Provided are a small-sized optical coupling system and an optical communication device using the optical coupling system. An optical coupling system includes a liquid crystal optical element, and a photonic device having a plurality of photonic chips, and couples an optical fiber to the photonic device, in which each of the photonic chips includes a grating coupler, the liquid crystal optical element separates incident signal light depending on at least one of polarization or a wavelength to emit light in different directions, and each separated signal light component is incident into the grating coupler of the corresponding photonic chip.

A grating coupler integrated in a photonically-enabled circuit and a method for fabricating the same are disclosed herein. In some embodiments, the grating coupler includes a substrate comprising a silicon wafer, a first grating region etched into the substrate, wherein the first grating region comprises a first plurality of gratings having a first predetermined height, and a second grating region etched into the substrate, wherein the second grating region comprises a second plurality of gratings having a second predetermined height and wherein the first and second predetermined heights are not identical.

A grating coupler integrated in a photonically-enabled circuit and a method for fabricating the same are disclosed herein. In some embodiments, the grating coupler includes a substrate comprising a silicon wafer, a first grating region etched into the substrate, wherein the first grating region comprises a first plurality of gratings having a first predetermined height, and a second grating region etched into the substrate, wherein the second grating region comprises a second plurality of gratings having a second predetermined height and wherein the first and second predetermined heights are not identical.

A wavelength converter includes an optical waveguide substrate configured to include a plurality of optical waveguides formed with different design values, an incidence-side optical fiber from which signal light and excitation light are incident to the optical waveguide substrate, and an emission-side optical fiber to which light including converted light having a wavelength different from a wavelength of the signal light is extracted from the optical waveguide substrate, wherein the incidence-side optical fiber and the emission-side optical fiber are optically coupled to one optical waveguide among the plurality of optical waveguides.

A chip-scale transceiver includes an interposer having microspring electrical contacts disposed on the interposer substrate. At least one electronic chip and at least one optoelectronic chip are electrically coupled to the interposer through the microsprings. The electronic chip includes at least one of an amplifier array and a laser driver array. First electrical contact pads arranged to make electrical contact with the first microsprings of the interposer. The optoelectronic chip includes at least one of a laser array and a photodetector array. Second electrical contact pads arranged to make electrical contact with the second microsprings of the interposer are disposed on the optoelectronic chip substrate. The transceiver has an area less than or equal to 0.17 mm.sup.2 per Gbps.

An optical device that includes a multicore optical fiber having at least two cores. An alignment feature is attached at the first end of the first multicore optical fiber. The device also includes a substrate having at least two waveguides, each waveguide comprising a redirecting feature. A fiber holder is located on the substrate to hold the multicore fiber in a correct axially rotational orientation using the alignment feature, so that light couples between the cores of the multicore fiber and respective waveguides in the substrate.

Monolithic optical interconnect component components for surface mounting to photonic IC (PIC) chip assemblies. A protrusion or detent in solid body of the component comprises a contact alignment surface that stands off from a remainder of the solid body and is sloped to facilitate passive alignment of the component to a surface feature of the PIC chip. A face of the solid body may include an interference fitting to receive an MT ferrule connector. An optical interconnect component may include an array of optical elements and/or optical waveguides embedded within a solid body and extending between faces of the solid body. Once assembled, a multi-fiber push-on (MPO) connector may be inserted into the surface mounted interconnect component to optically couple a fiber cable to the PIC chip.

Monolithic optical interconnect component components for surface mounting to photonic IC (PIC) chip assemblies. A protrusion or detent in solid body of the component comprises a contact alignment surface that stands off from a remainder of the solid body and is sloped to facilitate passive alignment of the component to a surface feature of the PIC chip. A face of the solid body may include an interference fitting to receive an MT ferrule connector. An optical interconnect component may include an array of optical elements and/or optical waveguides embedded within a solid body and extending between faces of the solid body. Once assembled, a multi-fiber push-on (MPO) connector may be inserted into the surface mounted interconnect component to optically couple a fiber cable to the PIC chip.

An integrated optical device fabricated in the back end of line process located within the vertical span of the metal stack and having one or more advantages over a corresponding integrated optical device fabricated in the silicon on insulator layer.

An optoelectronic device includes a photonic component. The photonic component includes an active side, a second side different from the active side, and an optical channel extending from the active side to the second side of the photonic component. The optical channel includes a non-gaseous material configured to transmit light.