A DMD chip includes a micromirror array mounted on a very thin silicon wafer attached to a cooling system integrated within the DMD chip. The cooling system includes a fluid cooled heat sink with a cooling channel. Fluid coolant may be pumped through the channel and out of the DMD to remove heat from the silicon substrate and the micromirror array. The micromirror array may be hermetically sealed within the housing, with the heat sink located between the micromirror array and a back wall of the housing, with both the heat sink and the array within the interior of the housing.

The present disclosure provides a hair removing device, including: a reflector; a light source; a light-transmitting body; a heat dissipation assembly, being connected to the light-transmitting body and configured to absorb heat from the light-transmitting body; a cold drive assembly, being configured to absorb external air, then blow into at least two cooling channels, and expel the air out of the hair removing device; cooling channels, comprising a first cooling channel and a second cooling channel; wherein at least one of the light source, the reflector is disposed in the first cooling channel, and at least part of the heat dissipation is disposed in the second cooling channel. Such that heat of the light source is dissipated uniformly, the service life of the light source is extended. Further, the improved heat dissipation performance allows the user to use the hair removing device more comfortably.

A reflector and processing chamber having the same are described herein. In one example, a reflector is provided that includes cylindrical body, a cooling channel, and a reflective coating. The cylindrical body has an upper surface and a lower surface. The lower surface has a plurality of concave reflector structures disposed around a centerline of the cylindrical body. The cooling channel disposed in or on the cylindrical body. The reflective coating is disposed on the plurality of concave reflector structures.

A portable heated mirror includes a mount subassembly that includes a mount housing and a mount member that is configured to releasably attach the heated mirror to a support surface. The heated mirror also includes a mirror subassembly that is pivotally attached to the mount subassembly by a ball-in-socket arrangement. The mirror subassembly includes a mirror housing that contains a mirror and a flexible heating element in the form of a flexible heat film that contains heating elements and is secured to a rear surface of the mirror for heating the mirror when the flexible heat film is actuated. A battery power source is operatively connected to a printed circuit board that is contained within the mirror housing.

A reflector (2) comprising a plate (4) supported by a substrate (8), wherein the plate has a reflective surface (5) and is secured to the substrate by adhesive free bonding, and wherein a cooling channel array (10) is provided in the reflector. The channels (16) of the cooling channel array may be formed from open channels in a surface of the substrate, the open channels being closed by the plate to create the channels.

A reflector for EUV radiation, the reflector comprising a reflector substrate and a reflective surface, the reflector substrate having a plurality of coolant channels formed therein, the coolant channels being substantially straight, substantially parallel to each other and substantially parallel to the reflective surface and configured so that coolant flows in parallel through the coolant channels and in contact with the reflector substrate.

A DMD chip includes a micromirror array mounted on a very thin silicon wafer attached to a cooling system integrated within the DMD chip. The cooling system includes a fluid cooled heat sink with a cooling channel. Fluid coolant may be pumped through the channel and out of the DMD to remove heat from the silicon substrate and the micromirror array. The micromirror array may be hermetically sealed within the housing, with the heat sink located between the micromirror array and a back wall of the housing, with both the heat sink and the array within the interior of the housing.

A digital micro-mirror unit is arranged on a circuit board. A digital micro-mirror device mask surroundingly covers the digital micro-mirror unit. A thermo-insulation element is arranged between the digital micro-mirror unit and the digital micro-mirror device mask. The digital micro-mirror unit is thermally insulated against the digital micro-mirror device mask through the thermos-insulation element. A thermoelectric cooler (TEC) is thermally connected to the digital micro-mirror unit. A thermo-conductive body is attached on the hot side of the TEC. Therefore the digital micro-mirror unit can meet temperature requirements of safety standards and avoid reducing its service life.

A liquid cooling apparatus has a chassis, a cover mounted on the chassis, and a dividing structure disposed in an inner chamber defined between the chassis and the cover. The dividing structure divides the inner chamber into a liquid inlet compartment and a liquid outlet compartment. The liquid inlet compartment communicates with the liquid outlet compartment via the recess. The liquid cooling apparatus can be installed on a first panel with the boss of the chassis mounted through a through hole of the first panel and thermally attached to a heat source on a second panel. A working fluid that flows into the liquid inlet compartment is forced to flow into the recess before flowing to the liquid outlet compartment by the dividing structure. Accordingly, heat generated by the heat source can be effectively dissipated.

A thermally actuated adaptive optic includes a base, a reflector, and a plurality of actuators coupled therebetween. The reflector has a light-receiving front surface, and a back surface facing the base. Each actuator includes a bracket rigidly bonded to the reflector at a perimeter of the reflector, and an inner rod and an outer rod. Each rod is rigidly connected between the bracket and the base, with the inner rod being closer to a center of the reflector. The length of each rod is temperature dependent. In another adaptive optic, the rods are instead bonded directly to the reflector. This adaptive optic may be modified to implement an integrally formed, thermally actuated support. The disclosed adaptive optics are suitable for use in laser systems, allow for significant cost savings over piezoelectric devices, provide a reflective area free of surface-figure perturbations caused by the actuator-interfaces, and are relatively simple to manufacture.