Aspects include a pluggable optical device and related optical system. The pluggable optical device comprises a housing, a printed circuit board (PCB) within the housing, and one or more blind mate optical connectors attached to the PCB along a first end of the PCB. The pluggable optical device further comprises one or more electrical contacts of the PCB near the first end, one or more external optical connectors arranged near a second end of the PCB opposite the first end, and one or more optical components attached to the PCB and included in optical paths extending between the one or more external optical connectors and the one or more blind mate optical connectors.

Measuring a concentration of at least one target species is described. A first and second tunable diode laser are configured to generate laser light at a respective wavelength different from one another. A pitch head comprising a transmitting optic is optically coupled to the first and second tunable diode lasers via distal ends of the first and second optical fibers, and is oriented to project respective beams from each of the first and second distal ends through a measurement zone. A photodetector is configured to detect an optical power of light in the first and second wavelengths. A catch head located across the measurement zone from the pitch head is in optical communication with the pitch head to receive the respective beams from the first and second distal ends and direct the respective beams to the photodetector.

An electronic device and associated methods are disclosed. In one example, the electronic device includes a photonic integrated circuit and an in situ formed waveguide. In selected examples, the electronic device includes a photonic integrated circuit coupled to an electronic integrated circuit, in a glass layer, where a waveguide is formed in the glass layer.

Microelectronic assemblies including photonic integrated circuits (PICs), related devices and methods, are disclosed herein. For example, in some embodiments, a photonic assembly may include a PIC in a first layer including an insulating material, wherein the PIC is embedded in the insulating material with an active surface facing up; a conductive pillar in the first layer; an integrated circuit (IC) in a second layer on the first layer, wherein the second layer includes the insulating material and the IC is embedded in the insulating material, and wherein the IC is electrically coupled to the active surface of the PIC and the conductive pillar; an optical component optically coupled to the active surface of the PIC; and a hollow channel surrounding the optical component, the hollow channel extending from the active surface of the PIC through the insulating material in the second layer.

Embodiments described herein may be related to apparatuses, processes, and techniques directed to dense integration of PICs in a substrate using an optical fanout structure that includes waveguides formed within a substrate to optically couple with the PICs at an edge of the substrate. One or more PICs may then be electrically with dies such as processor dies or memory dies. The one or more PICs may be located within a cavity in the substrate. The substrate may be made of glass or silicon. Other embodiments may be described and/or claimed.

An optical transceiver may include a housing including a surface cutout. The surface cutout may be for receiving a locking tang from a cage and for being disengaged by a slide from an unlocking tool wherein the surface cutout is disposed on the housing at a position such that the surface cutout is entirely within the cage with respect to an electromagnetic interference (EMI) gasket of the cage when the optical transceiver is inserted into the cage.

Presented herein is a tray for shipping, handling, and/or processing optomechanical components. The tray has a plurality of pockets arranged in an array, wherein each pocket is configured to hold one optomechanical component, and wherein each pocket includes at least one fiducial hole, at least one vacuum hole, a first cradle element configured to support a clip that attaches to one or more optical fibers of the optomechanical component, and a second cradle element configured to support a head of the optomechanical component. Also presented herein is a clip for an optomechanical component that includes a body having a top face and a bottom face, and a plurality of gripping elements arranged in pairs on the bottom face, each pair of gripping elements configured to support a barrel of an optical connector attached to a corresponding optical fiber of the pair of optical fibers.

A micro connector kit including a ferrule assembly, an optical sub-assembly (“OSA”) and a micro connector. The ferrule assembly is coupled to an optical fiber and includes a ferrule. The OSA can receive an electric signal and transmit an optical signal or receive an optical signal and transmit an electric signal. The OSA includes a receptacle sized and shaped to receive the ferrule of the ferrule assembly to form an optical connection between the ferrule assembly and the OSA. The micro connector secures the optical connection between the ferrule assembly and the OSA. The micro connector includes a micro connector housing that forms a direct, mating connection with the OSA to secure the optical connection between the ferrule assembly and the OSA. The connection is made using only a very small space, allowing more ferrule assembly and OSA connections to be made in a smaller area.

An optical communication system includes a co-packaged optical module and a heatsink mounted to the co-packaged optical module. The co-packaged optical module includes a processor disposed on a substrate and a plurality of light engines disposed at different locations around the processor on the substrate. The processor and the light engines generating different amounts of heat during operation. The heatsink includes a plurality of heat pipes non-uniformly distributed throughout the heatsink to remove the different amounts of heat generated at a location of the processor and respective locations of the different ones of the light engines.

A fiber optic ferrule having an angled endface is used in a system where the system can detect back reflection if there is an air gap but not if the fiber optic ferrule is physically mated to another optical device such as a fiber optic ferrule or transceiver. The angle of the end face is preferably between 3 and 5° and most preferably about 4° for most systems. No special detection equipment is needed to infer and determine an acceptable physical contact between two mated fiber-optic ferrules having the angled end faces.