An example of a printed structure comprises a target substrate and a structure protruding from a surface of the target substrate. A component comprising a component substrate separate and independent from the target substrate is disposed in alignment with the structure on the surface of the target substrate within 1 micron of the structure. An example method of making a printed structure comprises providing the target substrate with the structure protruding from the target substrate, a transfer element, and a component adhered to the transfer element. The component comprises a component substrate separate and independent from the target substrate. The transfer element and adhered component move vertically toward the surface of the target substrate and horizontally towards the structure until the component physically contacts the structure or is adhered to the surface of the target substrate. The transfer element is separated from the component.

A semiconductor optical device includes: a laser for emitting light; a modulator for modulating the light using an electroabsorption effect; a chip capacitor that is electrically connected in parallel to the laser; a chip inductor that is electrically connected in series to the chip capacitor, is electrically connected in series to the laser and the chip capacitor as a whole, and includes a first terminal and a second terminal; a solder or a conductive adhesive that directly bonds the first terminal of the chip inductor and the chip capacitor to each other; an electrical wiring group in which the laser, the modulator, the chip capacitor, and the chip inductor are electrically connected to each other; and a substrate on which the laser, the modulator, the chip capacitor, and the chip inductor are mounted.

Aspects of the subject disclosure may include, a system for receiving first optical power signals via an optical fiber connected with a light source of a network device, converting the first optical power signals to electrical energy utilizing an optical power converter where the electrical energy is utilized as power by the system, and transmitting or receiving electromagnetic waves that propagate along a transmission medium without requiring an electrical return path, and wherein the electromagnetic waves convey data. Other embodiments are disclosed.

An optical connector is provided which can prevent contamination of a lens body with dust or its scratching without a dust cap when being not mated with a partner optical connector. An optical connector is configured to be mounted on a board and to be mated with a partner optical connector which is connected to a terminal end of an optical fiber. The optical connector includes a housing, an optic transceiver, a lens body and a shield case. The housing includes a tubular section for receiving an optical fiber and a ferrule of a partner optical connector. The lens body is located on one side of the tubular section, wherein a film for closing the tubular section is molded integrally with the tubular section on another side of the tubular section. The film is configured to be broken by inserting the optical fiber and the ferrule into the tubular section.

An optical connector is provided which can prevent contamination of a lens body with dust or its scratching without a dust cap when being not mated with a partner optical connector. An optical connector is configured to be mounted on a board and to be mated with a partner optical connector which is connected to a terminal end of an optical fiber. The optical connector includes a housing, an optic transceiver, a lens body and a shield case. The housing includes a tubular section for receiving an optical fiber and a ferrule of a partner optical connector. The lens body is located on one side of the tubular section, wherein a film for closing the tubular section is molded integrally with the tubular section on another side of the tubular section. The film is configured to be broken by inserting the optical fiber and the ferrule into the tubular section.

A semiconductor package includes a first optical transceiver, a second optical transceiver, a third optical transceiver, and a plasmonic waveguide. The first optical transceiver, the second optical transceiver, and the third optical transceiver are stacked in sequential order. The first optical transceiver and the third optical transceiver respectively at least one optical input/output portion for transmitting and receiving an optical signal. The plasmonic waveguide includes a first segment, a second segment, and a third segment optically coupled to one another. The first segment is embedded in the first optical transceiver. The second segment extends through the second optical transceiver. The third segment is embedded in the third optical transceiver. The first segment is optically coupled to the at least one optical input/output portion of the first optical transceiver and the third segment is optically coupled to the at least one optical input/output portion of the third optical transceiver.

A housing structure of an optical module with self-sinking unlocking comprises: a base, an upper cover, a rotating lug, a support rod and a pull ring; wherein the rotating lug comprises a first connecting piece a lug, a second connecting piece and a stem, wherein the first connecting piece and the second connecting piece are respectively horizontally disposed at two ends of the stem, and the lug is disposed on the stem; and the pull ring comprises a fixing shaft, a rotating shaft and a side rod; wherein the second connecting piece of the rotating lug is disposed on the bas; the first connecting piece of the rotating lug is coupled to a right connecting piece of the support rod; a left hole of the support rod is coupled to the rotating shaft of the pull ring.

This optical receptacle has an optical receptacle main body, a supporting member, and an adhesive. The optical receptacle main body includes a first optical surface, second optical surface, reflecting surface, first fit-in section, and recessed section. The supporting member includes: a supporting member main body; a second fit-in section fitted in the first fit-in section; and a through hole, which faces the recessed section, and which is opened in the inner-side surface of the supporting member main body, and in the outer-side surface on the reverse side of the inner-side surface. The adhesive is in contact with the inner surface of the recessed section, and the supporting member. The optical receptacle main body is disposed further toward the supporting member side than an installation surface.

An optical transceiver according to one embodiment includes a housing having an inner space and inner planes that face to each other and define the inner space, a TOSA including a package and a sleeve attached to the package, the sleeve being fixed to the housing, the package being housed in the inner space, a heat conductive gel that is plastic or deformable and closely sandwiched between the package and one of the inner planes, a fitting member in contact with the other of the inner planes and detachably fixed to the housing, and a resin member closely sandwiched between the package and the fitting member.

An optical module includes: an optical component; a light receiving element receiving a laser beam through the optical component; a package housing the optical component and the light receiving unit; and a shielding portion that prevents stray light, which is generated by at least one of the laser beam and the laser beam emitted through the optical component is reflected or scattered in the package or at the optical component, from being incident on the light receiving element.