Microelectronic assemblies including photonic integrated circuits (PICs), related devices and methods, are disclosed herein. For example, in some embodiments, a photonic assembly may include an integrated circuit (IC) in a first layer including an insulating material, wherein the IC is embedded in the insulating material; a PIC, having an active surface, in a second layer, wherein the second layer is on the first layer, the second layer includes the insulating material, and the PIC is embedded in the insulating material with the active surface facing the first layer and electrically coupled to the IC; and a housing, having an optical lens optically coupled to an internal surface of the housing, attached to the active surface of the PIC and extending from the active surface of the PIC through the insulating material in the first layer, wherein the internal surface of the housing is opposite the active surface of the PIC.

Methods and apparatus to reduce stress on lasers in optical transceivers are disclosed. An apparatus comprising a printed circuit board (PCB) having a first side and a second side opposite the first side; and a first stiffener attached to the first side of the PCB; and a photonic integrated circuit (PIC) attached to the first stiffener. The first stiffener is between the PIC and the PCB. The apparatus also includes a second stiffener attached to the second side of the PCB.

A photonic package and a method of manufacturing a photonic package are provided. The photonic package includes a carrier, an electronic component, and a photonic component. The carrier has a first surface and a recess portion exposed from the first surface. The electronic component is disposed in recessed portion. The photonic component is disposed on and electrically connected to the electronic component and is configured to communicate optical signals.

An optical telescope may include an array of optical lenslets in a common plane, and optical waveguides extending from respective optical lenslets and each having a common optical path delay. Further, at least one optical star coupler may be downstream from the optical waveguides, and an optical detector may be downstream from the at least one optical star coupler and having an optical image formed thereon.

A die for a semiconductor chip package includes a first surface including an integrated circuit formed therein. The die also includes a backside surface opposite the first surface. The backside surface has a total surface area defining a substantially planar region of the backside surface. The die further includes at least one device formed on the backside surface. The at least one device includes at least one extension extending from the at least one device beyond the total surface area.

An optical transceiver that includes a housing, an inner ceiling, and an outer ceiling. The housing includes sides and a bottom. The inner ceiling is assembled with the housing; while, the outer ceiling is fit with the housing. The outer ceiling, which forms a cavity accompanied with the housing, is fastened with the inner ceiling by a screw inserted into a screw hole.

Metasurface elements, integrated systems incorporating such metasurface elements with light sources and/or detectors, and methods of the manufacture and operation of such optical arrangements and integrated systems are provided. Systems and methods for integrating transmissive metasurfaces with other semiconductor devices or additional metasurface elements, and more particularly to the integration of such metasurfaces with substrates, illumination sources and sensors are also provided. The metasurface elements provided may be used to shape output light from an illumination source or collect light reflected from a scene to form two unique patterns using the polarization of light. In such embodiments, shaped-emission and collection may be combined into a single co-designed probing and sensing optical system.

A compact, wavelength-stabilized laser source is provided by utilizing a specialty gain element (i.e., formed to include a curved waveguide topology), where a separate wavelength stabilization component (for example, a fiber Bragg grating (FBG)) is used one of the mirrors for the laser cavity. That is, the FBG takes the place of the physical “front facet” of the gain element, and functions to define the laser cavity in the first instance, while also utilizing the grating structure to impart the desired wavelength stability to the output from the packaged laser source. As a result, the FBG is disposed within the same package used to house the gain element and provides a wavelength-stabilized laser source in a compact form.

A composite semiconductor laser is made by securing a III-V wafer to a transfer wafer. A substrate of the III-V wafer is removed, and the III-V wafer is etched into a plurality of chips while the III-V wafer is secured to the transfer wafer. The transfer wafer is singulated. A portion of the transfer wafer is used as a handle for bonding the chip in a recess of a silicon device. The chip is used as a gain medium for the semiconductor laser.

An optical module-member is provided, including: a layer-shaped optical waveguide; a light-emitting unit substrate including an insulating substrate, light-emitting element-mounting portions where light-emitting elements are configured to be mounted so as to be optically connected to the optical waveguide, and driving element-mounting portions which are electrically connected to the light-emitting element-mounting portions where driving elements for driving the light-emitting elements are configured to be mounted; and a light-receiving unit substrate which is separated from the light-emitting unit substrate, the light-receiving unit substrate including: an insulating substrate, light-receiving element-mounting portions where light-receiving elements are configured to be mounted so as to be optically connected to the optical waveguide, and signal amplification element-mounting portions which are electrically connected to the light-receiving element-mounting portions and where signal amplification elements for amplifying a signal from the light-receiving element are configured to be mounted.