An excitation light irradiation device includes a substrate having a color center. The color center is excited by an excitation light incident to the substrate. The substrate includes first and second reflection surfaces facing each other, and first and second end surfaces facing each other. When the excitation light enters into the substrate, the incident excitation light travels from the first end surface to the second end surfaces while repeatedly reflecting between the first and second reflection surfaces. The second end surface is inclined. The second end surface reflects the incident excitation light so as to cause the incident excitation light to be emitted from one of the first and second reflection surfaces.

An optoelectronic module may include a housing enclosing at least one optical transmitter or receiver and a slider configured to move with respect to the housing. The slider may include at least one protrusion configured to engage a cage sized and shaped to receive the housing. The optoelectronic module may include a bail rotatably coupled to the housing. The bail may be configured to actuate the slider when the bail is rotated. The optoelectronic module may include a retainer including an occlusion member sized and shaped to be positioned inside a port of the optoelectronic module. The retainer may define a surface configured to engage with the bail.

Provided is a waveguide photodetector including a semiconductor substrate, a first optical waveguide and a second optical waveguide, which are sequentially laminated on the semiconductor substrate, in which each of the first optical waveguide and the second optical waveguide includes a first portion and a second portion, and the first portion extends from the second portion in a first direction parallel to a top surface of the semiconductor substrate, a refractive index matching layer disposed on the second portion of the second optical waveguide, a clad layer disposed on the refractive index matching layer, and an absorber disposed between the refractive index matching layer and the clad layer. Here, the second optical waveguide has a first conductive-type, the clad layer has a second conductive-type opposite to the first conductive-type, and the refractive index matching layer includes a first semiconductor layer that is an intrinsic semiconductor layer.

A photodetector is realized which does not need an additional circuit for an inspection and may perform a characteristic evaluation inspection of optical input and electrical output such as optical sensitivity and OE characteristics of a photodetector alone with respect to wavelength and temperature dependent characteristics. A photodetector is provided in which light absorption layers are formed on a semiconductor substrate, the photodetector detects signal light incident on the light absorption layers from a direction in a substrate surface of the semiconductor substrate, and the light absorption layers have a portion not covered by an electrode for photocurrent detection connected with the light absorption layers in a case where the substrate surface of the semiconductor substrate is seen from a direction from an outside of the substrate surface.

An optical waveguide includes a core extending in a transmission direction of light, a clad covering the core along the transmission direction, and a mixing layer containing a material for the core and a material for the clad on the interface between the core and the clad, and the mixing layer includes a plurality of regions each having a different thickness in the transmission direction.

Embodiments may relate to a microelectronic package that includes a package substrate with an active bridge positioned therein. An active die may be coupled with the package substrate, and communicatively coupled with the active bridge. A photonic integrated circuit (PIC) may also be coupled with the package substrate and communicatively coupled with the active bridge. Other embodiments may be described or claimed.

A photonic integrated circuit (PIC) spectrometer for sensing the spectroscopic signature of airborne molecules, comprising a dispersive element to separate the spectral information spatially, and a tuning mechanism for said dispersive element to convert the spectral information to time-dependent information. The approach allows the PIC spectrometer to have a single (or a few) output pin(s), enabling sensing of the environment with a simple packaged chip that is compact, lightweight, energy efficient and low cost, making it suitable for platforms that have a small form factor, a small power budget, and are cost sensitive, such as mobile devices.

A light-modulating device includes optical microstructures, each including a topmost layer, a bottommost layer, and in-between layers. The topmost layer extends in a first predetermined axis. The bottommost layer extends in a last predetermined axis which turns about a center axis such that an incident light beam passing through the topmost layer in an incident route is modulated to permit the light beam emitting from the bottommost layer to impinge upon a solar concentrator disposed below the light-modulating device along an impinging route different from the incident route. The in-between layers are sequentially turned about the center axis by an incremental degree toward the last predetermined axis.

An optical sub-module includes a first casing, a second casing, an adhesive layer and an optical device. The first casing has a top wall and a first sidewall. The second casing has a bottom wall and a second sidewall. A height of the second sidewall in a thickness direction of the bottom wall is greater than a height of the first sidewall in a thickness direction of the top wall, and the second casing and the first casing is connected to form a chamber. The adhesive layer is disposed between a surface of the first sidewall and a surface of the second sidewall, and a coefficient of thermal expansion of the adhesive layer is greater than a coefficient of thermal expansion of the first casing and a coefficient of thermal expansion of the second casing. The optical device is disposed in the chamber and fixedly connected to the second casing.

There is set forth herein a method including a substrate; a dielectric stack disposed on the substrate; one or more photonics device integrated in the dielectric stack; and a laser light source having a laser stack including a plurality of structures arranged in a stack, wherein structures of the plurality of structures are integrated in the dielectric stack, wherein the laser stack includes an active region configured to emit light in response to the application of electrical energy to the laser stack.