Patent classifications
G03B19/07
Camera module with stacked lens structure and electronic apparatus
The present technique relates to a camera module and an electronic apparatus that allow a camera module to be used for various purposes. The camera module includes a first pixel array in which pixels that receive light having an R, G, or B wavelength are two-dimensionally arranged in a matrix form and a second pixel array in which pixels that receive light having a wavelength region of visible light are two-dimensionally arranged in a matrix form and a first optical unit that converges incident light onto the first pixel array and a second optical unit that converges the incident light onto the second pixel array. The present technique can be for example applied to a camera module and the like.
Camera module with stacked lens structure and electronic apparatus
The present technique relates to a camera module and an electronic apparatus that allow a camera module to be used for various purposes. The camera module includes a first pixel array in which pixels that receive light having an R, G, or B wavelength are two-dimensionally arranged in a matrix form and a second pixel array in which pixels that receive light having a wavelength region of visible light are two-dimensionally arranged in a matrix form and a first optical unit that converges incident light onto the first pixel array and a second optical unit that converges the incident light onto the second pixel array. The present technique can be for example applied to a camera module and the like.
IMAGE CAPTURING APPARATUS AND IMAGE CAPTURING METHOD
An image capturing apparatus includes a first camera that captures a first image, a second camera that captures a second image, a lens cover that includes transparent parts and ridgelines and that covers the first camera and the second camera, and a processing circuit that identifies a pixel located in an area, in which it is necessary to interpolate a pixel value, in the first image, and generates an output image using the first image and interpolation pixel information for interpolating a pixel value of the identified pixel. Each ridgeline between adjacent parts of the lens cover is twisted with respect to a base line extending between a center of a first lens of the first camera and a center of a second lens of the second camera. An upper part of the lens cover opposes a base on which the first camera and the second camera are disposed.
IMAGING APPARATUS, IMAGING MODULE, AND CONTROL METHOD OF IMAGING APPARATUS
The focus detection accuracy is improved in an imaging apparatus that detects focus of each of a plurality of lenses.
A main side focus control section detects, as a main side in-focus position, a main side lens position where focus is achieved in a main side detection region inside a main side image. A parallax acquisition section acquires parallax proportional to a distance by finding the distance on the basis of the main side in-focus position. A subordinate side detection region setup section sets a subordinate side detection region position in a subordinate side image on the basis of the parallax and the main side detection region position. A subordinate side focus control section detects, as a subordinate side in-focus position, a subordinate side lens position where focus is achieved in the subordinate side detection region.
IMAGING DEVICE
The present invention provides an imaging device wherein an imaging unit can be stably supported by a bracket and adverse effects on the imaging unit caused by differences in the amount of thermal expansion between the bracket and the imaging unit can be reduced. This imaging device 1 is provided with an imaging unit 10 attachable to the bracket. The imaging unit 10 is provided with a plurality of supported parts 15 to be supported by the bracket. The supported parts 15 are provided on both ends of the imaging unit 10 in the width direction DW crossing the light axis OA direction at one end of the imaging unit 10 in the light axis OA direction, and in the center part in the width direction DW at the other end of the imaging unit 10 in the light axis OA direction. The supported parts 15 have supported points 15a, which are supported by the bracket, and load points 15b, which receive the biasing force operating toward the supported points 15a from the bracket.
Image pickup system and signal processing apparatus
An image pickup system includes: a camera including a first image pickup unit and a second image pickup unit; and a processor configured to: define a first common area in a first image and a second common area in a second image, respectively; detect brightness of an image in the first common area; detect brightness of an image in the second common area; adjust brightness of the first image based on the brightness of the image in the first common area; and adjust brightness of the second image based on the brightness of the image in the second common area.
Image pickup system and signal processing apparatus
An image pickup system includes: a camera including a first image pickup unit and a second image pickup unit; and a processor configured to: define a first common area in a first image and a second common area in a second image, respectively; detect brightness of an image in the first common area; detect brightness of an image in the second common area; adjust brightness of the first image based on the brightness of the image in the first common area; and adjust brightness of the second image based on the brightness of the image in the second common area.
VEHICLE-MOUNTED CAMERA, VEHICLE-MOUNTED CAMERA APPARATUS, AND METHOD OF SUPPORTING VEHICLE-MOUNTED CAMERA
Provided are an excellent vehicle-mounted camera to be used by being attached to a windshield or the like of a vehicle, a vehicle-mounted camera apparatus, and a method of supporting a vehicle-mounted camera. The vehicle-mounted camera includes a substrate, an image pickup element mounted on the substrate, an image processing circuit that is mounted on the substrate and processes a captured image by the image pickup element, a light collection optical unit that collects incident light, and a reflection unit that reflects output light from the light collection optical unit to the image pickup element. The vehicle-mounted camera further includes a casing that accommodates the substrate on which at least the image pickup element and the image processing circuit are mounted, the light collection optical unit, and the reflection unit.
COMPOUND-EYE CAMERA MODULE AND ELECTRONIC DEVICE
The present technology relates to a compound-eye camera module and an electronic device in which a plurality of monocular camera modules can be fixed together by a connecting member more effectively. In the compound-eye camera module, a camera-side positioning portion for positioning formed on a camera-side reference surface of each of the monocular camera modules and a member-side positioning portion for positioning formed on a member-side reference surface of the connecting member are fitted together, to connect the plurality of monocular camera modules together, whereby the plurality of monocular camera modules can be fixed together by the connecting member more effectively. The present technology can be applied to, for example, a compound-eye camera module in which a plurality of CMOS image sensors is connected together.
COMPOUND-EYE CAMERA MODULE AND ELECTRONIC DEVICE
The present technology relates to a compound-eye camera module and an electronic device in which a plurality of monocular camera modules can be fixed together by a connecting member more effectively. In the compound-eye camera module, a camera-side positioning portion for positioning formed on a camera-side reference surface of each of the monocular camera modules and a member-side positioning portion for positioning formed on a member-side reference surface of the connecting member are fitted together, to connect the plurality of monocular camera modules together, whereby the plurality of monocular camera modules can be fixed together by the connecting member more effectively. The present technology can be applied to, for example, a compound-eye camera module in which a plurality of CMOS image sensors is connected together.