layer; and a second taper structure formed in the planar layer connecting a second side of the grating region to a second waveguide, wherein a shape of the second taper structure is a second triangle that is asymmetric about any line perpendicular to the second side of the grating region in the planar layer, wherein the first side and the second side are substantially perpendicular to each other.

Embodiments are disclosed for providing a silicon photonics collimator for wafer level assembly. An example apparatus includes a silicon photonics (SiP) device and a micro-optical passive element. The SiP device comprises a set of optical waveguides. The micro-optical passive element is mounted on an edge of a cavity etched into a silicon surface of the SiP device. Furthermore, the micro-optical passive element is configured to direct optical signals between the set of optical waveguides and an external optical element.

An optoelectronic package structure and a method of manufacturing an optoelectronic package structure are provided. The optoelectronic package structure includes a photonic component. The photonic component has an electrical connection region, a blocking region and a region for accommodating a device. The blocking region is located between the electrical connection region and the region for accommodating a device.

An optical device has a first photonic waveguide provided on a substrate, a second photonic waveguide provided on the substrate and extending side by side with the first photonic waveguide, and a looped waveguide continuously connecting the first photonic waveguide and the second photonic waveguide on the substrate, wherein a width of at least one of the first photonic waveguide or the second photonic waveguide varies continuously along an optical axis, between a first position located at a side opposite to the looped waveguide and a second position connected to the looped waveguide, and wherein cross sections of the first photonic waveguide and the second photonic waveguide are congruent at the second position, and are incongruent at the first position.

A light receiving element enables light incidence from the upper surface of a light receiving element while realizing a structure in which the optical path length is extended, and as a result, facilitates optical mounting. A light receiving element in which a first semiconductor layer, a light absorbing layer composed of a semiconductor, a second semiconductor layer, a first electrode formed in contact with the first semiconductor layer, and a second electrode formed in contact with the second semiconductor layer and including a first reflective layer composed of a metal are formed on an upper surface of a substrate, wherein incident light is incident from the upper surface of the substrate, reflected by the bottom surface of the substrate, and then incident on the light absorbing layer obliquely to the vertical direction.