G02B6/43

USB ACTIVE OPTICAL CABLE AND PLUG CAPABLE OF MANAGING POWER CONSUMPTION AND STATUS

A USB active optical cable and a plug capable of managing power consumption and state. The USB active optical cable and plug respectively comprises a first plug, a second plug, and an optical transmission medium used to connect the first plug and the second plug; the first plug and the second plug are configured to operate different operating states, including an initialization mode, a transmission mode, and a power saving mode, and they can switch between the different operating states. The USB active optical cable and plug are both based on the separate control of the transmitting unit and the receiving unit to distinguish different operating modes, provide necessary operating requirements and mode switching conditions for each mode, and also enable the checking and transmission of the plugging state in the power saving mode, thus facilitate the power consumption management of the active optical cable.

DETECTION STRUCTURE AND METHOD FOR FEED-FORWARD PUMP FAILURE IN L-BAND OPTICAL FIBER AMPLIFIER
20230058940 · 2023-02-23 ·

A short-waveband active optical component based on a vertical emitting laser and a multi-mode optical fiber has an emitting end and a receiving end. In the emitting end, multiple VCSELs generate multiple optical signals of different wavelengths, and multiple photodiodes in the receiving end receive the optical signals emitted by the VCSELs. Both ends use a focusing lens array to collimate and focus the optical signals A Z-block-shaped prism performs a light combining function at the emitting end, while another Z-block-shaped prism performs a light splitting function at the receiving end. Both ends use a focusing lens for collimating and focusing the optical signals at ends of a multi-mode optical fiber, which is used for transmitting the optical signals generated by the VCSELs. The short-waveband active optical component has a small size and a high transmission rate.

DETECTION STRUCTURE AND METHOD FOR FEED-FORWARD PUMP FAILURE IN L-BAND OPTICAL FIBER AMPLIFIER
20230058940 · 2023-02-23 ·

A short-waveband active optical component based on a vertical emitting laser and a multi-mode optical fiber has an emitting end and a receiving end. In the emitting end, multiple VCSELs generate multiple optical signals of different wavelengths, and multiple photodiodes in the receiving end receive the optical signals emitted by the VCSELs. Both ends use a focusing lens array to collimate and focus the optical signals A Z-block-shaped prism performs a light combining function at the emitting end, while another Z-block-shaped prism performs a light splitting function at the receiving end. Both ends use a focusing lens for collimating and focusing the optical signals at ends of a multi-mode optical fiber, which is used for transmitting the optical signals generated by the VCSELs. The short-waveband active optical component has a small size and a high transmission rate.

PHOTONICS PACKAGE INTEGRATION

An interconnect package integrates a photonic die, an electronic die, and a switch ASIC into one package. At least some of the components in the electronic die, such as, for example, the serializer/deserializer circuits, transceivers, clocking circuitry, and/or control circuitry are integrated into the switch ASIC to produce an integrated switch ASIC. The photonic die is attached and electrically connected to the integrated switch ASIC.

PHOTONICS PACKAGE INTEGRATION

An interconnect package integrates a photonic die, an electronic die, and a switch ASIC into one package. At least some of the components in the electronic die, such as, for example, the serializer/deserializer circuits, transceivers, clocking circuitry, and/or control circuitry are integrated into the switch ASIC to produce an integrated switch ASIC. The photonic die is attached and electrically connected to the integrated switch ASIC.

STRUCTURE FOR A PHOTONIC INTEGRATED CIRCUIT

A structure for a photonic integrated circuit, comprising: a substrate; a first portion of n-type semiconductor material on a first surface area of the substrate, a second portion of n-type semiconductor material on a second surface area of the substrate; a waveguide; and an element between the first portion and the second portion. The waveguide is on and in contact with the element. The element is configured to reduce electric current flow from the first portion to the second portion during propagation of light via the waveguide.

STRUCTURE FOR A PHOTONIC INTEGRATED CIRCUIT

A structure for a photonic integrated circuit, comprising: a substrate; a first portion of n-type semiconductor material on a first surface area of the substrate, a second portion of n-type semiconductor material on a second surface area of the substrate; a waveguide; and an element between the first portion and the second portion. The waveguide is on and in contact with the element. The element is configured to reduce electric current flow from the first portion to the second portion during propagation of light via the waveguide.

PACKAGING STRUCTURE AND PACKAGING METHOD OF EDGE COUPLERS AND FIBER ARRAY

A packaging structure and a packaging method of edge couplers and a fiber array are provided. The packaging structure includes a silicon substrate, an edge coupler, and a fiber array. Multiple edge couplers are arranged in a main body portion of the silicon substrate, and an end of the edge coupler extends to a step groove of the silicon substrate. At least a part of the cover of the fiber array is accommodated in the step groove. Multiple fibers in the fiber array correspondingly pass through multiple lead channels of the cover and are then coupled with the edge couplers in the step groove. The edge couplers butt the fibers in the fiber array. The cover is moved until a part of the cover is accommodated in the step groove, so that the fibers can be aligned with the edge couplers in the step groove.

PACKAGING STRUCTURE AND PACKAGING METHOD OF EDGE COUPLERS AND FIBER ARRAY

A packaging structure and a packaging method of edge couplers and a fiber array are provided. The packaging structure includes a silicon substrate, an edge coupler, and a fiber array. Multiple edge couplers are arranged in a main body portion of the silicon substrate, and an end of the edge coupler extends to a step groove of the silicon substrate. At least a part of the cover of the fiber array is accommodated in the step groove. Multiple fibers in the fiber array correspondingly pass through multiple lead channels of the cover and are then coupled with the edge couplers in the step groove. The edge couplers butt the fibers in the fiber array. The cover is moved until a part of the cover is accommodated in the step groove, so that the fibers can be aligned with the edge couplers in the step groove.

OPTOELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

An optoelectronic device includes a photonic component. The photonic component includes an active side, a second side different from the active side, and an optical channel extending from the active side to the second side of the photonic component. The optical channel includes a non-gaseous material configured to transmit light.