A cable connector disconnection system includes a cable having a cable connector, and a computing device. The computing device includes a computing device connector that connects to the cable connector, a cable connector disconnection actuator that is spaced apart from the computing device connector on the computing device and that is configured to move relative to the computing device, and a cable connector engagement subsystem that is located immediately adjacent the computing device connector and that is coupled to the cable connector disconnection actuator. Movement of the cable connector disconnection actuator relative to the computing device when the cable connector is connected to the computing device connector causes the cable connector engagement subsystem to move relative to the computing device connector and into engagement with the cable connector to disconnect the cable connector from the computing device connector.

A semiconductor package includes a printed wiring board, a logic IC mounted on the printed wiring board, a connector mounted on the printed wiring board, an optical element that is accommodated inside the printed wiring board and converts an optical signal to an electrical signal and/or the electrical signal to the optical signal, an optical waveguide formed between the optical element inside the printed wiring board and the connector on the printed wiring board such that the optical waveguide optically connects the optical element and the connector, and an electrical path formed between the optical element and the logic IC such that the electrical path connects the logic IC and the optical element and that a length of the electrical path is 1 mm or less.

Embodiments disclosed herein include electronic packages with a core that includes an optical waveguide and methods of forming such electronic packages. In an embodiment, a package substrate comprises a core, and a photonics die embedded in the core. In an embodiment, the electronic package further comprises an optical waveguide embedded in the core. In an embodiment, the optical waveguide optically couples the photonics die to an edge of the core.

Aspects described herein include an apparatus supporting optical alignment with one or more optical waveguides optically exposed along an edge of a photonic integrated circuit (IC). The apparatus comprises a frame body comprising an upper portion defining a reference surface, and a lateral portion defining an interface for an optical connector connected with one or more optical fibers. The lateral portion comprises one or more optical components defining an optical path through the lateral portion. The one or more optical components are arranged relative to the reference surface such that the one or more optical components align with (i) the one or more optical waveguides along at least one dimension when the reference surface contacts a top surface of an anchor IC, and with (ii) the one or more optical fibers when the optical connector is connected at the interface.

An optoelectronic assembly comprises at least two electrical contacts on a surface of an optoelectronic component for supplying electrical energy for generating electromagnetic radiation, and at least two meander-shaped contact lugs, each of which comprises a first and a second section. The first section in each case of the at least two meander-shaped contact lugs is coupled to one of the at least two electrical contacts. The second section in each case of the at least two meander-shaped contact lugs comprises a fastening element which is designed to go into a mechanical linkage to a fiber structure of a carrier and to create an electrical connection to the first section.

There is provided a light emitting element and an optical waveguide that propagates light from the light emitting element. For example, the optical waveguide is an optical fiber or a silicon optical waveguide. The light propagating through the optical waveguide is light having components of a fundamental mode and a first order mode, and the light propagates through the optical waveguide while having a light intensity distribution in which high intensity portions alternately appear in one direction and another direction opposite to the one direction with respect to the center of a core along the optical waveguide. A light intensity distribution at an output end surface of the optical waveguide is a light intensity distribution corresponding to an intermediate position between a first position where the high intensity portion is in the one direction and a second position where the high intensity portion is in the another direction. In a case of propagating the light having the components of the fundamental mode and the first order mode, it is possible to obtain favorable coupling efficiency regardless of a direction of an optical axis deviation, as in a case of propagating light having only the component of the fundamental mode. A cost is thus reduced by reducing accuracy of positional deviation.

An optical module includes a shell, a circuit board, a display light and a light guide pipe. The circuit board is disposed in the shell. The display light is disposed on the circuit board, and is configured to emit light of different colors. The light guide pipe is disposed between the shell and the circuit board. An input end of the light guide pipe is arranged to correspond to the display light, an output end of the light guide pipe is configured to transmit light emitted by the display light to an outside of the optical module. The shell includes a groove. The output end of the light guide pipe is fixed in the groove, so that the shell is fixed with the light guide pipe.

A connector has a case, a circuit board, and a thermal diffusing unit. The case has an inner surface. The circuit board is mounted in the case and has a heating source. The thermal diffusing unit abuts the inner surface of the case and the heating source of the circuit board. An area of the thermal diffusing unit abutting the inner surface is bigger than an area of the thermal diffusing unit abutting the heating source. A heat transfer coefficient of the thermal diffusing unit is bigger than a heat transfer coefficient of the case. With the structure above, the thermal diffusing unit is allowed to transmit heat from a small area to a big area, thereby improving the heat dissipation efficiency of the connector.

The photoelectric signal conversion and transmission device includes a photoelectric signal module and a fiber joint, matched and coupled together. A circuit board of the photoelectric signal module includes one or more connection bases. Light emission elements, light reception elements, and amplifiers are configured on a first coupling face of the connection based, and electrically connected by first and second wires. The fiber joint includes a number of fibers axially aligned with the light emission and reception elements. By having the light emission and reception elements and amplifiers configured on a same coupling face, their physical connection distance is reduced, thereby decreasing signal attenuation, enhancing signal transmission performance, and facilitating structural miniaturization.

Systems for measuring a concentration of a target species include a first and second tunable diode laser generating laser light at a respective first and second wavelength each corresponding to respective absorption lines of the target species. A first optical fiber is optically coupled to the first tunable diode laser, and does not support a fundamental mode at the second wavelength. A second optical fiber is coupled to the second tunable diode laser and does not support a fundamental mode at the first wavelength. A fiber bundle includes respective distal ends of the first and second optical fibers, which are stripped of their respective coatings and arranged with their claddings adjacent to each other. A pitch head is configured to project respective optical beams from the fiber bundle through a measurement zone. A catch head located across the measurement zone receives the projected beams and directs them to a sensor.