An optical assembly includes stacked first and second planar lightwave circuit (PLC) members each having a plurality of waveguides in respective first and second planes, to provide optical connections between a two-dimensional array and a one-dimensional array of external optical waveguides (e.g., optical fiber cores). Inner faces of first and second PLC members are arranged facing one another and with the first and second planes (corresponding to the pluralities of first and second waveguides, respectively) being non-parallel. An optical assembly may provide optical connections between arrays of cores having a different pitch to serve as a fanout interface. Methods for fabricating an optical assembly are further provided.

A method and system for an optical package assembly is disclosed. According to one example, the optical package assembly includes a photonic integrated circuit (PIC) chip, at least one fiber coupled to the PIC chip, a fiber lid plate disposed on at least a portion of the at least one fiber, and a cover plate having a surface coupled to the PIC chip and the fiber lid plate.

Semiconductor device includes light-emitting die and semiconductor package. Light emitting die includes substrate and first conductive pad. Substrate has emission region located at side surface. First conductive pad is located at bottom surface of substrate. Semiconductor package includes semiconductor-on-insulator substrate, interconnection structure, second conductive pad, and through semiconductor via. Semiconductor-on-insulator substrate has linear waveguide formed therein. Interconnection structure is disposed on semiconductor-on-insulator substrate. Edge coupler is embedded within interconnection structure and is connected to linear waveguide. Semiconductor-on-insulator substrate and interconnection structure include recess in which light-emitting die is disposed. Edge coupler is located close to sidewall of recess. Second conductive pad is located at bottom of recess. Through semiconductor via extends across semiconductor-on-insulator substrate to contact second conductive pad. First conductive pad is connected to through semiconductor via. Emission region directly faces sidewall of recess where edge coupler is located.

An object of the present invention is to provide a core position recognition method, a connection method, and a connection apparatus that can simplify connection operations, and reduce rotational displacement and positional displacement. The connection apparatus according to the present invention includes a function capable of acquiring the rotation amount of an MCF during the bonding/fixing step. Specifically, the connection apparatus of the present invention uses an MCF with lines drawn on a side surface thereof, thereby recognizing the rotation amount of the MCF from the side surface, and calculating the absolute positions of the cores. The connection apparatus according to the present invention can recognize the absolute position s of the cores from a side image of an MCF in a state in which the MCF has been rotated. By forming a waveguide on a glass substrate serving as a connection destination so as to match the absolute positions of the cores, the rotational and positional displacements of the MCF can be eliminated, thus making it possible to reduce the connection loss.

An example device comprises: a substrate comprising a waveguide material having a waveguide refractive index (RI.sub.WG); a first layer of oxide on the substrate having an RI.sub.1 lower than the RI.sub.WG; a waveguide on the first oxide layer, the waveguide comprising the waveguide material having the RI.sub.WG; a second oxide layer on the waveguide and the first oxide layer, the second oxide layer having a second RI.sub.2 higher than the RI.sub.1 and less than the RI.sub.WG, the first oxide layer, the waveguide and the second oxide layer forming an end face for light coupling, and the waveguide extending inwards from the end face and increasing in effective RI from the end face; and an index matching material on the second oxide layer that encapsulates at least the second oxide layer and the end face, a respective RI of the index matching material being about index matched to the RI.sub.1.

An optical adjustment apparatus includes a measurement-light irradiation part that has a plurality of second optical fibers and emits, with timings different from each other, a plurality of lights having a single wavelength via the second optical fibers, an optical fiber block that holds exit-side end portions of the first and second optical fibers, a light detection part that receives and detects a plurality of reflected lights via the second optical fibers, a tilt calculation part that compares, with each other, variations with time of intensities of the respective reflected lights and calculates a tilt of the optical fiber block relative to the optical substrate, and a distance calculation part that calculates an inter-end surface distance between the optical substrate and the optical fiber block, based on a variation with time of an intensity of at least one reflected light.

The invention relates to a single photon detector device for detecting an optical signal comprising an optical fiber and at least one nanowire, wherein the optical fiber comprises a core area and a cladding area and is designed to conduct the optical signal along an optical axis, wherein, with respect to the optical axis, a first area of the optical fiber is an entrance area for the optical signal and a second area of the optical fiber is a detector area, and wherein the nanowire becomes superconducting at a predetermined temperature and is designed in the superconducting state to generate an output signal as a function of the optical signal. It is provided that in the detector area of the optical fiber the nanowire extends essentially along the optical axis of the optical fiber. A single photon detector device is thus provided which has a simple structure, a high efficiency, a high detection rate and a high spectral bandwidth.

The invention described herein pertains to the structure and formation of dual core waveguide structures and to the formation of optical devices including spot size converters from these dual core waveguide structure for the receiving and routing of optical signals on substrates, interposers, and sub-mount assemblies.

The invention described herein pertains to the structure and formation of dual core waveguide structures and to the formation of optical devices including spot size converters from these dual core waveguide structure for the receiving and routing of optical signals on substrates, interposers, and sub-mount assemblies.

An electro-optical system, and method for making the electro-optical system. The electro-optical system includes a Photonic Integrated Circuit (PIC) having a laser source located on the PIC, a fiberless optical coupler located on the PIC. The fiberless optical coupler is configured to be coupled to a fiber array. The electro-optical system also includes an optical element, and a mechanical aligner. The optical element is aligned with the fiber array, via the mechanical aligner, for a light from the laser source to transmit in between the fiber array and the PIC through the optical element, when the fiberless optical coupler is coupled to the fiber array.