A system includes a housing that has a front panel; a substrate that is positioned at a distance from the front panel, in which a data processor is mounted on the substrate; and a pluggable module. The pluggable module includes a co-packaged optical module, at least one first optical connector, a first fiber optic cable that is optically coupled between the co-packaged optical module and the first optical connector, and a fiber guide that is positioned between the co-packaged optical module and the first optical connector and provides mechanical support for the co-packaged optical module and the first optical connector. The co-packaged optical module is configured to receive optical signals from the first optical connector, generate electrical signals based on the received optical signals, and transmit the electrical signals to the data processor. The pluggable module has a shape that enables the pluggable module to pass through an opening in the front panel to enable the co-packaged optical module to be coupled to the substrate.

In one embodiment, an optical spectroscopy probe includes an optical fiber having a distal tip and a microfluidic filtering chamber attached to the distal tip of the optical fiber, the chamber comprising a microfluidic membrane adapted to enable liquid to enter the chamber but prevent particles from entering the chamber.

Disclosed is an optical interconnection device that includes an alignment ferrule assembly formed from an alignment substrate and optical fibers. The optical interconnection device also has an alignment assembly formed by a planar support member with guide features. A receiving region resides between the guide features in which the alignment substrate is secured. An evanescent optical coupler can be formed using the optical interconnection device as a first device and another optical interconnection device as a second device. The second device is constituted by a planar lightwave circuit that operably supports waveguides and an adapter. The adapter of the second device is configured to engage the alignment assembly of the first device to place the optical fibers and the optical waveguides of the respective devices in evanescent optical communication.

A optoelectronic assembly is provided including a photonic integrated circuit (PIC) including at least one electronic connection element and plurality of waveguides disposed on a PIC face, a printed circuit board (PCB) including at least one PCB electronic connection element, which is complementary to the at least one electronic connection element of the PIC and the PIC is configured to be flip chip mounted to the PCB, a lidless fiber array unit including a support substrate having a substantially flat first surface and a signal fiber array including a plurality of optical fibers supported on the first surface, and an alignment substrate disposed on the PIC face and configured to align the plurality of optical fibers of the signal fiber array with the plurality of waveguides.

A structure for coupling an optical signal between an integrated circuit photonic structure and an external optical fiber is disclosed as in a method of formation. The coupling structure is sloped relative to a horizontal surface of the photonic structure such that light entering or leaving the photonic structure is substantially normal to its upper surface.

An external indicator assembly for a central processing unit (CPU) disposed within an equipment cabinet, including: an internal fitting adapted to be disposed adjacent to indicator lights associated with the CPU; an external fitting adapted to be coupled to or disposed through an external surface of the equipment cabinet; and one or more optical fibers adapted to be coupled between the internal fitting and the external fitting such that light from the indicator lights is transmitted from the CPU disposed within the equipment cabinet external to the equipment cabinet such that the light is visible to a person external to the equipment cabinet. This allows the person to visually assess the status or power-down cycling of the CPU during a shutdown or restart process without or before opening the equipment cabinet, thereby preventing corruption of the CPU and assuring personal safety by avoiding contact with powered components.

A multi-channel mode converter includes a lens array having a first lens and a second lens, a glass block coupled to the lens array, and a fiber assembly unit (FAU) array coupled to the glass block, the FAU array including a first fiber corresponding to the first lens, and a second fiber corresponding to the second lens. The FAU array provides for a corresponding number of fibers and lenses such that a specific single fiber corresponds to a specific single lens, there being a 1:1 relationship between fibers and lenses. A mode converter system comprises: a lens array comprising: a first silicon lens configured to convert a first mode between a first waveguide and a first fiber, and a second silicon lens configured to convert a second mode between a second waveguide and a second fiber, and a glass block coupled to the lens array and configured to provide an optical path for a first light beam corresponding to the first silicon lens and a second light beam corresponding to the second silicon lens.

An electrical connector, comprising a connector main body, a cable, a connecting housing, a limiting member, and a housing. The connector main body comprises a plugging side and a connecting side. One end of the cable is electrically connected with the connector main body, while the other end protrudes from the connecting side of the connector main body. The connecting housing is disposed at one side of the connector main body. The cable protrudes from one side of the connecting housing close to the connecting side. The limiting member is disposed at one side of the connecting housing close to the plugging side. The housing is disposed at one side of the connecting housing close to the plugging side. The plugging side of the connector main body is disposed in the housing. The connecting housing is assembled to the housing through the cooperation of the limiting member and the housing.

A device is provided. The device may be an optical device, a light coupling device, or a device containing an optical structure. The device includes a waveguide, a cladding, and a light coupling material. The light coupling material is disposed adjacent to the waveguide and has a first surface and a second surface, where the second surface is disposed further away from the waveguide than the first surface and a thickness of the second surface is greater than that of the first surface.

A optoelectronic assembly is provided including a photonic integrated circuit (PIC) including at least one electronic connection element and plurality of waveguides disposed on a PIC face, a printed circuit board (PCB) including at least one PCB electronic connection element, which is complementary to the at least one electronic connection element of the PIC and the PIC is configured to be flip chip mounted to the PCB, a lidless fiber array unit including a support substrate having a substantially flat first surface and a signal fiber array including a plurality of optical fibers supported on the first surface, and an alignment substrate disposed on the PIC face and configured to align the plurality of optical fibers of the signal fiber array with the plurality of waveguides.