A recessed portion in a semiconductor substrate and a method of forming the same are provided. The method comprises: forming a mask on the semiconductor substrate; forming a protection layer on a top surface of the mask and on at least one sidewall of the mask, and on at least one surface of the semiconductor substrate exposed by the mask; performing a first etching process to remove the protection layer on the top surface of the mask and on a bottom surface of the semiconductor substrate exposed by the mask; and performing a second etching process to remove the remaining protection layer and to etch the semiconductor substrate to form the recessed portion. In this way, a recessed portion with relatively smooth and vertical sidewalls can be realized.

An optical interconnection assembly for the mutual connection of a plurality of signal switching circuit boards that may be coupled to a common planar support, backplane, includes a planar support frame, adapted to receive an ordered arrangement of connectors, which includes a series of first connectors arranged to face corresponding signal transmission ports of said boards, and a series of second connectors arranged to face corresponding signal reception ports of the boards. The support frame is adapted to guide the deployment of an interconnection circuit between corresponding pairs of first and second connectors. The interconnection circuit includes a plurality of arrangements of aggregated interconnection optical fibers extending along a longitudinal axis of the arrangement; and controlled deformation guide formations of the optical fiber arrangements, arranged to establish a plurality of non-intersecting coplanar paths of the optical fiber arrangements between corresponding pairs of first and second connectors.

An optical fiber guide structure includes a guide member that is configured to be erected on a connection end surface of an optical waveguide device and forms a space for accommodating a leading end portion of an optical fiber to be connected to the optical waveguide device. The guide member is formed of an elastically deformable material, and in a specific region a longitudinal direction of the guide member, and a diameter of an inscribed circle in contact with an inner wall of the guide member in a plane perpendicular to the longitudinal direction is smaller than an outer diameter of the optical fiber.

A recessed portion in a semiconductor substrate and a method of forming the same are provided. The method comprises: forming a mask on the semiconductor substrate; forming a protection layer on a top surface of the mask and on at least one sidewall of the mask, and on at least one surface of the semiconductor substrate exposed by the mask; performing a first etching process to remove the protection layer on the top surface of the mask and on a bottom surface of the semiconductor substrate exposed by the mask; and performing a second etching process to remove the remaining protection layer and to etch the semiconductor substrate to form the recessed portion. In this way, a recessed portion with relatively smooth and vertical sidewalls can be realized.

The present disclosure relates to a fiber management device or system for facilitating routing and storing optical fibers. The fiber management device includes a flexible, film-like substrate that has optical fiber management, storing functionality, and splicing functionality all on one film-like substrate. The flexible, film-like substrate can provide a routing path for routing optical fibers onto a flexible planar substrate that can be temporarily supported by, mounted on or attached to the flexible planar substrate. The flexible, film-like substrate can accommodate fibers that are in a multi-fiber (e.g., ribbon) configuration or a single fiber configuration.

Embodiments of the invention are directed a waveguide having a first waveguide segment that includes a set of first waveguide segment confinement parameters; a second waveguide segment having routing bends and a set of second waveguide segment confinement parameters; and a third waveguide segment having a set of third waveguide segment confinement parameters. The waveguide is configured to guide optical data according to an asymmetric optical-loss performance curve that is a plot of the sets of first, second, and third waveguide segment confinement parameters on a first axis; and a level of optical-loss performance that results from the sets of first, second, and third waveguide segment confinement parameters on a second axis. The sets of first, second, and third waveguide segment confinement parameters are configured to, collectively, maximize a predetermined worst-case optical-loss performance level of the asymmetric optical-loss performance curve within a range of waveguide fabrication tolerances.

An apparatus includes a base having walls that define a track. The track has input and output ends and defines a coiled path that spirals inward from the input end, reaches an inflection point where a direction of curvature is reversed, and spirals outward towards the output end. The track is configured to receive and maintain a majority of an optical fiber in an at least substantially planar coiled arrangement. The apparatus also includes a first transition arm positioned at the input end and a second transition arm positioned at the output end. Each transition arm is configured to be mechanically coupled to the base and includes a groove configured to receive and maintain a portion of the optical fiber in an at least substantially straight orientation. The walls and transition arms are configured to maintain thermal contact with the optical fiber along its entire length.

A method and device for interconnecting optical components, such as optical fibers and optical circuits, in a flexible, repeatable, and cost-effective manner. Two or more optical components are interconnected by a flexible optical circuit substrate bearing one or more embedded optical fibers with a lens at each end of each fiber. The flexible optical circuit may be incorporated into a housing bearing apertures for receiving the optical connectors of the optical components that are to be interconnected with the device. The lensed ends of the fibers embedded in the flexible optical circuit are positioned adjacent to the apertures for optically connecting to the fibers within the connectors installed in the apertures without conventional mating connectors disposed inside the housing.

Waveguide substrates, waveguide substrate assemblies, and methods for fabricating waveguide substrates are disclosed. In one embodiment, a waveguide substrate includes an input edge, an output edge, and at least one waveguide within the waveguide substrate. The waveguide substrate further includes at least one input alignment feature within the input edge adjacent to the input end of the at least one waveguide, wherein the at least one input alignment feature is fabricated from a material of the waveguide substrate. The waveguide substrate may also include at least one output alignment feature within the input edge adjacent to the output end of the at least one waveguide, wherein the at least one output alignment feature is fabricated from the material of the waveguide substrate.

An optical module includes a wiring board having a first electrode, an optical waveguide provided on the wiring board, an optical element having a second electrode and provided on the optical waveguide, a conductive bonding material bonding the first and second electrodes, and a fixing member that fixes the optical element to the optical waveguide. The optical waveguide includes a core layer, a first cladding layer provided on a first side of the core layer, a second cladding layer provided on a second side of the core layer opposite to the first side, and an optical path conversion mirror provided on the core layer or the second cladding layer. The optical element is optically coupled to one end of the core layer via the optical path conversion mirror, and a softening point of the fixing member is higher than a melting point of the conductive bonding material.