Semiconductor devices and methods of forming the same are provided. A method according to the present disclosure includes forming a first wafer including a plurality of electronic integrated circuits (EICs), forming a second wafer including a plurality of photonic integrated circuits (PICs), bonding the first wafer to the second wafer to form a first stacked wafer. The bonding of the first wafer to the second wafer includes vertically aligning each of the plurality of the EICs with one of the plurality of the PICs.

Semiconductor devices and methods of forming the same are provided. A method according to the present disclosure includes forming a first wafer including a plurality of electronic integrated circuits (EICs), forming a second wafer including a plurality of photonic integrated circuits (PICs), bonding the first wafer to the second wafer to form a first stacked wafer. The bonding of the first wafer to the second wafer includes vertically aligning each of the plurality of the EICs with one of the plurality of the PICs.

An optical touch-sensitive device is able to determine the locations of multiple simultaneous touch events. The optical touch-sensitive device can include an optical waveguide, an emitter, and an emitter coupler. The emitter produces optical beams, and the emitter coupler is on a surface of the waveguide and is configured to direct at least some of the optical beams to propagate via total internal reflection (TIR) through the waveguide as coupled optical beams. Touches on the top surface of the waveguide disturb the coupled optical beams, and the touch-sensitive device determines touch events based on the disturbances.

An optical touch-sensitive device is able to determine the locations of multiple simultaneous touch events. The optical touch-sensitive device can include an optical waveguide, an emitter, and an emitter coupler. The emitter produces optical beams, and the emitter coupler is on a surface of the waveguide and is configured to direct at least some of the optical beams to propagate via total internal reflection (TIR) through the waveguide as coupled optical beams. Touches on the top surface of the waveguide disturb the coupled optical beams, and the touch-sensitive device determines touch events based on the disturbances.

An apparatus arranged for deflecting an optical component for alignment purposes of the optical component with a further optical component, wherein the apparatus comprises a plurality of adjacently placed elongate carriers, extending mutually parallel to each other in a longitudinal direction, wherein two adjacently placed elongate carriers have a spacing between them for receiving a first optical component such that the received optical component rests against two adjacently placed elongate carriers, wherein the two elongate carriers have slopes such that the spacing between the two adjacently placed elongate carriers is smaller at a bottom side compared to the spacing at a top side of the carriers, wherein the carriers comprise piezoelectric material configured to deflect the carriers in a direction perpendicular to the longitudinal direction by actuating the piezoelectric material.

A multi-level, multi-connector assembly that may include high-speed, low-speed and power terminals is protected from electromagnetic interference. The multi-level, multi-port connector assembly includes a bottom port connector connected with a circuit board, a top port connector positioned over the bottom port connector, and an electromagnetic shielding cage positioned over both the top port connector and the bottom port connector to provide shielding from a range of electromagnetic interference (EMI) for the top port connector and the bottom port connector. Each of the top and bottom port connectors comprise power and communication signal conductors, where the signal conductors are operable to conduct at least high-speed communication signals.

Disclosed are apparatus and methods for optical interconnections that include the integration of a photonics die @Die) and an electronic die (eDie) with a socket layer, waveguides and fiber connectors to enable high bandwidth communications. In one embodiment, an exemplary optical interconnect device includes an electronic die coupled to a photonics die and integrated with a substrate, a socket, a board, a pair of micro-lenses and a mirror coupled to a waveguide, which can be embedded in the board. In another embodiment, the waveguide is embedded in a socket layer and coupled to a fiber connector. In these embodiments, the exemplary optical interface device can be coupled one more other optical interconnect devices via a waveguide array and/or a fiber array.

Disclosed are apparatus and methods for optical interconnections that include the integration of a photonics die @Die) and an electronic die (eDie) with a socket layer, waveguides and fiber connectors to enable high bandwidth communications. In one embodiment, an exemplary optical interconnect device includes an electronic die coupled to a photonics die and integrated with a substrate, a socket, a board, a pair of micro-lenses and a mirror coupled to a waveguide, which can be embedded in the board. In another embodiment, the waveguide is embedded in a socket layer and coupled to a fiber connector. In these embodiments, the exemplary optical interface device can be coupled one more other optical interconnect devices via a waveguide array and/or a fiber array.

A semiconductor device includes a substrate. The semiconductor device further includes a waveguide on a first side of the substrate. The semiconductor device further includes a photodetector (PD) on a second side of the substrate, opposite the first side of the substrate. The semiconductor device further includes an optical through via (OTV) optically connecting the PD with the waveguide, wherein the OTV extends through the substrate from the first side of the substrate to the second side of the substrate.

A semiconductor device includes a substrate. The semiconductor device further includes a waveguide on a first side of the substrate. The semiconductor device further includes a photodetector (PD) on a second side of the substrate, opposite the first side of the substrate. The semiconductor device further includes an optical through via (OTV) optically connecting the PD with the waveguide, wherein the OTV extends through the substrate from the first side of the substrate to the second side of the substrate.