A method of preparing a preformed fiber optic circuit for later termination to at least one fiber optic connector includes providing a substrate for supporting a plurality of optical fibers, the substrate including at least one layer of flexible foil, wherein the flexible foil may be formed from polyethylene terephthalate (PET) according to one example and peeling a layer including at least the optical fibers from the at least one layer of flexible foil.

The present disclosure relates to a fiber management device or system for facilitating routing and storing optical fibers. The fiber management device includes a flexible, film-like substrate that has optical fiber management, storing functionality, and splicing functionality all on one film-like substrate. The flexible, film-like substrate can provide a routing path for routing optical fibers onto a flexible planar substrate that can be temporarily supported by, mounted on or attached to the flexible planar substrate. The flexible, film-like substrate can accommodate fibers that are in a multi-fiber (e.g., ribbon) configuration or a single fiber configuration.

A method of preparing a preformed fiber optic circuit for later termination to at least one fiber optic connector includes providing a substrate for supporting a plurality of optical fibers, the substrate including at least one layer of flexible foil, wherein the flexible foil may be formed from polyethylene terephthalate (PET) according to one example and peeling a layer including at least the optical fibers from the at least one layer of flexible foil.

An apparatus includes: at least one of a circuit board or a substrate; and a first structure attached to the at least one of a circuit board or a substrate. The first structure is configured to enable an optical module with connector to be removably coupled to the first structure, and the optical module with connector is configured to enable an optical fiber connector to be removably coupled to the optical module with connector. For example, the circuit board or the substrate includes first electrical contacts, the first structure includes walls that define a first opening, the walls also define one or more retaining mechanisms such that when the optical module with connector is inserted into the first opening, the one or more retaining mechanisms on the walls of the first structure engage one or more latch mechanisms on the optical module with connector to secure the optical module with connector to the first structure, and second electrical contacts on the optical module with connector are electrically coupled to the first electrical contacts on the circuit board or the substrate.

An optical cable assembly comprising: (a) a plurality of fibers; (b) a connector; (c) at least a first flat ribbonized portion comprising at least a first portion of the plurality of fibers, the first flat ribbonized portion being terminated to the connector; and (d) at least a first non-flat portion comprising at least a second portion of the plurality of fibers.

A system and method of mounting and electrically contacting a first printed circuit board perpendicularly onto a second printed circuit board within a housing includes inserting the first printed circuit board into an upper part of the housing using a stop surface arranged on an inner side surface of the upper part of the housing and arranged to support the electrical contacting and assembly, locking the first printed circuit board in the upper part of the housing using a locking system, and mounting the upper part of the housing with the locked printed circuit board on a lower part of the housing in which the second printed circuit board is mounted.

A shuffle assembly for a computing device comprises at least one chassis waveguide shuffle block having a plurality of chassis inputs and a plurality of chassis outputs, and having a plurality of optical waveguides formed therein connecting the chassis inputs to the chassis outputs in a desired chassis shuffle arrangement. The shuffle assembly may further comprise at least one line card waveguide shuffle block having a plurality of line card inputs, at least one of the plurality of line card inputs, a plurality of line card outputs, and a plurality of waveguides formed therein connecting the plurality of line card inputs to the plurality of line card outputs in a line card shuffle arrangement. At least one optical ribbon cable may couple the at least one chassis waveguide shuffle block to the at least one waveguide shuffle block.

An apparatus includes a base having walls that define a track. The track has input and output ends and defines a coiled path that spirals inward from the input end, reaches an inflection point where a direction of curvature is reversed, and spirals outward towards the output end. The track is configured to receive and maintain a majority of an optical fiber in an at least substantially planar coiled arrangement. The apparatus also includes a first transition arm positioned at the input end and a second transition arm positioned at the output end. Each transition arm is configured to be mechanically coupled to the base and includes a groove configured to receive and maintain a portion of the optical fiber in an at least substantially straight orientation. The walls and transition arms are configured to maintain thermal contact with the optical fiber along its entire length.

A structured optical fiber cabling system configured to connect first and second layers of switches in a mesh network is disclosed. The system comprises a plurality of fiber optic modules each including a plurality of first fiber optic ports distributed in a vertical direction when the fiber optic modules are installed in a chassis. A plurality of fiber optic jumper assemblies each include a horizontal segment and a plurality of legs and fiber optic connectors extending from the horizontal segment, with each fiber optic connector configured to connect to a corresponding fiber optic port of the plurality of first fiber optic ports at the same vertical location in each fiber optic module.

A recessed portion in a semiconductor substrate and a method of forming the same are provided. The method comprises: forming a mask on the semiconductor substrate; forming a protection layer on a top surface of the mask and on at least one sidewall of the mask, and on at least one surface of the semiconductor substrate exposed by the mask; performing a first etching process to remove the protection layer on the top surface of the mask and on a bottom surface of the semiconductor substrate exposed by the mask; and performing a second etching process to remove the remaining protection layer and to etch the semiconductor substrate to form the recessed portion. In this way, a recessed portion with relatively smooth and vertical sidewalls can be realized.