A method for fabrication a multifiber cable assembly is provided. The method includes selecting a plurality of optical fibers that each have a respective cladding diameter, determining a maximum fiber core position error for the plurality of optical fibers in a plurality of configurations, and determining a desired order of the plurality of optical fibers that minimizes the maximum fiber position total error.

A optoelectronic assembly is provided including a photonic integrated circuit (PIC) including at least one electronic connection element and plurality of waveguides disposed on a PIC face, a printed circuit board (PCB) including at least one PCB electronic connection element, which is complementary to the at least one electronic connection element of the PIC and the PIC is configured to be flip chip mounted to the PCB, a lidless fiber array unit including a support substrate having a substantially flat first surface and a signal fiber array including a plurality of optical fibers supported on the first surface, and an alignment substrate disposed on the PIC face and configured to align the plurality of optical fibers of the signal fiber array with the plurality of waveguides.

A semiconductor device including a singulated structure and an optical fiber assembly is provided. The singulated structure includes a photonic die, an electronic die connected to the photonic die and an optical element over the photonic die. The optical fiber assembly is disposed on a top of the singulated structure and includes a holder and an optical fiber structure. The holder keeps an air gap from the optical element. The optical fiber structure is carried by the holder and configured to be optically communicated with the photonic die through the optical element.

Methods for laser bonding optical elements to substrates and optical assemblies are disclosed. According to one embodiment, a method of bonding an optical element to a substrate includes disposing at least one optical element onto a surface of the substrate, electrostatically affixing the at least one optical element to the surface of the substrate, and directing a laser beam into the at least one optical element. The laser beam heats an interface between at least one optical element and the substrate to a temperature that is higher than a lowest temperature of the optical element change temperature and the substrate change temperature, thereby forming a bond between at least one optical element and the substrate at a bond area. The laser beam has a fluence that does not modify the substrate at areas of the substrate that are outside of the at least one optical element.

A optoelectronic assembly is provided including a photonic integrated circuit (PIC) including at least one electronic connection element and plurality of waveguides disposed on a PIC face, a printed circuit board (PCB) including at least one PCB electronic connection element, which is complementary to the at least one electronic connection element of the PIC and the PIC is configured to be flip chip mounted to the PCB, a lidless fiber array unit including a support substrate having a substantially flat first surface and a signal fiber array including a plurality of optical fibers supported on the first surface, and an alignment substrate disposed on the PIC face and configured to align the plurality of optical fibers of the signal fiber array with the plurality of waveguides.

Methods for laser welding one or more optical fibers to a substrate and assemblies are disclosed. In one embodiment, a method of bonding an optical fiber to a substrate having at least one film layer on a surface of the substrate includes directing a laser beam into the optical fiber disposed on the at least one film layer. The optical fiber has a curved surface that focuses the laser beam to a focused diameter. The method further includes melting, using the focused diameter laser beam, a material of the substrate to create a laser bond area between the optical fiber and the surface of the substrate. The laser bond area includes laser-melted material of the substrate that bonds the optical fiber to the substrate. The at least one film layer has an absorption of at least 15% at a wavelength of the focused diameter laser beam.

An optical fiber fixing tool includes: a fiber accommodating body having a fiber accommodating groove that accommodates: at least a part of an uncovered bare portion of an optical fiber and a boundary part between the uncovered bare portion and a covered portion of the optical fiber, a cover being removed to expose a bare fiber in the uncovered bare portion; and a fixing resin that fills an inside of the fiber accommodating groove and fixes at least the part of the uncovered bare portion and the boundary part. In a cross-sectional view of the fiber accommodating groove viewed from a cross section of the optical fiber, the entire uncovered bare portion and the entire boundary part are accommodated in the fiber accommodating groove, and the fixing resin covers an entire outer circumference of the uncovered bare portion and an entire outer circumference of the boundary part.

The present disclosure provides an electrical connector connected with a chip connector. The electrical connector comprises a first terminal component, an adapting board, and a cable. The first terminal component comprises a plurality of terminals. The adapting board is disposed at one side of the first terminal component. At least one of the plurality of terminals of the first terminal component is connected with the adapting board. One end of the cable is connected with the adapting board. The other end of the cable is connected with the chip connector. Since the plurality of terminals and the cable of the first terminal component are connected with the adapting board, selectable cables in multiple dimensions would be increased, the soldering process can be simplified, the soldering cost can be reduced, and the stability of the connection between the terminal and the cable would also be enhanced.

An electrical connector, comprising a connector main body, a cable, a connecting housing, a limiting member, and a housing. The connector main body comprises a plugging side and a connecting side. One end of the cable is electrically connected with the connector main body, while the other end protrudes from the connecting side of the connector main body. The connecting housing is disposed at one side of the connector main body. The cable protrudes from one side of the connecting housing close to the connecting side. The limiting member is disposed at one side of the connecting housing close to the plugging side. The housing is disposed at one side of the connecting housing close to the plugging side. The plugging side of the connector main body is disposed in the housing. The connecting housing is assembled to the housing through the cooperation of the limiting member and the housing.

This optical fiber alignment jig for aligning a plurality of optical fibers with the tip end coating stripped off to expose glass fiber includes a rail; a convex push-up part capable of moving in the extending direction of the rail; and a plurality of plate-shaped parts that each have a first surface and a second surface perpendicular to the extending direction of the rail and an inclined surface that can carry a respective optical fiber, the inclined surfaces of the plurality of plate-shaped parts being inclined, relative to the extending direction of the rail, in the same direction. The plurality of plate-shaped parts are arranged side by side along the extending direction of the rail with the first surface of one plate-shaped part facing the second surface of an adjacent plate-shaped part and are contacted by the push-up part so as to move toward the inclined surface side.