An electro-optic assembly comprises a first substrate and a second substrate. The first and second substrates are disposed in a parallel and spaced apart relationship so as to define a cavity therebetween. A primary seal extends between the first and second substrates. An electro-optic medium is located in the cavity and retained in an inboard direction by the primary seal. A plurality of first spacer elements are coupled to the primary seal. A break wall is located in the inboard direction or an outboard direction from the primary seal. The break wall extends between the first and second substrates and generally along the primary seal. A plurality of second spacer elements are coupled to the break wall. A space is defined between the primary seal and the break wall in the inboard-outboard directions.

An asymmetric whispering gallery mode resonator device is described. The resonator device includes an asymmetric whispering gallery mode resonator disk (e.g., transparent material, electrooptic material). The resonator disk includes an axial surface along a perimeter of the resonator disk, a top surface, and a bottom surface. A first midplane passes through the axial surface dividing the axial surface into symmetrical halves. The top surface and the bottom surface are substantially parallel, and a second midplane is substantially equidistant between the top surface and the bottom surface. The first midplane and the second midplane are non-coextensive. The asymmetric whispering gallery mode resonator disk can further include a first chamfered edge between the top surface and the axial surface, and a second chamfered edge between the bottom surface and the axial surface. Moreover, the resonator device includes a first electrode on the top surface and a second electrode on the bottom surface.

A functional element housing package includes a pin terminal disposed in an outer region of a housing for housing a functional element. A wiring substrate is connected with the pin terminal. The wiring substrate includes a through hole for receiving the pin terminal, a first metallic layer disposed around an opening of the through hole on a side of the wiring substrate which side is located close to the housing, a second metallic layer disposed around an opening of the through hole on a side of the wiring substrate which is opposed to the side located close to the housing, the second metallic layer being greater in area than the first metallic layer, a connection wiring line connected to the first metallic layer or the second metallic layer, and a solder which connects the pin terminal to each of the first metallic layer and the second metallic layer.

A composite substrate for an electro-optic element is disclosed. The composite substrate includes: an electro-optic crystal substrate having an electro-optic effect; a low-refractive-index layer being in contact with the electro-optic crystal substrate and having a lower refractive index than the electro-optical crystal substrate; and a support substrate bonded to the low-refractive-index layer at least via a bonding layer. A plurality of interfaces located between the low-refractive-index layer and the support substrate includes at least one rough interface having a roughness that is larger than a roughness of an interface between the electro-optic crystal substrate and the low-refractive-index layer.

A light modulator includes a perovskite-type electro-optic crystal including a first surface to which the input light is input and a second surface which faces the first surface; a first electrode which is disposed on the first surface of the electro-optic crystal and through which the input light is transmitted; a second electrode which is disposed on the second surface of the electro-optic crystal and through which the input light is transmitted; and a drive circuit for applying an electric field between the first electrode and the second electrode. The first electrode is disposed alone on the first surface. The second electrode is disposed alone on the second surface. At least one of the first electrode and the second electrode partially covers the first surface or the second surface. A propagation direction of the input light and an applying direction of the electric field are parallel to each other.

A monolithically integrated optical analog-to-digital conversion system based on a lithium niobate-silicon wafer, and a method for manufacturing the same, wherein a novel wafer (lithium niobate-silicon wafer) is used to implement the monolithically integrated optical analog-to-digital conversion system having multiple photonic devices, including an electro-optical modulator array, a tunable delay line array, an electronic circuit, and the like. As a result, multiple devices are manufactured on one chip, and the performance advantages and the stability of the system are guaranteed. Moreover, the present invention provides a CMOS-compatible method for manufacturing the system, so that the monolithically integrated optical analog-to-digital conversion system based on the lithium niobate-silicon wafer can be implemented on platforms of most chip manufacturers.

An optical waveguide device includes a substrate on which an optical waveguide is formed, and a reinforcing block disposed on the substrate, along an end surface of the substrate on which an input portion or an output portion of the optical waveguide is disposed, in which an optical component that is joined to both the end surface of the substrate and an end surface of the reinforcing block is provided, a material used for a joining surface of the optical component and a material used for the substrate or the reinforcing block have at least different linear expansion coefficients of a direction parallel to the joining surface, and an area of the joining surface is set to be smaller than a maximum value of a total of areas of cross sections of the substrate and the reinforcing block parallel to the joining surface.

A light modulator includes a perovskite-type electro-optic crystal having an input surface to which input light is input and a rear surface opposing the input surface, a first optical element being disposed on the input surface of the electro-optic crystal and having a first electrode through which the input light is transmitted, a second optical element being disposed on the rear surface of the electro-optic crystal and having a second electrode through which the input light is transmitted, and a drive circuit applying an electric field between the first electrode and the second electrode.

Electro-optical devices and methods for constructing electro-optical devices such as a switch or phase shifter. An electrode layer is deposited on a substrate layer, a waveguide structure is deposited on the electrode layer, a first cladding layer is deposited on the waveguide structure, and the first cladding layer is planarized and bonded to a wafer. The substrate layer is removed and the electrode layer is etched to split the electrode layer into a first electrode separated from a second electrode. A second cladding layer is deposited on the etched electrode layer. The first and second electrodes may be composed of a material with a large dielectric constant, or they may be composed of a material with a large electron mobility. The device may exhibit a sandwich waveguide architecture where an electro-optic layer is disposed between two strip waveguides.

Electro-optical devices and methods for constructing electro-optical devices such as a switch or phase shifter. An electrode layer is deposited on a substrate layer, a waveguide structure is deposited on the electrode layer, a first cladding layer is deposited on the waveguide structure, and the first cladding layer is planarized and bonded to a wafer. The substrate layer is removed and the electrode layer is etched to split the electrode layer into a first electrode separated from a second electrode. A second cladding layer is deposited on the etched electrode layer. The first and second electrodes may be composed of a material with a large dielectric constant, or they may be composed of a material with a large electron mobility. The device may exhibit a sandwich waveguide architecture where an electro-optic layer is disposed between two strip waveguides.